Cypress Semiconductor Corp CY7C1515JV18-300BZC
- Part No.:
- CY7C1515JV18-300BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1515JV18-300BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1515JV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz clock operation, double data rate (DDR) read/write interfaces delivering 600 MT/s effective throughput, 1.5-cycle read latency with DLL enabled, and 165-ball FBGA (15 × 17 × 1.4 mm) package. It serves as a high-bandwidth buffer in network packet processors requiring concurrent read/write access without bus turnaround.
For engineers reviewing the CY7C1515JV18 datasheet, CY7C1515JV18 pinout, CY7C1515JV18 application, or CY7C1515JV18 equivalent, key selection criteria include DDR timing compliance, echo clock (CQ/CQ) support for high-speed data capture, HSTL-18 I/O compatibility, DLL-enabled latency mode, and depth expansion via RPS/WPS port selects.
Technical Context
The CY7C1515JV18 implements a synchronous pipelined QDR II architecture with physically separate read and write ports, enabling true concurrency: reads use C/C clocks while writes use K/K clocks, both operating at 300 MHz. Address inputs are multiplexed and latched on alternating rising edges of K/K to support 19-bit addressing for 2M depth.
It features a Delay Lock Loop (DLL) that aligns output data to C/C edges with ±0.15 ns jitter, supports variable-drive HSTL-18 outputs, and includes JTAG 1149.1 test access. The DOFF pin disables the DLL to revert to QDR I timing (1-cycle latency, ≤167 MHz), and ZQ enables impedance tuning via external resistor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 300 MHz - sets maximum sustained bandwidth of 4.32 GB/s (36-bit × 600 MT/s) |
| Read Latency | 1.5 cycles with DLL enabled - ensures deterministic timing alignment for synchronous controllers |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - compatible with HSTL-18 Class I/II signaling standards |
| Core Voltage | VDD = 1.8 V ± 0.1 V - defines stable internal logic operation and power integrity margin |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 75% versus single-word access |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - provides thermal and signal integrity for high-speed routing |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | Latched on rising edges of K/K; supports full 36-bit parallel writes per burst |
| Q[35:0] | Synchronous read data output | Driven on rising edges of C/C; tristated automatically when RPS deasserted |
| RPS / WPS | Read/Write Port Select (active LOW) | Enables independent port activation for depth expansion without shared control logic |
| BWS[3:0] | Byte Write Select (active LOW) | Controls 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]) for partial writes |
| C / C, K / K | Differential clock inputs | K/K capture inputs; C/C clock outputs - eliminates skew between controller and memory |
| CQ / CQ | Echo clocks referenced to C/C | Enable source-synchronous capture at controller; free-running, DLL-aligned |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[35:0]/CQ/CQ drive strength to 50 Ω |
| DOFF | DLL disable control (active LOW) | Switches device to QDR I mode (1-cycle latency, max 167 MHz) for backward compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay and contention - enables continuous full-duplex traffic |
| DDR interfaces on both ports | Delivers 600 MT/s effective throughput per port using 300 MHz clocks - doubles bandwidth vs. SDR |
| Delay Lock Loop (DLL) | Aligns Q[35:0] and CQ/CQ edges to C/C with sub-0.2 ns jitter - enables reliable >400 MHz system timing |
| HSTL-18 compatible I/O | Supports 1.4–1.8 V VDDQ with programmable drive strength - matches FPGA/ASIC memory controllers |
| JTAG 1149.1 test access | Enables boundary scan testing and in-system debug without additional test fixtures |
Applications
| Network Packet Processors | Telecom Line Cards |
|---|---|
|
Use Scenario: Storing and forwarding variable-length IP packets in multi-gigabit line-rate switches. IC Role / Device Role / Timing Role: High-throughput dual-port buffer managing simultaneous ingress packet writes and egress reads under strict latency budgets. Use Value: 4-word burst + DDR interface delivers 4.32 GB/s bandwidth, eliminating bottlenecks in 10G/40G Ethernet processing pipelines. |
Use Scenario: Buffering real-time voice/video streams across TDM-to-packet gateways in carrier-grade base stations. IC Role / Device Role / Timing Role: Synchronous pipeline memory synchronizing asynchronous transport layers with deterministic 1.5-cycle read latency. Use Value: Echo clocks (CQ/CQ) simplify source-synchronous capture at FPGA receivers, reducing timing closure effort by >30%. |
| High-Speed Test Equipment | Avionics Data Recorders |
|
Use Scenario: Capturing high-fidelity analog waveform samples at >1 GS/s for semiconductor ATE systems. IC Role / Device Role / Timing Role: Burst-mode acquisition buffer accepting interleaved sample streams via write port while feeding analysis engines via read port. Use Value: Independent RPS/WPS allows seamless depth expansion across multiple devices without arbitration logic. |
Use Scenario: Recording flight telemetry (sensor, navigation, control signals) with guaranteed non-volatile write persistence during power loss. IC Role / Device Role / Timing Role: Deterministic low-latency SRAM stage buffering critical data before flash storage - requires no refresh or wear leveling. Use Value: DLL-off mode (QDR I) provides fallback operation at 167 MHz with 1-cycle latency for fail-safe recording paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 36-bit, 2M × 36, 250 MHz max, LVDS I/O, no DLL, 1-cycle latency only | Lacks echo clocks and DLL; requires tighter board-level skew control | Select when system clock <250 MHz and controller lacks DLL-aware timing recovery |
| ISSI IS61WV204836BLL-150BLI | 36-bit, 2M × 36, 150 MHz max, SSTL-2 I/O, asynchronous reset, no DDR | Single data rate, lower bandwidth (1.08 GB/s), no burst or echo clock support | Select for cost-sensitive, non-real-time buffering where 300 MHz timing is unnecessary |
Compared with IDT72T3615L10PA and IS61WV204836BLL-150BLI, CY7C1515JV18 uniquely delivers 300 MHz DDR performance with DLL-aligned echo clocks-enabling robust >400 Mbps link margins in telecom and test equipment where timing margin is constrained.
Availability
CY7C1515JV18 is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, high-speed test equipment, and avionics data recorders requiring stable component supply, long-lifecycle support, and consistent FBGA packaging.
Supply support for CY7C1515JV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, industrial, and automotive systems, with emphasis on signal integrity and timing precision.
CY7C1515JV18 belongs to the QDR® II SRAM product line, engineered specifically for applications demanding concurrent, low-latency, high-bandwidth memory access in packet-switched infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1515JV18?
The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device operates in QDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. For normal QDR II operation at 300 MHz with 1.5-cycle latency, DOFF must be tied HIGH via a ≤10 kΩ pull-up resistor to VDDQ.
How does the ZQ pin affect output drive strength?
ZQ calibrates the output impedance of Q[35:0], CQ, and CQ pins. When connected to a resistor (RQ) to ground, outputs are tuned to 0.2 × RQ; typical RQ = 240 Ω yields ~48 Ω drive strength matching standard PCB traces. Connecting ZQ directly to VDDQ enables minimum impedance (~25 Ω), while leaving it unconnected or grounded violates specification.
Can CY7C1515JV18 operate with only a single clock domain?
Yes - the device supports single-clock mode where K/K serve as both input and output clocks. In this configuration, Q[35:0] data is driven on rising edges of K/K instead of C/C, and CQ/CQ are generated relative to K/K. This simplifies clock distribution but sacrifices deskew capability provided by dedicated C/C pairs.
What is the purpose of BWS[3:0] in 36-bit mode?
BWS[3:0] are active-LOW byte write select signals controlling four independent 9-bit lanes: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Asserting only selected BWS lines enables partial 36-bit writes without disturbing unselected bytes - essential for protocol header updates or metadata patching.
CY7C1515JV18-300BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1515JV18-300BZC FAQ
1.How can I place an order for CY7C1515JV18-300BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1515JV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1515JV18-300BZC reliable?
The price and inventory of CY7C1515JV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515JV18-300BZC is usually 5 days.
3.What payment methods are accepted for CY7C1515JV18-300BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515JV18-300BZC transactions.
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CY7C1515JV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1515JV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1515JV18-300BZC?
For technical support, including CY7C1515JV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515JV18-300BZC requirements.
6.How does Aetrix verify that CY7C1515JV18-300BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1515JV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515JV18-300BZC meets industry standards.
7.What is the process for return or replacement of CY7C1515JV18-300BZC?
All CY7C1515JV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515JV18-300BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1515JV18-300BZC part is unused and in its original packaging.
Return procedure for CY7C1515JV18-300BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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