Cypress Semiconductor Corp CY7C1515KV18-250BZC

Overview

CY7C1515KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 333 MHz clock capability, 666 MHz DDR data transfer rate on both read and write ports, and 1.8 V core / 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for network line cards.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection criteria include four-word burst timing, echo clock (CQ/CQ) support for source-synchronous capture, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density routing.

Technical Context

The CY7C1515KV18 implements a true dual-port synchronous SRAM architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses independent K/K clocks for address/data capture and C/C clocks for output timing, enabling concurrent read/write operations at full bandwidth.

Its QDR II architecture relies on a phase-locked loop (PLL) to align echo clocks (CQ/CQ) with output data edges, supporting precise source-synchronous capture in systems operating up to 333 MHz. The device supports depth expansion via RPS/WPS controls and byte-level write masking through BWS[3:0].

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1513KV18, CY7C1515KV18 offers native 36-bit data width and BWS[3:0] granularity without re-routing; versus AS7C362000B-25JIN, it delivers higher bandwidth and built-in echo clocking for robust 333 MHz operation in telecom infrastructure.

Availability

CY7C1515KV18 is available at Aetrix Electronics and suitable for network line cards, high-speed test instrumentation, telecom baseband modules, and AI accelerator subsystems requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1515KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR® II SRAM product line targets high-bandwidth, low-latency buffering in packet-switched infrastructure - optimized for deterministic timing, concurrent access, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C1515KV18?

The DOFF (Data Output OFF) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency mode for improved setup/hold timing margins; when LOW, it selects 1-cycle latency for minimum delay. This setting is sampled at power-up and remains static during operation - no runtime reconfiguration is supported.

Can CY7C1515KV18 operate with only a single clock domain (K only)?

Yes - the device supports single-clock mode where K serves as both input and output clock. In this configuration, C and C inputs are tied to K and K respectively, and Q[35:0] data is clocked by K/K edges. However, echo clock (CQ/CQ) functionality and optimal deskew capability require the dual-clock mode with separate C/C inputs.

How does byte write select (BWS) work in CY7C1515KV18?

BWS[3:0] are active-low signals controlling eight-bit write enable per byte across the 36-bit D[35:0] bus: BWS0 enables D[7:0], BWS1 enables D[15:8], BWS2 enables D[23:16], and BWS3 enables D[35:24]. Unselected bytes retain their prior values - no read-modify-write cycle is required for partial writes.

Is the 165-ball FBGA package of CY7C1515KV18 compatible with standard reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤260°C). Ball composition is SnAgCu (SAC305), and thermal pad design accommodates standard stencil apertures for reliable solder joint formation under typical SMT process controls.