Cypress Semiconductor Corp CY7C1515KV18-250BZXI

Overview

CY7C1515KV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II SRAM with four-word burst architecture, 1.8-V core supply, and DDR interfaces on independent read/write ports. It operates at 250 MHz (40 ns clock period), delivers 600 MB/s sustained bandwidth, and uses echo clocks (CQ/CQ) for timing-critical data capture in high-speed networking buffers and packet processors.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection criteria include its 2M × 36 organization, 165-ball FBGA package, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, HSTL-compatible I/O with VDDQ = 1.4–1.8 V, and JTAG 1149.1 test access support.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined read/write operations using separate K/K input clocks for address/data capture and C/C output clocks for data launch. Its dual-port architecture eliminates bus turnaround delays by dedicating D[35:0] inputs to writes and Q[35:0] outputs to reads.

The device integrates a PLL for precise internal timing alignment, supports depth expansion via RPS/WPS controls, and enables byte-level write masking through BWS[3:0]. All operations are edge-triggered on rising edges of K or C clocks, with self-timed write cycles ensuring deterministic timing.

Key Specifications

Pinout & Package

165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1515KV18-250BZXI, the Pb-free CY7C1515KV18-250BZI offers identical performance and pinout but excludes leaded packaging, while AS7C3256A-25JC lacks QDR II architecture entirely-making it unsuitable for high-throughput, low-latency data path applications.

Availability

CY7C1515KV18-250BZXI is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and FPGA-based protocol accelerators requiring stable component supply across extended production lifecycles.

Supply support for CY7C1515KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with headquarters in San Jose, CA.

The QDR® II SRAM product line targets bandwidth-constrained, low-latency applications such as packet switching, baseband processing, and real-time signal buffering-optimized for deterministic timing and concurrent read/write throughput.

FAQ

What is the function of the DOFF pin on CY7C1515KV18-250BZXI?

The DOFF pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in systems with longer clock-to-data flight times; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting is sampled at power-up and remains static during operation-it is not dynamically reconfigurable.

Can CY7C1515KV18-250BZXI operate with VDDQ = 1.5 V while VDD = 1.8 V?

Yes-VDDQ is independently configurable from 1.4 V to 1.8 V, allowing direct interface with 1.5 V logic families without level shifters. The device maintains full AC/DC specifications across this range when VDD remains at 1.8 V ±0.1 V, and HSTL output drivers automatically adapt drive strength to the selected VDDQ.

How does the BWS[3:0] signal control write operations?

BWS[3:0] are active-low byte write enable signals: BWS0 controls D[7:0], BWS1 controls D[15:8], BWS2 controls D[23:16], and BWS3 controls D[35:24]. When a BWS bit is deasserted (HIGH), the corresponding 8-bit byte is masked and retains its prior value; only asserted (LOW) bytes are updated during the write cycle.

Is the 165-ball FBGA package of CY7C1515KV18-250BZXI compatible with standard reflow profiles?

Yes-the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard Pb-free reflow profiles (peak temperature ≤260°C). Its 0.8 mm ball pitch requires Type II or III stencil apertures and controlled-collapse flip-chip (CCFC) solder paste volume to ensure void-free interconnects under thermal cycling.