Cypress Semiconductor Corp CY7C1515KV18-300BZC

Overview

CY7C1515KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz maximum clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering systems.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection considerations include its 300 MHz operation under 1.8 V core, 36-bit wide synchronous interface, FBGA-165 package, DOFF-controlled read latency mode, and support for depth expansion via RPS/WPS and BWS[3:0].

Technical Context

This device uses a pipelined QDR II architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K/K, enabling concurrent transactions without bus turnaround. The internal memory array is organized as four 512K × 36 banks.

It employs dual output clocks (C/C) and echo clocks (CQ/CQ) to compensate for PCB flight-time skew, and includes a PLL for precise data placement. Write operations are internally self-timed, and read latency is configurable between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH) modes.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1515KV18-250BZC, the -300BZC variant delivers 20% higher bandwidth at identical voltage and package; versus AS7C36256P-300BIN, it offers latency flexibility and enhanced signal integrity features critical for high-margin telecom designs.

Availability

CY7C1515KV18-300BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom baseband processing, and test equipment pattern memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C1515KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1515KV18 belongs to Cypress's QDR II SRAM product line, designed specifically for high-throughput, low-latency memory subsystems in networking infrastructure and real-time signal processing applications.

FAQ

What is the function of the DOFF pin on CY7C1515KV18-300BZC?

The DOFF (Data Output OFF) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency mode; when LOW, it selects 1-cycle latency. This setting directly affects the number of clock cycles between address assertion and first valid Q[35:0] data, impacting controller pipeline depth and timing margin allocation.

Can CY7C1515KV18-300BZC operate with only a single clock source?

Yes - the device supports single-clock-domain operation using only the K input clock for both input sampling and output timing (with C tied to K). However, this disables echo clock functionality and reduces timing margin compared to dual-clock (C/C + CQ/CQ) mode, limiting maximum reliable data rate in high-speed layouts.

How does byte write select (BWS[3:0]) work in practice?

BWS[3:0] are active-LOW signals that independently gate 8-bit segments of the 36-bit D[35:0] bus: BWS0 controls D[7:0], BWS1 controls D[15:8], BWS2 controls D[23:16], and BWS3 controls D[31:24]. D[35:32] and D[39:36] are unused; the remaining bits map to defined byte lanes. Unselected bytes retain prior values.

Is the 165-ball FBGA package of CY7C1515KV18-300BZC compatible with standard reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤ 260 °C). Its 0.8 mm ball pitch and 13 × 15 mm footprint align with industry-standard layout rules for high-density routing and thermal vias under the die.