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Cypress Semiconductor Corp CY7C1515KV18-300BZXC

Part No.:
CY7C1515KV18-300BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1515KV18-300BZXC.pdf
Description:
SRAM - SYNCHRONOUS, QDR II MEMOR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,036

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Product details

Overview

CY7C1515KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz maximum clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports with DDR interfaces, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers and baseband memory subsystems.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection criteria include concurrent read/write bandwidth, DOFF-controlled read latency (1.5-cycle vs. 1-cycle), BWS[3:0] byte-write granularity, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density routing constraints.

Technical Context

This device uses synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K/K clocks, enabling concurrent transactions without bus turnaround.

It integrates a PLL for precise data placement, supports both single-clock (K/K only) and dual-clock (C/C + K/K) modes, and delivers 666 MT/s effective data rate via DDR on both ports - achieving 4.8 GB/s aggregate bandwidth at 300 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 configuration)
Max Clock Frequency 300 MHz - sets maximum sustained transaction rate and system timing margin
Data Rate 666 MT/s - double-data-rate transfer on both read and write ports
Core Supply Voltage 1.8 V ±0.1 V - defines power rail tolerance and noise immunity requirements
I/O Supply Range 1.4 V to 1.8 V - enables interoperability with 1.5 V or 1.8 V logic families
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing trade-off for pipeline depth
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in telecom modules

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit parallel data sampled on rising edge of K/K; supports full-word or nibble/byte writes via BWS[3:0]
Q[35:0] Synchronous read data output 36-bit parallel data driven on rising edges of C/C; tristated when RPS deasserted
A[18:0] Multiplexed address input 19-bit address shared by read/write ports; latched on rising edge of K for 512K × 36 array access
RPS / WPS Read/write port select Active-low synchronous controls; enables independent port activation for concurrent operations
BWS[3:0] Byte write select Four active-low signals controlling write enable per 8-bit segment - preserves unselected bytes during partial writes
C / C / CQ / CQ Output clock & echo clock pairs C/C drive Q outputs; CQ/CQ replicate clock timing at receiver for deskewed capture in high-speed systems
K / K Input clock pair Rising edges sample D[35:0], A[18:0], RPS, WPS, BWS[3:0]; define all synchronous timing boundaries
DOFF Read latency control High = 1.5-cycle latency (pipelined); Low = 1-cycle latency (QDR I mode) - impacts controller pipeline design

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent access - no bus turnaround required, eliminating arbitration delay in burst-heavy traffic
Four-word burst architecture Reduces address bus toggling frequency by 4× versus single-word access - lowers EMI and routing complexity
Echo clocks (CQ/CQ) Deliver source-synchronous timing reference to receiver - simplifies PCB layout and eliminates need for complex trace length matching
Programmable impedance (ZQ) On-die termination calibration using external 240 Ω resistor - ensures consistent signal integrity across voltage/temperature
JTAG 1149.1 compliance Supports boundary scan testing and in-system programming - critical for high-reliability telecom board validation

Applications

Packet Buffer Memory Baseband Signal Processing

Use Scenario: High-throughput line cards in 10G/25G Ethernet switches buffering ingress/egress packet streams.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency FIFO between MAC and switch fabric, synchronized to 300 MHz system clock.

Use Value: Concurrent read/write allows simultaneous packet enqueue/dequeue at 666 MT/s - sustaining full line-rate throughput without head-of-line blocking.

Use Scenario: LTE/5G remote radio units (RRUs) performing real-time FFT/IFFT and channel estimation.

IC Role / Device Role / Timing Role: Shared memory buffer between DSP cores and FPGA accelerators, accessed via AXI-HP or similar high-bandwidth interface.

Use Value: Four-word burst reduces address bus activity by 75%, lowering power and routing congestion in dense RF front-end PCBs.

Network Processor Offload Test Equipment Pattern Memory

Use Scenario: Deep packet inspection engines requiring rapid pattern matching against dynamic rule sets.

IC Role / Device Role / Timing Role: High-speed lookup table storage for TCAM-assisted classification, updated dynamically via write port.

Use Value: Byte-write select (BWS[3:0]) enables atomic updates to individual rule fields without disturbing adjacent entries - preserving state consistency.

Use Scenario: Automated test equipment (ATE) generating and validating multi-gigabit serial waveforms.

IC Role / Device Role / Timing Role: Pattern generator memory storing stimulus vectors, clocked synchronously to 300 MHz sampling engine.

Use Value: Echo clocks (CQ/CQ) provide deterministic setup/hold timing at the DAC interface - eliminating jitter-induced bit errors in waveform fidelity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 36-bit, 10 ns access time, 1.8 V core, but asynchronous interface - no DDR or burst capability Limited to lower-bandwidth control-plane memory; lacks concurrent read/write and echo clock support Choose only if system clocking infrastructure cannot support QDR timing or requires simpler timing closure
ISSI IS61WV102436BLL-15BLI 2M × 36, 15 ns async SRAM, 3.3 V I/O - no DDR, no burst, no echo clocks, no JTAG Suitable for legacy designs with wide parallel buses and relaxed timing; incompatible with QDR-II controller IP Select only for cost-sensitive industrial controllers where bandwidth < 1 GB/s and testability is non-critical

Compared with IDT72T36120L10BG and IS61WV102436BLL-15BLI, CY7C1515KV18 delivers 4.8 GB/s aggregate bandwidth via DDR+burst, supports concurrent transactions essential for packet processing, and includes echo clocks and JTAG for production testability - making it uniquely suited for next-generation telecom and test equipment.

Availability

CY7C1515KV18 is available at Aetrix Electronics and suitable for packet buffer memory, baseband signal processing, and network processor offload applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1515KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1515KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth memory subsystems in networking infrastructure and test instrumentation where deterministic timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1515KV18?

The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, the device operates with 1.5-cycle read latency (standard QDR II mode); when LOW, it reverts to 1-cycle latency like QDR I. This setting directly affects controller pipeline depth and must be configured before initialization and held stable during operation.

Can CY7C1515KV18 operate with only the K clock, without C/C inputs?

Yes - CY7C1515KV18 supports single-clock mode where K/K clocks drive both input sampling and output data timing. In this mode, Q[35:0] outputs are synchronized to K/K edges instead of C/C, eliminating the need for separate output clocks but reducing flexibility in deskewing multiple devices.

How does the ZQ pin enable impedance calibration?

ZQ connects to an external 240 Ω resistor to ground, allowing the device to calibrate its output driver impedance and ODT (on-die termination) values. This calibration compensates for process, voltage, and temperature variations, ensuring consistent signal integrity across operating conditions without manual PCB tuning.

Is CY7C1515KV18 pin-compatible with other devices in the CY7C15xxKV18 family?

No - while all share the same 165-ball FBGA package, pin assignments differ significantly across CY7C1526KV18 (×9), CY7C1513KV18 (×18), and CY7C1515KV18 (×36) due to differing data bus widths, BWS signal counts, and internal array mapping; direct substitution requires PCB redesign.

CY7C1515KV18-300BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1515KV18-300BZXC FAQ

1.How can I place an order for CY7C1515KV18-300BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1515KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1515KV18-300BZXC reliable?

The price and inventory of CY7C1515KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515KV18-300BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1515KV18-300BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515KV18-300BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1515KV18-300BZXC?

CY7C1515KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1515KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1515KV18-300BZXC?

For technical support, including CY7C1515KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515KV18-300BZXC requirements.

6.How does Aetrix verify that CY7C1515KV18-300BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1515KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515KV18-300BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1515KV18-300BZXC?

All CY7C1515KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515KV18-300BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1515KV18-300BZXC part is unused and in its original packaging.

Return procedure for CY7C1515KV18-300BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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