Cypress Semiconductor Corp CY7C1515KV18-333BZI

Overview

CY7C1515KV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock frequency, DDR interfaces on both read and write ports (666 MHz data rate), and separate independent read/write ports enabling concurrent transactions. It operates at 1.8 V core supply and supports 1.4–1.8 V I/O (VDDQ), and is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection considerations include its 19-bit address bus, 36-bit bidirectional data width, echo clock (CQ/CQ) support for timing margin improvement, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

The CY7C1515KV18 implements a synchronous pipelined QDR II architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternate rising edges of the K clock, and each access delivers a fixed four-word burst of 36-bit data.

It uses dual input clocks (K/K) for write control and dual output clocks (C/C) plus echo clocks (CQ/CQ) to minimize skew between controller and memory. The device integrates a PLL for precise data placement and supports programmable impedance via ZQ pin for HSTL-18 I/O compliance.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, with 0.8 mm ball pitch and standard HSTL-18 compatible I/O structure.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36150 and IS61WV102436B, the CY7C1515KV18 provides higher bandwidth (24 Gbps vs. 22 Gbps and 18 Gbps), integrated echo clocks for robust high-speed capture, and ZQ calibration for consistent signal integrity-making it optimal for new 10G+ networking and telecom designs.

Availability

CY7C1515KV18 is available at Aetrix Electronics and suitable for high-speed network switch buffering, telecom line card packet memory, and baseband processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1515KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II SRAM product line was designed specifically for ultra-low-latency, high-throughput memory subsystems in networking infrastructure, where deterministic concurrent read/write performance and signal integrity at >600 MT/s are critical.

FAQ

What is the function of the DOFF pin on CY7C1515KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin in high-speed systems; when LOW, it reverts to 1-cycle latency for minimal access delay. This setting is sampled synchronously on the rising edge of the K clock during initialization and remains static during operation.

Can CY7C1515KV18 operate with only a single clock domain?

Yes. The device supports single-clock-mode operation where the same K clock drives both input and output registers-eliminating need for separate C/C clocks. In this mode, Q[35:0] outputs are clocked by K/K instead of C/C, simplifying clock tree design at the cost of reduced timing flexibility and no echo clock support.

How does the ZQ pin affect system-level signal integrity?

The ZQ pin connects to an external 240 Ω resistor to ground and initiates on-die impedance calibration. This adjusts output driver strength and ODT (on-die termination) to match HSTL-18 specifications across process/voltage/temperature, ensuring consistent rise/fall times and reducing reflections on high-speed traces without requiring external termination resistors.

Is CY7C1515KV18 pin-compatible with other devices in the CY7C15xxKV18 family?

No. Although all share the same 165-ball FBGA package footprint, pin assignments differ significantly across CY7C1526KV18 (×9), CY7C1513KV18 (×18), and CY7C1515KV18 (×36) due to differing data bus widths, byte-select configurations, and address bit counts-requiring unique PCB layouts for each variant.