Cypress Semiconductor Corp CY7C1515V18-200BZC
- Part No.:
- CY7C1515V18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1515V18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,846
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1515V18 from Cypress Semiconductor is a 2M × 36-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 200 MHz clock operation (400 MT/s effective data rate), DDR interfaces on both ports, and echo clocks (CQ/CQ) for timing margin recovery in high-speed systems. It delivers full data coherency and synchronous self-timed writes in networking packet buffers and FPGA co-processor memory subsystems.
For engineers reviewing the CY7C1515V18 datasheet, CY7C1515V18 pinout, CY7C1515V18 application, or CY7C1515V18 equivalent, key selection criteria include burst depth (4-word), x36 bus width, 165-ball FBGA package, HSTL I/O compatibility, and DLL-controlled output alignment - all critical for deterministic latency in telecom line cards and switch fabric designs.
Technical Context
The CY7C1515V18 implements QDR-II architecture with fully independent read and write pipelines, each clocked by dedicated K/K input pairs and driven by C/C output clocks. Its 512K × 36 internal organization uses 19 address bits (A[18:0]) and supports depth expansion via four byte write selects (BWS[3:0]).
All synchronous inputs latch on rising edges of K/K; outputs are registered to C/C with echo clocks CQ/CQ aligned to output data edges. The integrated Delay Lock Loop (DLL) ensures precise data-to-clock alignment at 200 MHz, while VREF and ZQ pins enable HSTL-15-compatible impedance control and signal integrity tuning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36-bit organization) |
| Maximum Clock Frequency | 200 MHz - defines maximum sustained transaction rate of 200 million cycles/sec |
| Data Rate | 400 MT/s - double-data-rate transfers on both read and write ports |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - enables low-power, high-speed HSTL signaling |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 4× versus single-word access |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-density PCB routing in telecom modules |
| Interface Standard | HSTL Class I - specifies drive strength, termination, and voltage thresholds for reliable 400 MT/s signaling |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel data latched on rising edge of K/K; supports partial writes via BWS[3:0] |
| Q[35:0] | Synchronous read data output | 36-bit parallel data driven on rising edges of C/C; tri-stated when RPS is deasserted |
| A[18:0] | Multiplexed address input | 19-bit address shared by read/write ports; latched on rising edge of K for both operations |
| RPS / WPS | Read/Write Port Select | Active-low enables port-specific access; allows concurrent read+write without bus contention |
| BWS[3:0] | Byte Write Select | Four independent active-low controls for selective 8-bit write masking within 36-bit word |
| C / C, CQ / CQ | Output clock & echo clock pair | C/C clocks data out; CQ/CQ track output timing for receiver capture margin optimization |
| K / K | Input clock pair | Rising edges sample all synchronous inputs (address, data, control); define pipeline timing |
| ZQ | Impedance calibration reference | Connects to external resistor to ground to tune output driver impedance to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay and contention - enables true concurrent access in packet buffering |
| 4-word burst architecture | Reduces address bus switching frequency by 75% versus single-word mode - lowers EMI and routing complexity |
| Integrated DLL | Aligns Q[35:0] output edges to C/C clock edges within ±50 ps - ensures setup/hold compliance at 400 MT/s |
| HSTL-15 compatible I/O | Supports 1.5 V swing with controlled slew and on-die termination - matches FPGA transceivers without external resistors |
| JTAG 1149.1 test port | Enables boundary-scan testing of interconnects in dense multi-SRAM systems - reduces test development time |
Applications
| Telecom Line Card Buffer | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in 10G/40G line interface modules. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level packet buffer between SERDES and traffic manager ASIC, using RPS/WPS for pipelined ingress/egress. Use Value: 400 MT/s throughput and zero-turnaround architecture reduce packet latency by up to 3.2 ns per access versus SDR SRAM. |
Use Scenario: High-bandwidth scratchpad memory for Xilinx Virtex-7 or Intel Stratix 10 FPGA-based digital signal processing pipelines. IC Role / Device Role / Timing Role: Off-chip memory extension synchronized to FPGA's HSTL I/O banks, with CQ/CQ enabling source-synchronous capture at 200 MHz. Use Value: x36 bus width matches FPGA 36-bit AXI4 data lanes; DLL alignment eliminates need for programmable IO delays in FPGA logic. |
| Switch Fabric Lookup Table | High-Speed Test Equipment Memory |
|
Use Scenario: Storing MAC address tables and policy rules in modular enterprise switches requiring sub-10 ns random access. IC Role / Device Role / Timing Role: Deterministic-latency memory accessed by dual-core lookup engine - one core reads while the other writes updated entries. Use Value: Full data coherency guarantees latest rule version is always returned; BWS[3:0] enables atomic 8-bit updates without disturbing adjacent fields. |
Use Scenario: Capturing real-time waveform samples in automated test equipment (ATE) with >200 MS/s sampling and pattern replay. IC Role / Device Role / Timing Role: Bidirectional memory buffer between ADC/DAC and pattern generator, leveraging independent ports for simultaneous acquisition and playback. Use Value: 200 MHz clock + 4-word burst sustains 800 MB/s sustained bandwidth - exceeds PCIe Gen2 x4 host interface bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150 | 2M × 36, 250 MHz max, LVDS I/O, 209-pin PQFP - higher speed but larger package and different signaling | Requires LVDS termination and differential routing; less suitable for HSTL-based FPGA platforms | Select when system demands >200 MHz operation and board layout accommodates LVDS constraints |
| ISSI IS61WV204836B | 2M × 36, 166 MHz max, single-port, CMOS I/O, 119-pin TQFP - lower speed, no QDR architecture | Lacks concurrent read/write capability; requires external arbitration logic for bidirectional use | Select only for cost-sensitive, non-concurrent applications where 166 MHz bandwidth suffices |
Compared with IDT72T36150 and IS61WV204836B, CY7C1515V18 uniquely balances 200 MHz QDR-II performance, HSTL compatibility, and 165-ball FBGA density - making it optimal for space-constrained, FPGA-centric designs requiring deterministic dual-port behavior.
Availability
CY7C1515V18 is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA acceleration, switch fabric, and high-speed test equipment requiring stable component supply across multi-year production cycles.
Supply support for CY7C1515V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, computing, and industrial systems.
CY7C1515V18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-processing and FPGA-adjacent architectures.
FAQ
What is the minimum supported clock frequency for CY7C1515V18?
The device operates down to DC - no minimum clock frequency is specified. All timing parameters are defined relative to the K/K input clock edges, and static operation (0 Hz) is supported for initialization and configuration sequences. However, DLL lock requires ≥10 MHz for stable operation.
Can CY7C1515V18 operate in single-clock mode?
Yes. When C and C are tied together and driven by K and K respectively, the device enters single-clock mode. In this mode, Q[35:0] data is clocked by K/K, and CQ/CQ are generated relative to K/K - simplifying clock tree design at the cost of reduced deskew capability.
How does ZQ pin calibration affect output drive strength?
ZQ connects to an external resistor (typically 100 Ω) to ground, setting output driver impedance to 20 Ω (0.2 × 100 Ω). This matches standard 50 Ω transmission lines in parallel-terminated HSTL-15 systems, minimizing reflections and ensuring clean eye diagrams at 400 MT/s.
Is DOFF pin required to be tied high in normal operation?
Yes. DOFF must be pulled high (to VDDQ) to enable the internal DLL. If grounded, the DLL disables and output timing shifts significantly - violating AC specifications in the datasheet. Leaving DOFF floating is not allowed due to potential metastability.
CY7C1515V18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1515V18-200BZC FAQ
1.How can I place an order for CY7C1515V18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1515V18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1515V18-200BZC reliable?
The price and inventory of CY7C1515V18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515V18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1515V18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515V18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1515V18-200BZC?
CY7C1515V18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1515V18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1515V18-200BZC?
For technical support, including CY7C1515V18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515V18-200BZC requirements.
6.How does Aetrix verify that CY7C1515V18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1515V18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515V18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1515V18-200BZC?
All CY7C1515V18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515V18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1515V18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1515V18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1515V18-200BZC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

