Cypress Semiconductor Corp CY7C1518AV18-167BZC

Overview

CY7C1518AV18-167BZC from Cypress Semiconductor is a 72-Mbit DDR-II synchronous SRAM configured as 4 M × 18, operating at up to 167 MHz with 1.8-V core supply, HSTL I/O, and two-word burst architecture. It uses dual input clocks (K/K̄) for address/data capture and echo clocks (CQ/CQ̄) for precise data capture in high-speed memory subsystems, targeting network packet buffering and baseband processing.

For engineers reviewing the CY7C1518AV18-167BZC datasheet, CY7C1518AV18-167BZC pinout, CY7C1518AV18-167BZC application, or CY7C1518AV18-167BZC equivalent, key selection criteria include DDR-II timing compliance, 165-ball FBGA mechanical compatibility, DLL-enabled vs. DLL-off latency modes (1.5-cycle vs. 1-cycle), and HSTL-18 output drive matching.

Technical Context

This SRAM implements a synchronous pipelined architecture with internal self-timed writes and a 1-bit burst counter that increments A0 to deliver two consecutive 18-bit words per access. All synchronous inputs (A, R/W, BWS, LD) are registered on rising edges of K/K̄, while read data is driven on rising edges of C/C̄ (or K/K̄ in single-clock mode).

The device supports both DDR-II operation (with DLL enabled, 1.5-cycle read latency at 167 MHz) and backward-compatible DDR-I mode (DLL disabled, 1-cycle latency). Echo clocks CQ/CQ̄ are phase-aligned to C/C̄ and referenced to VDDQ, enabling source-synchronous data capture without board-level skew compensation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-167BLI and MT48LC16M18A2P-6A:G, CY7C1518AV18-167BZC delivers deterministic DDR-II timing with echo clocks for zero-skew data capture, 1.8-V operation for lower power, and integrated burst logic eliminating external address sequencing logic-making it optimal for new high-speed embedded memory subsystems.

Availability

CY7C1518AV18-167BZC is available at Aetrix Electronics and suitable for telecom line card buffering, wireless baseband processing, industrial video frame buffering, and ATE pattern memory applications requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1518AV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1518AV18 belongs to Cypress's DDR-II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in networking infrastructure and wireless baseband equipment where deterministic timing and HSTL interoperability are essential.

FAQ

What is the function of the DOFF pin on CY7C1518AV18-167BZC?

The DOFF (DLL Turn Off) pin is an active-low input that disables the internal delay-locked loop. When pulled LOW, the device operates in DDR-I mode with 1-cycle read latency and relaxed timing margins. For normal DDR-II operation, DOFF must be held HIGH via a ≤10 kΩ pull-up to VDDQ. This pin enables runtime switching between latency modes without changing clock frequency.

Can CY7C1518AV18-167BZC operate without external C and C̄ clocks?

Yes. In single-clock mode, the device uses only K and K̄ for both input capture and output data timing. Read data is driven on the rising edges of K and K̄, and echo clocks CQ/CQ̄ are generated relative to K/K̄ instead of C/C̄. This mode simplifies clock routing but sacrifices the flight-time deskewing capability provided by independent C/C̄.

How is output impedance calibrated using the ZQ pin?

ZQ connects to a 240 Ω resistor tied to ground, enabling on-die calibration of DQ, CQ, and CQ̄ output drivers to 48 Ω (0.2 × R_Q). This ensures consistent HSTL-18 signal integrity across process, voltage, and temperature. Connecting ZQ directly to VDDQ forces minimum output impedance (~24 Ω), while leaving it unconnected or grounded violates specification and may cause drive strength errors.

Is CY7C1518AV18-167BZC pin-compatible with CY7C1520AV18-167BZC?

No. Although both use the same 165-ball FBGA package, their pinouts differ significantly: CY7C1518AV18-167BZC has DQ[17:0], BWS[1:0], and 22 address bits (A[21:0]), while CY7C1520AV18-167BZC has DQ[35:0], BWS[3:0], and 21 address bits (A[20:0]). Signal placement (e.g., BWS2/BWS3, extra DQ pins) is not interchangeable-PCB layout is not compatible between the two parts.