Cypress Semiconductor Corp CY7C1518JV18-250BZC

Overview

CY7C1518JV18-250BZC from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous pipelined DDR II SRAM with 2-word burst architecture, 1.8V core supply, HSTL I/O, and 250 MHz maximum operating frequency (600 Mbps effective data rate). It uses dual input clocks (K/K) for precise DDR timing, echo clocks (CQ/CQ) for simplified high-speed data capture, and supports DLL-enabled 1.5-cycle read latency or DLL-off DDR I mode at up to 167 MHz.

For engineers reviewing the CY7C1518JV18-250BZC datasheet, CY7C1518JV18-250BZC pinout, CY7C1518JV18-250BZC application, or CY7C1518JV18-250BZC equivalent, key selection criteria include DDR II timing compliance, 165-ball FBGA (15 × 17 mm) mechanical fit, HSTL-18 I/O voltage tolerance (1.4V–1.8V), burst-aligned address incrementing, and JTAG 1149.1 test port support for system-level validation.

Technical Context

This SRAM implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of K/K and registering write data on both K and K edges. Read data is output-synchronized to C/C (or K/K in single-clock mode), with CQ/CQ echo clocks phase-aligned to output clocks for deterministic data capture.

The device integrates a Delay Lock Loop (DLL) for sub-cycle data placement accuracy in DDR II mode, while DOFF pin control enables fallback to DDR I timing with 1-cycle latency. All synchronous inputs pass through edge-triggered registers; outputs are registered to C/C or K/K, and byte write select (BWS[1:0]) operates per 9-bit byte with independent enable per burst word.

Key Specifications

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm footprint, 1.4 mm height, 0.8 mm ball pitch. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput memory subsystems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-15BLI and MT48LC16M18A2P-6A:G, CY7C1518JV18-250BZC delivers deterministic DDR II timing, integrated DLL for sub-cycle alignment, and echo clocks that eliminate external capture logic - reducing BOM count and PCB layer count in high-speed memory subsystems.

Availability

CY7C1518JV18-250BZC is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card memory, and medical imaging data acquisition requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1518JV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications systems, with emphasis on signal integrity and timing precision.

The CY7C1518JV18 belongs to Cypress's DDR II synchronous SRAM product line, engineered specifically for applications demanding deterministic low-latency burst access, echo-clock–assisted data capture, and HSTL-18 compatibility in 10 Gbps-class systems.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device reverts to DDR I timing with 1-cycle read latency and a maximum operating frequency of 167 MHz. When DOFF is HIGH, DDR II mode activates with 1.5-cycle latency and full 250 MHz capability. The pin must be externally biased - floating is not allowed.

Can CY7C1518JV18-250BZC operate with only one clock pair instead of two?

Yes - by strapping C and C HIGH at power-on, the device enters single-clock mode where K/K control both input registration and output timing. All timing parameters remain identical to dual-clock operation, effectively eliminating clock skew between input and output domains without requiring matched trace lengths.

How does ZQ calibration impact signal integrity in high-speed layouts?

ZQ calibration adjusts the output driver impedance to match the system data bus (typically 50 Ω). With a 240 Ω resistor tied from ZQ to ground, the device sets its output strength to 48 Ω (0.2 × 240 Ω), minimizing reflections and ensuring clean eye diagrams at 600 Mbps. This eliminates need for external series termination resistors on DQ lines.

Is the 165-ball FBGA package compatible with standard reflow profiles for lead-free assembly?

Yes - the CY7C1518JV18-250BZC Pb-free variant complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports peak reflow temperatures up to 260°C. Its 0.8 mm ball pitch and thermal pad design are validated for standard Type 3 solder paste and convection reflow profiles used in high-volume manufacturing.