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Cypress Semiconductor Corp CY7C1518KV18-250BZXI

Part No.:
CY7C1518KV18-250BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1518KV18-250BZXI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,171

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Product details

Overview

CY7C1518KV18-250BZXI from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous DDR-II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and HSTL I/O compatible with 1.5 V/1.8 V IO rails. It delivers 900 MB/s peak bandwidth via double-data-rate transfers at 500 Mbps per pin and supports precise timing via dual K/K input clocks and echo clocks CQ/CQ for high-speed data capture in networking and test equipment memory buffers.

For engineers reviewing the CY7C1518KV18-250BZXI datasheet, CY7C1518KV18-250BZXI pinout, CY7C1518KV18-250BZXI application, or CY7C1518KV18-250BZXI equivalent, key selection criteria include its 1.5-cycle read latency (DOFF = HIGH), programmable output drive strength, JTAG 1149.1 boundary scan support, and 165-ball FBGA package with ZQ impedance calibration.

Technical Context

The device implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of K and K clocks. Write data is registered on both K and K edges, while read data is driven synchronously to C and C - enabling deskewed system-level timing across multiple SRAMs.

It integrates a PLL for accurate data placement, supports single-clock mode (using K/K only) when C/C are unconnected, and uses ZQ calibration to match output impedance to system bus (0.2 × RQ). DOFF pin selects between DDR-II mode (1.5-cycle latency) and DDR-I–compatible mode (1-cycle latency).

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit / 4M × 18 - provides 72-bit-wide data path per access with two-word burst delivering 36 bytes per cycle
Max Clock Frequency 250 MHz - defines maximum sustained address strobe rate; enables 500 MT/s effective data rate on DQ pins
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - directly impacts pipeline depth and controller wait-state insertion
I/O Voltage Support 1.5 V or 1.8 V VDDQ - allows interoperability with legacy 1.5 V DDR-I systems and newer 1.8 V infrastructure
Core Supply 1.8 V ± 0.1 V - fixed low-voltage core reduces dynamic power vs. 3.3 V or 2.5 V SRAMs
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - fine-pitch footprint optimized for high-density PCB layouts in telecom line cards
Impedance Calibration ZQ pin with external resistor to GND - enables dynamic output driver tuning to match PCB trace impedance (e.g., 50 Ω)

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXI suffix).

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data Shares physical pins for read output and write input; driven on rising edges of C/C (or K/K); tristated automatically on deselect
K / K Positive/negative input clocks Capture all synchronous inputs (address, R/W, LD, BWS); define burst initiation edge; used for data output in single-clock mode
C / C Positive/negative output clocks Source synchronous clocking for read data; enable board-level flight-time deskew across multiple devices
CQ / CQ Echo clocks referenced to C/C Free-running, phase-aligned copies of C/C; simplify FPGA/ASIC capture logic by eliminating separate clock routing
DOFF DDR operation mode select HIGH → DDR-II mode (1.5-cycle latency); LOW → DDR-I–compatible mode (1-cycle latency); sets internal timing path
ZQ Output impedance calibration input Connects to external resistor to GND; calibrates DQ/CQ/CQ driver strength to match system bus impedance
LD Load control Active-low synchronous strobe; latches address and R/W on next K edge; initiates burst sequence
BWS[1:0] Byte write select Active-low controls write masking: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; enables partial-word writes without read-modify-write

Key Features

Feature Design Value
Two-word burst architecture Reduces external address bus toggling by 50% vs. single-word SRAMs - lowers EMI and simplifies controller address generation
Programmable HSTL output drive Variable strength via ZQ calibration - ensures signal integrity across varying trace lengths and loads without external termination resistors
JTAG 1149.1 boundary scan Enables in-system test and interconnect verification on dense PCBs - eliminates need for bed-of-nails fixtures during manufacturing
Dual clock domains (K/K + C/C) Decouples address/control capture from data output timing - permits independent optimization of setup/hold margins for each domain
DOFF-selectable latency mode Allows runtime switching between 1-cycle (legacy compatibility) and 1.5-cycle (higher bandwidth efficiency) read response - aids migration paths

Applications

High-Speed Packet Buffering Test Equipment Waveform Memory

Use Scenario: Storing and replaying multi-gigabit Ethernet or OTN frame payloads in real time within line interface cards.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to FPGA-based packet processors using source-synchronous DDR timing.

Use Value: 900 MB/s sustained throughput and echo clocks (CQ/CQ) eliminate timing closure challenges across 18-bit data buses at 250 MHz.

Use Scenario: Capturing and regenerating high-fidelity analog stimulus waveforms in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Synchronous burst memory staging waveform samples for DAC feeding; synchronized to precision clock generator.

Use Value: 1.5-cycle DDR-II latency and ZQ-calibrated outputs ensure deterministic jitter-free sample delivery to high-speed DACs.

Telecom Baseband Processing Industrial Motion Controller FIFO

Use Scenario: Temporary storage of OFDM symbol data between FFT processing stages in wireless baseband units.

IC Role / Device Role / Timing Role: Pipelined burst SRAM acting as inter-stage data register with minimal pipeline stall overhead.

Use Value: DOFF-selectable latency allows tuning between throughput (1.5-cycle) and determinism (1-cycle) based on algorithmic pipeline constraints.

Use Scenario: Holding interpolated motion trajectory points between PLC scan cycles and servo drive update intervals.

IC Role / Device Role / Timing Role: Deterministic-access FIFO buffering position/velocity commands with guaranteed worst-case read latency.

Use Value: JTAG boundary scan enables field-upgradeable firmware validation and real-time memory integrity checking in safety-critical motion systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C362000B-250BIN 256-Mbit (16M × 18), 250 MHz, 3.3 V core, SSTL-2 I/O - higher density but incompatible voltage and signaling Requires level-shifting and separate 3.3 V rail; lacks ZQ calibration and echo clocks - increases PCB complexity Select only if 256-Mbit capacity is mandatory and system already supports 3.3 V SSTL-2 interfaces
IS61WV102418BLL-250TQLI 18-Mbit (512K × 36), 250 MHz, 3.3 V core, LVTTL I/O - lower density, no DDR, no burst, no echo clocks Single-data-rate operation limits bandwidth to 450 MB/s; requires full address bus per access - increases controller pin count Consider only for cost-sensitive, non-burst, non-DDR designs where 18-Mbit capacity suffices

Compared with AS7C362000B-250BIN and IS61WV102418BLL-250TQLI, CY7C1518KV18-250BZXI uniquely delivers DDR-II burst performance at 1.8 V with integrated impedance control and echo clocks - reducing system-level timing margin risk in high-speed serial data paths.

Availability

CY7C1518KV18-250BZXI is available at Aetrix Electronics and suitable for high-speed packet buffering, test equipment waveform memory, telecom baseband processing, and industrial motion controller FIFO applications requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1518KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems, with focus on reliability, signal integrity, and system-level integration.

CY7C1518KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for applications needing deterministic low-latency burst access, source-synchronous timing, and impedance-matched I/O in high-speed digital systems.

FAQ

What is the function of the DOFF pin on CY7C1518KV18-250BZXI?

The DOFF (DDR Operation Mode Select) pin configures the device's read latency behavior: when asserted HIGH, it enables DDR-II mode with 1.5-cycle read latency; when LOW, it reverts to DDR-I–compatible mode with 1-cycle latency. This pin directly selects internal timing paths and must be held static during operation - it is not sampled dynamically per access.

Can CY7C1518KV18-250BZXI operate without external C and C clocks?

Yes - the device supports single-clock mode where read data is driven on the rising edges of K and K instead of C and C. In this configuration, echo clocks CQ/CQ remain functional and phase-aligned to K/K, preserving their utility for data capture timing. All timing parameters shift to reference K/K edges, and setup/hold margins must be re-validated per the datasheet's single-clock timing tables.

How does ZQ calibration work, and what resistor value is required?

ZQ calibration uses an external resistor (RQ) connected between the ZQ pin and ground to set output driver impedance to 0.2 × RQ. For standard 50 Ω PCB traces, a 240 Ω resistor yields 48 Ω output impedance. The device performs calibration at power-up and optionally on command via JTAG; it cannot be left floating or tied to VSS, and direct connection to VDDQ enables minimum-impedance mode (~30 Ω).

Is CY7C1518KV18-250BZXI pin-compatible with other densities in the CY7C15xxKV18 family?

No - CY7C1518KV18-250BZXI (4M × 18) is not pin-compatible with CY7C1520KV18 (2M × 36), despite shared package and signal naming. Pin functions differ significantly: BWS[1:0] vs. BWS[3:0], DQ[17:0] vs. DQ[35:0], and distinct address bit counts (A[21:0] vs. A[20:0]). Layout reuse requires full redesign; no mechanical or electrical drop-in replacement exists within the family.

CY7C1518KV18-250BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1518KV18-250BZXI FAQ

1.How can I place an order for CY7C1518KV18-250BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1518KV18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1518KV18-250BZXI reliable?

The price and inventory of CY7C1518KV18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1518KV18-250BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1518KV18-250BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1518KV18-250BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1518KV18-250BZXI?

CY7C1518KV18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1518KV18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1518KV18-250BZXI?

For technical support, including CY7C1518KV18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1518KV18-250BZXI requirements.

6.How does Aetrix verify that CY7C1518KV18-250BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1518KV18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1518KV18-250BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1518KV18-250BZXI?

All CY7C1518KV18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1518KV18-250BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1518KV18-250BZXI part is unused and in its original packaging.

Return procedure for CY7C1518KV18-250BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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