Cypress Semiconductor Corp CY7C1518KV18-300BZXC

Overview

CY7C1518KV18-300BZXC from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR-II synchronous pipelined SRAM with two-word burst architecture, 333 MHz clock operation, 1.8 V core supply, HSTL I/O, and 165-ball FBGA package. It delivers 666 MT/s data transfer via double-data-rate interface and supports configurable 1-cycle (DOFF = LOW) or 1.5-cycle (DOFF = HIGH) read latency for high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the CY7C1518KV18-300BZXC datasheet, CY7C1518KV18-300BZXC pinout, CY7C1518KV18-300BZXC application, or CY7C1518KV18-300BZXC equivalent, key selection criteria include DDR-II timing compliance, echo clock (CQ/CQ) synchronization capability, burst-addressed 18-bit dual-word access, and JTAG 1149.1 test port support for system-level validation.

Technical Context

The device implements a synchronous pipelined architecture with independent K/K input clocks for address/control/data capture and C/C output clocks for data launch-enabling precise skew management across multi-device DDR buses. Its internal burst counter uses A0 to generate sequential 18-bit word addresses on each access, eliminating external address sequencing logic.

All synchronous inputs (R/W, LD, BWS[1:0], A[21:0]) are registered on rising edges of K/K; all outputs (DQ[17:0], CQ, CQ) are edge-aligned to C/C (or K/K in single-clock mode). The integrated PLL ensures accurate data placement relative to echo clocks, while ZQ calibration enables dynamic output impedance matching to 0.2 × RQ.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SRAM applications.

Compared with AS7C3256A-20TIN and IS61WV102418BLL-10BLI, CY7C1518KV18-300BZXC delivers 12× higher effective bandwidth, eliminates per-word address overhead via burst mode, and enables deterministic multi-device timing alignment through CQ/CQ echo clocks-critical for >1 Gb/s packet processing.

Availability

CY7C1518KV18-300BZXC is available at Aetrix Electronics and suitable for telecom packet buffers, network switch lookup tables, medical imaging frame stores, and industrial vision preprocessing buffers requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1518KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

CY7C1518KV18 belongs to Cypress's DDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in FPGA- and ASIC-based networking and imaging platforms where echo-clock synchronization and burst efficiency are critical.

FAQ

What is the function of the DOFF pin on CY7C1518KV18-300BZXC?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency for improved timing margin; when LOW, it selects DDR-I compatibility mode with 1-cycle latency. This setting directly affects setup/hold timing windows for read data capture and must be fixed at power-up.

Can CY7C1518KV18-300BZXC operate without the C and C output clocks?

Yes - the device supports single-clock-domain operation using only K and K for both input sampling and output launching. In this mode, DQ[17:0], CQ, and CQ are synchronized to K/K instead of C/C, sacrificing deskew capability but simplifying clock routing in cost-sensitive or space-constrained designs.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and configures its output drivers to deliver 0.2 × RQ impedance. This matches typical 50 Ω PCB traces, minimizing reflections and ensuring clean eye diagrams at 666 MT/s - critical for maintaining BER < 10⁻¹² in high-speed links.

Is CY7C1518KV18-300BZXC pin-compatible with CY7C1520KV18-300BZXC?

No - although both use the same 165-ball FBGA package, their pinouts differ significantly: CY7C1518KV18 has DQ[17:0], BWS[1:0], and 22 address lines (A[21:0]), while CY7C1520KV18 uses DQ[35:0], BWS[3:0], and 21 address lines (A[20:0]). Interchange requires full PCB redesign and firmware revalidation.