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Cypress Semiconductor Corp CY7C1518V18-250BZC

Part No.:
CY7C1518V18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1518V18-250BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:210

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Product details

Overview

CY7C1518V18 from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous pipelined DDR-II SRAM with 300 MHz clock support, 2-word burst architecture, and dual-clock DDR interface delivering 600 MHz effective data rate. It operates from a 1.8V core supply with HSTL I/O, integrates a Delay Lock Loop (DLL) for precise data placement, and targets high-bandwidth buffering in network packet processors and telecom line cards.

For engineers reviewing the CY7C1518V18 datasheet, CY7C1518V18 pinout, CY7C1518V18 application, or CY7C1518V18 equivalent, key selection criteria include its 4M × 18 organization, 165-ball FBGA package, echo clock (CQ/CQ) timing support, and synchronous self-timed write capability-critical for deterministic latency in burst-oriented memory subsystems.

Technical Context

The CY7C1518V18 implements a synchronous pipelined architecture where all address, control, and data inputs are registered on rising edges of K/K clocks. Its internal organization comprises two 2M × 18 arrays, with A0 driving the burst counter to sequence two 18-bit words per access.

Read data is output-synchronized to C/C clocks (or K/K in single-clock mode), while echo clocks CQ/CQ-phase-aligned to C/C-are provided to simplify system-level data capture. The DLL ensures accurate data-to-clock alignment, and ZQ enables dynamic output impedance tuning to match the 50-Ω system bus.

Key Specifications

ParameterValue and Actual Design Meaning
Density & Organization72 Mbit / 4M × 18 - supports 18-bit parallel data paths with 2-word burst transfers per address cycle
Max Clock Frequency250 MHz (K/K) - defines maximum sustained burst transaction rate; corresponds to 500 MT/s effective throughput
Data Rate600 MHz DDR - achieves 1.2 Gbps per DQ pin via double-edge sampling on C/C clocks
Core Supply1.8 V ± 0.1 V - powers SRAM core and logic; requires tight regulation to maintain timing margins
I/O StandardHSTL Class I - provides 1.5V swing with programmable drive strength and ZQ-calibrated output impedance
Package165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch, thermally enhanced package suitable for high-density PCB layouts
Timing ArchitectureDDR-II with DLL - eliminates data-eye closure due to clock skew; enables reliable operation at 250 MHz system clock

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
DQ[17:0]Synchronous bidirectional data bus18-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges with echo-clock alignment
A[21:1], A0Address inputsA[21:1] selects 4M rows; A0 feeds burst counter to generate second 18-bit word address in linear sequence
BWS[1:0]Byte write select (active low)BWS0 controls DQ[8:0], BWS1 controls DQ[17:9]; enables partial writes without read-modify-write overhead
K, KInput clock pairRising edges latch all synchronous inputs (address, R/W, LD, BWS); define system timing reference for command initiation
C, COutput clock pairRising edges gate read data output; used with CQ/CQ to deskew flight time across multiple devices on same bus
CQ, CQEcho clock outputsFree-running clocks synchronized to C/C; eliminate need for external strobes in high-speed capture circuitry
ZQImpedance calibration inputConnects to external 240 Ω resistor to ground; calibrates DQ/CQ output drivers to ±10% of 50 Ω system impedance
DOFFDLL disable controlPulling LOW disables DLL; used for power-down or when board-level timing budget allows fixed delay compensation

Key Features

FeatureDesign Value
2-word burst architectureReduces address bus toggling by 50% versus single-word access-lowers EMI and simplifies controller address generation logic
Integrated Delay Lock Loop (DLL)Compensates for process/voltage/temperature drift to maintain < ±50 ps data-to-clock alignment at 250 MHz
HSTL Class I I/O with ZQ calibrationEnsures consistent signal integrity across voltage/temp range; eliminates manual termination resistor selection
Synchronous self-timed writesRemoves external write pulse timing constraints; guarantees internal write completion before next cycle begins
JTAG 1149.1 test access portEnables boundary-scan testing of SRAM interconnects without requiring functional memory access during production test

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput burst buffer interfacing directly to MAC-layer controllers via 18-bit DDR bus.

Use Value: 250 MHz clock + 2-word burst delivers 900 MB/s sustained bandwidth-sufficient for 10Gbps line-rate header processing without pipeline stalls.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH framer ASICs.

IC Role / Device Role / Timing Role: Synchronous pipelined memory providing deterministic 2-cycle read latency for cell-based traffic shaping.

Use Value: DLL-aligned CQ/CQ echo clocks enable reliable data capture at 600 Mbps DDR without complex receiver deskew circuitry.

Baseband Processing CacheIndustrial Real-Time Controller Buffer

Use Scenario: Temporary storage of FFT coefficients and channel estimation results in LTE eNodeB baseband units.

IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM co-located with DSP cores to minimize memory wait states.

Use Value: 1.8V core + HSTL I/O reduces switching noise coupling into sensitive RF sections compared to 3.3V alternatives.

Use Scenario: Motion control trajectory buffering in CNC machine controllers requiring jitter-free position updates.

IC Role / Device Role / Timing Role: Deterministic-access memory holding interpolated motion profiles for servo loop execution.

Use Value: Synchronous self-timed writes guarantee write completion within one K-clock cycle-enabling sub-microsecond update intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1520V182M × 36 organization (same 72-Mbit density); uses 21 address bits and BWS[3:0]Optimized for 36-bit datapaths (e.g., PCI-X, legacy RISC buses); higher pin count for wider interfaceSelect when system bus width matches 36-bit and burst depth requirement remains 2 words
IS42S16400F-6BLISDRAM (not SRAM); 16M × 4 organization; 166 MHz clock; no DLL or echo clocksRequires refresh management and longer latency; lacks deterministic timing for real-time control loopsConsider only for cost-sensitive, non-real-time buffering where latency variability is acceptable

Compared with CY7C1520V18, CY7C1518V18 offers narrower 18-bit bus loading and lower pin count for space-constrained designs; versus IS42S16400F-6BLI, it delivers guaranteed zero-wait-state operation and no refresh overhead-critical for hard real-time embedded systems.

Availability

CY7C1518V18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial real-time controller buffer applications requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1518V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C15xxV18 family was designed specifically for high-bandwidth, low-latency burst memory applications in networking and telecom infrastructure-emphasizing deterministic timing, DDR-II compatibility, and system-level signal integrity.

FAQ

What is the minimum supported clock frequency for CY7C1518V18?

The device supports operation down to DC (0 Hz) for static functionality, but its DDR timing specifications-including setup/hold windows and DLL lock range-are guaranteed only at frequencies ≥100 MHz. For full compliance with AC parameters in the datasheet, use ≥167 MHz as the practical lower limit.

Can CY7C1518V18 operate without the DLL enabled?

Yes-asserting DOFF LOW disables the DLL, reverting to fixed-delay output timing. However, AC timing parameters change significantly: tAC increases by up to 1.2 ns, and data valid window shrinks. This mode is intended only for power-sensitive or low-frequency applications where timing margin is sufficient.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts the DQ and CQ driver output impedance to match the system's 50-Ω transmission line. With a 240-Ω resistor tied to ground, the device sets driver strength to deliver 0.2 × 240 Ω = 48 Ω, minimizing reflections and ensuring clean eye diagrams at 600 Mbps DDR rates.

Is CY7C1518V18 compatible with standard HSTL-18 receivers?

Yes-the device complies with JEDEC HSTL Class I (1.8V) specifications: VDDQ = 1.8V, VOH = 1.5V min, VOL = 0.3V max, and VIH/VIL thresholds centered at VREF = 0.9V. It interfaces directly with FPGA or ASIC HSTL-18 I/O banks without level-shifting.

CY7C1518V18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1518V18-250BZC FAQ

1.How can I place an order for CY7C1518V18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1518V18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1518V18-250BZC reliable?

The price and inventory of CY7C1518V18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1518V18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1518V18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1518V18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1518V18-250BZC?

CY7C1518V18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1518V18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1518V18-250BZC?

For technical support, including CY7C1518V18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1518V18-250BZC requirements.

6.How does Aetrix verify that CY7C1518V18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1518V18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1518V18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1518V18-250BZC?

All CY7C1518V18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1518V18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1518V18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1518V18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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