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Cypress Semiconductor Corp CY7C1520AV18-250BZXC

Part No.:
CY7C1520AV18-250BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1520AV18-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:119

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Product details

Overview

CY7C1520AV18-250BZXC from Cypress Semiconductor is a 72-Mbit (2 M × 36) DDR-II synchronous SRAM with two-word burst architecture, 1.8-V core supply, HSTL I/O, and 250 MHz clock operation enabling 500 MT/s data transfer. It uses dual input clocks (K/K̄) for address/data capture and dual output clocks (C/C̄) with echo clocks (CQ/CQ̄) for precise DDR timing in high-speed memory subsystems. Designed for networking packet buffers and telecom line cards requiring low-latency, burst-mode memory access.

For engineers reviewing the CY7C1520AV18-250BZXC datasheet, CY7C1520AV18-250BZXC pinout, CY7C1520AV18-250BZXC application, or CY7C1520AV18-250BZXC equivalent, key selection criteria include DDR-II burst latency (1.5 cycles with DLL enabled), 165-ball FBGA package compatibility, HSTL-18 I/O voltage range (1.4 V–1.8 V), and JTAG 1149.1 test port support for system-level validation.

Technical Context

The device implements a synchronous pipelined architecture with internal delay-locked loop (DLL) for accurate data placement relative to C/C̄ clocks, supporting 1.5-cycle read latency in DLL-on mode and 1-cycle latency in DLL-off (DDR-I) mode up to 167 MHz. Burst counter logic increments A0 internally to deliver two consecutive 36-bit words per access.

All synchronous inputs (A[20:0], R/W, BWS[3:0], LD) are registered on rising edges of K/K̄; data outputs DQ[35:0] are edge-aligned to C/C̄ and echoed via CQ/CQ̄, eliminating board-level skew compensation. ZQ pin enables dynamic output impedance tuning to match 50 Ω system buses.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit (2 M × 36); supports depth expansion via chip select and byte write masking across multiple devices.
Max Clock Frequency 250 MHz (K/K̄); enables 500 MT/s effective throughput with double-data-rate transfers.
Read Latency 1.5 clock cycles with DLL enabled; reduces pipeline stalls in high-throughput packet buffering applications.
I/O Standard HSTL-18 Class I; compatible with 1.8-V systems and supports programmable drive strength via VDDQ and ZQ calibration.
Supply Voltages VDD = 1.8 V ± 0.1 V (core); VDDQ = 1.8 V ± 0.1 V (I/O); independent power domains isolate noise-sensitive logic from I/O switching.
Package 165-ball FBGA (15 mm × 17 mm × 1.4 mm); RoHS-compliant, 0.8-mm ball pitch, thermal pad exposed on bottom for enhanced heat dissipation.
JTAG Support IEEE 1149.1 compliant TAP controller with boundary scan, instruction register, and identification register for production test and debug.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, bottom thermal pad.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus Shares physical pins for read/write; driven on rising edges of C/C̄ during reads, sampled on K/K̄ during writes; tristated automatically when deselected.
K / K̄ Primary input clock pair Captures all synchronous inputs (address, R/W, BWS, LD); defines access initiation timing; used for data output in single-clock mode.
C / C̄ Output data clock pair Controls timing of DQ[35:0] output edges; enables flight-time deskewing across multiple DDR-II SRAMs on same bus.
CQ / CQ̄ Echo clock outputs Free-running clocks synchronized to C/C̄; referenced by external controller for reliable data capture without board trace length matching.
BWS[3:0] Byte write select inputs Active-low signals controlling 9-bit byte lanes (BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]); allows partial-word writes without read-modify-write.
ZQ Output impedance calibration input Connects to external 50 Ω resistor to ground to tune DQ/CQ output driver impedance to 10 Ω (0.2 × RQ); prevents signal integrity degradation on long traces.

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling frequency by 50% versus single-word SRAMs-critical for minimizing routing congestion in dense FPGA/SOC memory interfaces.
Programmable output drive strength HSTL outputs support variable drive via ZQ calibration and VDDQ scaling, enabling optimization for signal integrity across varied PCB stackups and trace lengths.
DLL-enabled timing precision Internal delay-locked loop aligns CQ/CQ̄ and DQ edges to C/C̄ within ±50 ps, eliminating need for manual board-level delay tuning in 500 MT/s designs.
Single/dual clock mode flexibility DLL-off mode reverts to DDR-I timing (1-cycle latency) at ≤167 MHz, allowing backward compatibility with legacy controllers lacking DDR-II clock management.
JTAG 1149.1 test access port Enables in-system boundary scan testing of interconnects between FPGA and SRAM, reducing test fixture cost and accelerating production fault isolation.

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules handling 10 Gbps+ aggregate traffic.

IC Role / Device Role / Timing Role: Primary burst-access memory for ingress/egress FIFOs, synchronized to SERDES clock domain via K/K̄ and C/C̄.

Use Value: Two-word burst minimizes address bus bandwidth; DLL alignment ensures deterministic 1.5-cycle latency across temperature and voltage variation.

Use Scenario: Deep buffer storage in enterprise switches/routers for TCP retransmission queues and QoS scheduling tables.

IC Role / Device Role / Timing Role: Synchronous SRAM interfaced to multi-port switch fabric ASICs using HSTL-18 signaling and echo-clock–based capture.

Use Value: ZQ-calibrated 10 Ω outputs maintain signal integrity on 10+ inch backplane traces; BWS[3:0] enables efficient 36-bit partial writes.

FPGA-Based Protocol Analyzers Industrial Real-Time Controllers

Use Scenario: Capture memory in PCIe-based protocol analyzers logging full-link traffic at 2.5 GT/s with timestamped metadata.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory mapped directly to FPGA DDR-II controller IP with CQ/CQ̄–driven capture logic.

Use Value: Echo clocks eliminate setup/hold uncertainty at 500 MT/s; JTAG port enables field-upgradable firmware and runtime diagnostics.

Use Scenario: Deterministic data logging in motion control PLCs requiring sub-microsecond memory access for servo loop state updates.

IC Role / Device Role / Timing Role: Burst-mode SRAM co-located with real-time processor for cyclic buffer storage of encoder position and torque samples.

Use Value: DLL-off mode provides guaranteed 1-cycle latency at 167 MHz for deterministic worst-case timing analysis in safety-critical applications.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102436B 1024 K × 36, 165-BGA, 200 MHz max, no DLL, DDR-I only Lacks DLL and echo clocks; requires tighter board layout control for timing closure at 400 MT/s Select when cost sensitivity outweighs need for DLL-assisted timing margin and echo-clock simplification.
Renesas R1EX24036AS 2 M × 36, 165-BGA, 250 MHz, integrated termination resistors, no JTAG On-die termination eliminates external resistors but removes boundary scan capability for production test Select for space-constrained designs where BOM reduction and layout simplicity are prioritized over testability.

Compared with IS61WV102436B and R1EX24036AS, CY7C1520AV18-250BZXC uniquely combines DLL-based timing precision, echo clocks for skew-insensitive capture, and JTAG testability-making it optimal for high-reliability, high-speed memory subsystems where timing margin and test coverage are critical.

Availability

CY7C1520AV18-250BZXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, FPGA-based protocol analyzers, and industrial real-time controllers requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1520AV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1520AV18 belongs to Cypress's DDR-II SRAM product line, engineered specifically for high-bandwidth, low-latency memory subsystems in networking infrastructure and real-time embedded systems demanding deterministic timing and robust signal integrity.

FAQ

What is the minimum supported clock frequency for CY7C1520AV18-250BZXC?

The device operates down to DC for functional operation, but AC timing specifications (e.g., tCK, tAC) are guaranteed only at frequencies ≥167 MHz in DLL-off mode and ≥200 MHz in DLL-on mode. Below 167 MHz, setup/hold margins must be verified per application conditions using the device's static timing model.

Can CY7C1520AV18-250BZXC operate without connecting the ZQ pin?

No. ZQ must be connected either to a 50 Ω resistor to ground for impedance calibration or directly to VDDQ for minimum-drive mode. Leaving ZQ floating or tied to VSS violates Absolute Maximum Ratings and may cause output driver instability or excessive current draw.

How does the DLL affect read latency in CY7C1520AV18-250BZXC?

With DLL enabled, read latency is fixed at 1.5 clock cycles (tRL = 1.5 × tCK), ensuring consistent timing across voltage/temperature. With DLL disabled (DOFF = LOW), latency reduces to 1 cycle but maximum frequency drops to 167 MHz and timing margins tighten significantly due to uncalibrated clock-to-output skew.

Is CY7C1520AV18-250BZXC pin-compatible with CY7C1518AV18-250BZXC?

No. Although both use the same 165-ball FBGA package, pin assignments differ significantly: CY7C1518AV18 has DQ[17:0] and BWS[1:0], while CY7C1520AV18 routes DQ[35:0] and BWS[3:0] across distinct ball locations. Direct replacement requires PCB redesign and signal mapping verification.

CY7C1520AV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1520AV18-250BZXC FAQ

1.How can I place an order for CY7C1520AV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1520AV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1520AV18-250BZXC reliable?

The price and inventory of CY7C1520AV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520AV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1520AV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520AV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1520AV18-250BZXC?

CY7C1520AV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1520AV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1520AV18-250BZXC?

For technical support, including CY7C1520AV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520AV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1520AV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1520AV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520AV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1520AV18-250BZXC?

All CY7C1520AV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520AV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1520AV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1520AV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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