Cypress Semiconductor Corp CY7C1520KV18-300BZXC

Overview

CY7C1520KV18-300BZXC from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 300 MHz with double-data-rate interface delivering 600 MT/s effective throughput. It features two-word burst architecture, echo clocks (CQ/CQ), and programmable output impedance via ZQ pin. Designed for high-bandwidth buffering in network packet processors and telecom line cards where deterministic latency and precise timing alignment are critical.

For engineers reviewing the CY7C1520KV18-300BZXC datasheet, CY7C1520KV18-300BZXC pinout, CY7C1520KV18-300BZXC application, or CY7C1520KV18-300BZXC equivalent, key selection criteria include 300 MHz clock frequency, 1.8 V core supply with HSTL I/O, 1.5-cycle read latency (DOFF = HIGH), dual-clock domain support (K/K and C/C), and 165-ball FBGA package compatibility.

Technical Context

The CY7C1520KV18-300BZXC implements a synchronous pipelined architecture with internal burst counter driven by A0, enabling sequential 36-bit word reads/writes on alternate K/K edges. All address, control, and data inputs are registered on rising edges of K and K clocks, ensuring strict setup/hold compliance at 300 MHz.

Read data is edge-aligned to C and C clocks (or K/K in single-clock mode), with echo clocks CQ/CQ phase-matched to C/C for simplified system-level capture. The device integrates a PLL for accurate data placement and supports JTAG 1149.1 boundary scan for production testability.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with AS7C3256A-15JCIN and IS61WV102432BLL-10BLI, the CY7C1520KV18-300BZXC delivers 2.8× higher effective bandwidth, eliminates address bus contention via burst mode, and provides system-level timing control through echo clocks-making it uniquely suited for next-generation packet-processing architectures.

Availability

CY7C1520KV18-300BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and radar signal processing FIFOs requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1520KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

The CY7C15xxKV18 family targets high-speed data-path buffering in networking, telecom, and test equipment where DDR-II timing precision, echo-clock synchronization, and JTAG testability are essential design requirements.

FAQ

What is the function of the DOFF pin on CY7C1520KV18-300BZXC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, the device operates in DDR-II mode with 1.5-cycle read latency; when LOW, it reverts to DDR-I mode with 1-cycle latency. This setting directly affects controller pipeline depth and must be fixed at power-up via hardwired connection to VDD or VSS-not dynamically toggled during operation.

Can CY7C1520KV18-300BZXC operate without external C and C clocks?

Yes. When C and C are not provided, the device defaults to single-clock mode using K and K for both input capture and output timing. In this configuration, read data is driven on K/K rising edges, and echo clocks CQ/CQ are generated relative to K/K instead of C/C. System-level timing margin decreases, but functional compatibility is preserved.

How does the ZQ pin calibrate output impedance?

The ZQ pin connects to an external precision resistor (typically 240 Ω) tied to ground. The device measures this resistance and adjusts its HSTL output drivers to achieve 0.2 × RQ (e.g., 48 Ω) output impedance. This calibration occurs automatically at power-up and can be retriggered via JTAG instruction, ensuring consistent signal integrity across voltage and temperature variations.

Is CY7C1520KV18-300BZXC pin-compatible with CY7C1518KV18-300BZXC?

No. Although both use the same 165-ball FBGA package, pin assignments differ significantly: CY7C1520KV18-300BZXC uses DQ[35:0], BWS[3:0], and 21 address bits (A[20:0]), while CY7C1518KV18-300BZXC uses DQ[17:0], BWS[1:0], and 22 address bits (A[21:0]). Board-level redesign is required for substitution.