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Cypress Semiconductor Corp CY7C1520KV18-333BZC

Part No.:
CY7C1520KV18-333BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1520KV18-333BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:574

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Product details

Overview

CY7C1520KV18-333BZC from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 333 MHz clock frequency with double-data-rate (666 MHz effective) I/O, 1.8 V core supply, and HSTL-compatible interfaces. It implements two-word burst addressing, echo clocks (CQ/CQ), and programmable output impedance via ZQ pin for high-speed memory subsystems in networking line cards and packet buffering applications.

For engineers reviewing the CY7C1520KV18-333BZC datasheet, CY7C1520KV18-333BZC pinout, CY7C1520KV18-333BZC application, or CY7C1520KV18-333BZC equivalent, key selection criteria include DDR-II read latency (1.5 cycles with DOFF HIGH), dual-clock domain support (K/K and C/C), 165-ball FBGA package compatibility, and JTAG 1149.1 test access capability.

Technical Context

The CY7C1520KV18-333BZC integrates a pipelined SRAM core with synchronous peripheral logic, a 1-bit burst counter, and phase-locked loop (PLL) for precise data placement. Address latching occurs on alternate rising edges of K/K, while write data is registered on both K and K edges.

Read data is driven synchronously on rising edges of C/C (or K/K in single-clock mode), with echo clocks CQ/CQ aligned to C/C to eliminate board-level skew. Output impedance is calibrated via ZQ pin tied to external resistor (0.2 × RQ) or VDDQ for minimum drive strength.

Key Specifications

Parameter Value and Actual Design Meaning
Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 333 MHz - enables 666 MT/s effective data rate with DDR interface
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing mode for system synchronization
Supply Voltage 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - supports mixed-voltage system integration
Output Drive Variable HSTL - impedance programmable via ZQ pin for signal integrity tuning
Package 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch footprint for high-density PCB layouts
JTAG Support IEEE 1149.1 compliant TAP - enables boundary-scan testing and debug in assembled systems

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus 36-bit DDR I/O; sampled on K/K for writes, driven on C/C for reads; tristated during deselect
K / K Input clocks (positive/negative) Capture all synchronous inputs (address, R/W, LD, BWS); define burst address sequence
C / C Output data clocks Control timing of Q[35:0] output edges; used with CQ/CQ to deskew flight time across multiple devices
CQ / CQ Echo clocks Free-running outputs synchronized to C/C; enable source-synchronous data capture without controller-side delay matching
LD Load strobe Active-Low synchronous enable for address and R/W setup; initiates each 2-word burst transaction
BWS[3:0] Byte write select Four active-Low signals controlling 9-bit byte segments (D[8:0], D[17:9], D[26:18], D[35:27])
ZQ Impedance calibration input Connects to external resistor-to-ground (RQ) to set output driver impedance to 0.2 × RQ; or tie to VDDQ for min impedance
DOFF Read latency mode control High = DDR-II mode (1.5-cycle latency); Low = DDR-I mode (1-cycle latency)

Key Features

Feature Design Value
Two-word burst architecture Reduces external address bus toggling by 50% versus single-word access - lowers EMI and routing complexity
Programmable output impedance ZQ pin enables real-time driver strength tuning to match PCB trace impedance - improves signal integrity without layout re-spin
Source-synchronous echo clocks (CQ/CQ) Eliminates need for per-device trace length matching in multi-SRAM systems - simplifies high-speed timing closure
Configurable read latency (DOFF) Hardware-selectable 1-cycle or 1.5-cycle latency allows optimization for either bandwidth (DDR-I) or timing margin (DDR-II)
JTAG 1149.1 test access port Enables in-system boundary scan verification of interconnects and solder joints - critical for high-reliability telecom hardware

Applications

Packet Buffering in Switch ASIC Interfaces Line Card Memory for Telecom Equipment

Use Scenario: High-throughput packet buffering between switch fabric and ingress/egress ports in 10G+ Ethernet line cards.

IC Role / Device Role / Timing Role: DDR-II SRAM serving as low-latency, burst-access buffer with deterministic 1.5-cycle read response under DOFF HIGH configuration.

Use Value: Two-word burst reduces address bus activity by half, enabling higher aggregate bandwidth without increasing pin count or clock frequency beyond 333 MHz.

Use Scenario: Shared memory pool for control-plane packet processing in carrier-grade SDH/SONET add-drop multiplexers.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM with echo clocks (CQ/CQ) providing source-synchronous data capture for FPGA-based traffic managers.

Use Value: CQ/CQ alignment eliminates flight-time skew across multiple SRAMs, removing need for per-device PCB trace length tuning.

Real-Time Video Frame Buffering Industrial PLC Data Logging Buffer

Use Scenario: Dual-port frame storage for HD video pipelines requiring simultaneous read/write with minimal latency jitter.

IC Role / Device Role / Timing Role: 2M × 36 DDR-II SRAM acting as burst-aligned frame buffer with configurable latency (DOFF pin) to match FPGA pixel clock domains.

Use Value: Variable drive HSTL outputs maintain signal integrity across wide temperature range (-40°C to +85°C), ensuring stable operation in uncooled enclosures.

Use Scenario: High-reliability cyclic data logging in industrial automation controllers with deterministic interrupt response.

IC Role / Device Role / Timing Role: Synchronous SRAM with JTAG 1149.1 boundary scan supporting field-upgradable firmware and post-deployment diagnostics.

Use Value: IEEE 1149.1 TAP enables in-circuit validation of memory bus interconnects after thermal cycling or mechanical shock events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C3256A-15JCIN Asynchronous 256K × 16 SRAM, 15 ns access, no DDR, no burst, no echo clocks Limited to low-frequency control-plane buffering; lacks source-synchronous timing for >200 MHz systems Select only when deterministic sub-15 ns latency is required and DDR bandwidth is unnecessary
IS61WV102432BLL-10BLI Synchronous 1M × 32 SRAM, 10 ns cycle time, single-data-rate, no PLL or echo clocks Supports 100 MHz max clock; no burst addressing or impedance calibration - lower peak bandwidth and less signal integrity control Choose for cost-sensitive industrial designs where 333 MHz DDR-II features are over-specified

Compared with AS7C3256A-15JCIN and IS61WV102432BLL-10BLI, CY7C1520KV18-333BZC delivers 2.2× higher effective bandwidth (666 MT/s vs ≤200 MT/s), integrated skew compensation via CQ/CQ, and programmable drive strength - making it uniquely suited for telecom and high-end embedded memory subsystems demanding both speed and signal integrity.

Availability

CY7C1520KV18-333BZC is available at Aetrix Electronics and suitable for packet buffering, telecom line card memory, real-time video frame storage, and industrial PLC data logging requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1520KV18-333BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1520KV18 belongs to Cypress's DDR-II synchronous SRAM product line, designed specifically for high-bandwidth, low-latency memory subsystems in networking infrastructure and real-time embedded systems where burst efficiency and signal integrity are critical.

FAQ

What is the function of the DOFF pin on CY7C1520KV18-333BZC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency; when LOW, it configures the device for DDR-I behavior with 1-cycle latency. This hardware-selectable feature allows system designers to trade off timing margin against throughput without firmware changes or clock tree modifications.

How does the ZQ pin calibrate output impedance?

The ZQ pin connects to an external precision resistor (RQ) tied to ground, enabling on-die calibration of HSTL output drivers to 0.2 × RQ. Alternatively, tying ZQ to VDDQ activates minimum-impedance mode. This eliminates manual PCB trace impedance tuning and maintains consistent signal rise/fall times across voltage and temperature variations.

Can CY7C1520KV18-333BZC operate without C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this configuration, read data is driven on rising edges of K/K instead of C/C, and echo clocks CQ/CQ are generated relative to K. However, dual-clock mode (C/C) is required to achieve full DDR-II timing benefits including flight-time deskewing.

What is the purpose of BWS[3:0] in CY7C1520KV18-333BZC?

BWS[3:0] are active-Low byte write select signals that independently enable writing to four 9-bit segments of the 36-bit data bus (D[8:0], D[17:9], D[26:18], D[35:27]). During a write cycle, only bytes with asserted BWS remain updated; others retain prior values - enabling efficient partial-word updates without read-modify-write overhead.

CY7C1520KV18-333BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1520KV18-333BZC FAQ

1.How can I place an order for CY7C1520KV18-333BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1520KV18-333BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1520KV18-333BZC reliable?

The price and inventory of CY7C1520KV18-333BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-333BZC is usually 5 days.

3.What payment methods are accepted for CY7C1520KV18-333BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-333BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1520KV18-333BZC?

CY7C1520KV18-333BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1520KV18-333BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1520KV18-333BZC?

For technical support, including CY7C1520KV18-333BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-333BZC requirements.

6.How does Aetrix verify that CY7C1520KV18-333BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1520KV18-333BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-333BZC meets industry standards.

7.What is the process for return or replacement of CY7C1520KV18-333BZC?

All CY7C1520KV18-333BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-333BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1520KV18-333BZC part is unused and in its original packaging.

Return procedure for CY7C1520KV18-333BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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