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Cypress Semiconductor Corp CY7C1520KV18-333BZI

Part No.:
CY7C1520KV18-333BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1520KV18-333BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:565

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Product details

Overview

CY7C1520KV18-333BZI from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 333 MHz with double-data-rate (666 MHz effective) I/O, 1.8 V core supply, HSTL-compatible interfaces, and echo clocks (CQ/CQ) for precise high-speed data capture in networking and telecom buffer applications.

For engineers reviewing the CY7C1520KV18-333BZI datasheet, CY7C1520KV18-333BZI pinout, CY7C1520KV18-333BZI application, or CY7C1520KV18-333BZI equivalent, key selection factors include burst-mode latency control via DOFF, dual-clock domain timing (K/K and C/C), programmable output impedance via ZQ, and JTAG 1149.1 test support for system-level validation.

Technical Context

The device implements a two-word synchronous burst architecture: address A0 drives an internal 1-bit burst counter that sequentially accesses two 36-bit words per transaction. All synchronous inputs (R/W, LD, BWS[3:0], A[20:0]) are registered on rising edges of K and K clocks, enabling precise setup/hold timing control.

Read data is driven on rising edges of C and C clocks (or K/K in single-clock mode), synchronized to echo clocks CQ/CQ referenced to C/C - eliminating board-level skew compensation. The integrated PLL ensures accurate data placement relative to output clocks, and self-timed write circuitry guarantees deterministic write completion independent of external timing margins.

Key Specifications

Parameter Value and Actual Design Meaning
Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 333 MHz - defines maximum sustained bandwidth of 2.39 Gbps (333 MHz × 36 bits × 2 transfers/cycle)
I/O Voltage 1.8 V core / 1.4–1.8 V HSTL I/O - supports interoperability with both 1.5 V and 1.8 V memory controllers
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing mode for latency-critical vs. throughput-optimized systems
Burst Length Fixed two-word burst - reduces address bus toggling frequency by 50% versus single-word access
Package 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch footprint optimized for high-density routing in telecom line cards
Output Impedance Control ZQ pin calibrates DQ/CQ output drivers to 0.2 × RQ (RQ to GND) - enables trace impedance matching without external termination resistors

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data I/O Shares physical pins for read/write; driven on C/C rising edges during reads, sampled on K/K rising edges during writes
K, K Positive/negative input clocks Capture all synchronous inputs (address, R/W, LD, BWS); define initiation edge for all transactions
C, C Positive/negative output data clocks Source-synchronous clocking for read data; used with CQ/CQ to deskew flight time across multiple devices
CQ, CQ Echo clocks Free-running, phase-aligned copies of C/C - enable controller to latch Q[35:0] with zero setup/hold margin
DOFF Latency mode control HIGH selects DDR-II 1.5-cycle read latency; LOW selects DDR-I 1-cycle latency - configurable per system timing budget
ZQ Output impedance calibration input Connects to external resistor to ground; sets DQ/CQ driver strength to match PCB trace impedance (typically 50 Ω)
LD Load strobe Active-low signal indicating valid address/R/W setup; initiates burst sequence on next K/K edge
BWS[3:0] Byte write select Four active-low signals controlling 9-bit byte lanes (BWS0–BWS3 each mask 9 bits of DQ[35:0])

Key Features

Feature Design Value
Two-word burst architecture Halves required address bus transitions per 72-bit transfer - reduces controller pin count and routing complexity
Programmable read latency (1 or 1.5 cycles) Enables trade-off between minimum latency (DOFF = LOW) and jitter tolerance (DOFF = HIGH) without hardware change
Integrated ZQ impedance calibration Eliminates need for discrete series termination resistors on DQ/CQ lines - saves PCB area and improves signal integrity
JTAG 1149.1 boundary scan Supports IEEE-compliant structural testing and in-system debug - critical for high-reliability telecom and industrial designs
PLL-based output clock alignment Ensures <±50 ps skew between CQ and Q[35:0] edges - enables reliable >600 Mbps DDR operation at PCB level

Applications

Packet Buffer in 10G Ethernet Switch ASIC Line Card Memory for OTN Transport Equipment

Use Scenario: Temporary storage of variable-length Ethernet frames between ingress and egress ports in multi-layer switching fabric.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency burst SRAM serving as frame buffer with deterministic 1-cycle read access under DOFF = LOW.

Use Value: Two-word burst mode delivers 72-bit payload per cycle at 333 MHz, matching ASIC datapath width while minimizing address bus congestion.

Use Scenario: Storing overhead bytes and forward error correction (FEC) data in optical transport network (OTN) framer ICs.

IC Role / Device Role / Timing Role: Synchronous pipelined memory with echo clocks (CQ/CQ) ensuring precise data capture at 666 Mbps DDR rate.

Use Value: ZQ-calibrated outputs maintain signal integrity across 10+ inch backplane traces, reducing bit error rate in 40G/100G line cards.

Baseband Processing Buffer in 4G LTE eNodeB Real-Time Video Frame Store in Broadcast Encoder

Use Scenario: Intermediate storage of IQ samples between digital down-converter (DDC) and channel estimator in LTE base station radio units.

IC Role / Device Role / Timing Role: DDR-II SRAM with 1.5-cycle latency (DOFF = HIGH) providing jitter-resistant read timing for RF processing pipelines.

Use Value: Dual K/K and C/C clock domains isolate baseband controller timing from RF subsystem noise, improving EVM performance.

Use Scenario: Holding uncompressed YUV422 video frames during real-time compression in broadcast-grade SDI encoders.

IC Role / Device Role / Timing Role: 2M × 36 organization maps directly to 1920×1080@60Hz 16-bit pixel buffers with minimal address decoding logic.

Use Value: 165-ball FBGA package allows dense placement adjacent to FPGA video processors, minimizing interconnect delay and crosstalk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61VPS51236A-333BQI 512-Mbit density (16M × 36), 333 MHz, but uses QDR-II interface with separate read/write ports and no echo clocks Requires separate address/control paths for read/write; lacks ZQ calibration and CQ/CQ timing simplification Select when simultaneous read/write bandwidth >72 Mbit/s is required and controller supports QDR protocol
MT47H64M16HR-37E:H DDR2 SDRAM (1 Gbit, 64M × 16), 375 MHz, but asynchronous refresh, higher latency, and no burst counter Needs external refresh controller; unsuitable for deterministic low-latency buffering without complex scheduling Select only for cost-sensitive applications where latency >10 ns and refresh overhead are acceptable

Compared with IS61VPS51236A-333BQI and MT47H64M16HR-37E:H, CY7C1520KV18-333BZI provides guaranteed 1-cycle read latency, integrated echo clocks for simplified capture, and ZQ impedance tuning - making it uniquely suited for deterministic, high-speed packet buffering where timing predictability outweighs raw density.

Availability

CY7C1520KV18-333BZI is available at Aetrix Electronics and suitable for 10G Ethernet switch buffers, OTN transport line cards, LTE baseband processing, and broadcast video encoding requiring stable component supply, long-lifecycle support, and consistent parametric performance across temperature and voltage.

Supply support for CY7C1520KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and timing precision.

CY7C1520KV18 belongs to Cypress's DDR-II Burst SRAM product line, engineered specifically for deterministic, low-latency buffering in high-speed serial data infrastructure where echo-clock synchronization and programmable latency are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1520KV18-333BZI?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency for improved jitter tolerance; when LOW, it selects DDR-I mode with 1-cycle latency for minimum access delay. This setting is sampled synchronously on the K clock and remains latched until power-on reset or mode change.

How does ZQ calibration work on CY7C1520KV18-333BZI?

ZQ calibration adjusts the output driver strength of DQ[35:0] and CQ/CQ pins to match the system's data bus impedance. A precision resistor (RQ) is connected between ZQ and ground; the device measures RQ and sets output impedance to 0.2 × RQ. If ZQ is tied to VDDQ, minimum impedance mode activates - no external resistor required, but less precise matching.

Can CY7C1520KV18-333BZI operate in single-clock mode?

Yes. When C and C are not driven, the device uses K and K as both input and output clocks. In this mode, read data is driven on K/K rising edges, and CQ/CQ are generated relative to K/K instead of C/C. All timing parameters shift accordingly, and maximum frequency may be reduced due to combined clock path constraints.

What is the purpose of the BWS[3:0] signals?

BWS[3:0] (Byte Write Select) are active-low signals that enable selective writing of 9-bit byte lanes within the 36-bit DQ bus. BWS0 controls DQ[8:0], BWS1 controls DQ[17:9], BWS2 controls DQ[26:18], and BWS3 controls DQ[35:27]. Unselected bytes retain their prior values, supporting partial-word updates without read-modify-write cycles.

CY7C1520KV18-333BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1520KV18-333BZI FAQ

1.How can I place an order for CY7C1520KV18-333BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1520KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1520KV18-333BZI reliable?

The price and inventory of CY7C1520KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-333BZI is usually 5 days.

3.What payment methods are accepted for CY7C1520KV18-333BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-333BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1520KV18-333BZI?

CY7C1520KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1520KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1520KV18-333BZI?

For technical support, including CY7C1520KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-333BZI requirements.

6.How does Aetrix verify that CY7C1520KV18-333BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1520KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-333BZI meets industry standards.

7.What is the process for return or replacement of CY7C1520KV18-333BZI?

All CY7C1520KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-333BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1520KV18-333BZI part is unused and in its original packaging.

Return procedure for CY7C1520KV18-333BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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