Cypress Semiconductor Corp CY7C1520V18-167BZXC
- Part No.:
- CY7C1520V18-167BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1520V18-167BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1520V18 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined DDR-II SRAM with 1.8V core supply, 300 MHz clock support, and dual-edge DDR data transfer at 600 Mbps per pin. It implements 2-word burst architecture with echo clocks (CQ/CQ), DLL-based timing alignment, and HSTL I/O for high-speed networking and packet buffering applications.
For engineers reviewing the CY7C1520V18 datasheet, CY7C1520V18 pinout, CY7C1520V18 application, or CY7C1520V18 equivalent, key selection criteria include its 2M × 36 organization, 167 MHz maximum operating frequency variant, 165-ball FBGA package, burst-aligned read/write timing, and JTAG 1149.1 test access port compliance.
Technical Context
This SRAM uses a synchronous pipelined architecture with two independent input clock domains (K/K for address/control/data capture) and two output clock domains (C/C for data/echo clock generation). The internal burst counter accepts A0 as LSB to sequence two 36-bit words per access.
All synchronous inputs-including R/W, LD, BWS[3:0], and DQ[35:0]-are registered on rising edges of K/K; all outputs-including Q[35:0], CQ, and CQ-are edge-aligned to C/C (or K/K in single-clock mode). The DLL ensures precise data-eye placement relative to echo clocks, and ZQ enables dynamic output impedance calibration against system bus termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2M × 36 bits (72 Mbit total); supports burst-2 sequential access of two full 36-bit words per cycle |
| Maximum Clock Frequency | 167 MHz (K/K input); defines minimum 5.99 ns clock period for reliable 2-word burst timing |
| Data Rate | 334 MT/s effective (DDR: 167 MHz × 2 transitions/cycle); delivers 12.024 GB/s aggregate bandwidth across 36 pins |
| Core Supply Voltage | 1.8 V ± 0.1 V; powers SRAM array and internal logic; requires low-noise regulation for timing stability |
| I/O Interface Standard | HSTL Class I (1.5 V reference); supports 1.4–1.8 V output swing with programmable drive strength via ZQ calibration |
| Package | 165-ball FBGA (15 mm × 17 mm × 1.4 mm); ball pitch 0.8 mm; includes dedicated VDDQ, VSS, and impedance-matching ZQ pins |
| JTAG Support | IEEE 1149.1 compliant TAP controller (TCK/TMS/TDI/TDO); enables boundary-scan testing and in-system debug |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant. Package supports high-density routing and thermal dissipation for sustained DDR operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data I/O | 36-bit DDR data bus; latched on K/K rising edges during write; driven on C/C rising edges during read; tri-stated when deselected |
| BWS[3:0] | Byte Write Select (active LOW) | Four independent byte masks controlling D[8:0], D[17:9], D[26:18], D[35:27]; enables partial writes without read-modify-write |
| A[20:1], A0 | Synchronous address inputs | 21 address lines; A0 feeds internal burst counter to generate second 36-bit word address; no external A21 required |
| K, K | Positive/negative input clocks | Differential pair for capturing all synchronous inputs (address, control, data); defines burst initiation and write registration timing |
| C, C | Positive/negative output clocks | Differential pair driving Q[35:0] and echo clocks; enables board-level deskew of flight time mismatches across multiple devices |
| CQ, CQ | Output echo clocks | Free-running copies of C/C, phase-aligned to Q[35:0] edges; simplify receiver capture without complex delay tuning |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to GND; calibrates output driver impedance to 0.2 × RQ = 48 Ω for HSTL bus matching |
| LD | Load strobe | Active-LOW signal qualifying address and R/W setup; initiates burst transaction on next K edge; enables pipelined command flow |
Key Features
| Feature | Design Value |
|---|---|
| 2-Word Burst Architecture | Reduces address bus toggling by 50% versus single-word access; cuts control overhead in high-throughput packet buffers |
| Delay Lock Loop (DLL) | Aligns internal data launch to echo clock edges within ±50 ps; eliminates need for PCB trace length matching in multi-SRAM systems |
| Variable Drive HSTL Outputs | Four drive strength levels selectable via ZQ calibration; maintains signal integrity across varying trace lengths and loads |
| Expanded HSTL Output Range | 1.4 V to VDD (1.8 V) swing; accommodates tighter noise margins in dense backplane or switch fabric layouts |
| JTAG 1149.1 Test Access | Full boundary-scan capability on all I/O and power pins; enables automated manufacturing test and field diagnostics |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G line interface modules. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between SerDes PHY and traffic manager ASIC. Use Value: 2M × 36 organization matches typical packet descriptor + payload chunk size; 167 MHz DDR timing meets SONET/OTN frame alignment constraints. |
Use Scenario: Temporary storage of fragmented IP packets in enterprise core switches before reassembly or forwarding. IC Role / Device Role / Timing Role: Synchronous burst-access memory interfaced to multi-port switch fabric controller. Use Value: Echo clocks (CQ/CQ) eliminate per-device skew compensation; DLL ensures deterministic read latency across temperature range. |
| High-Speed Test Equipment | Radar Signal Processing |
|
Use Scenario: Capturing and replaying high-speed digital stimulus patterns in ATE systems with >1 Gbps vector rates. IC Role / Device Role / Timing Role: Dual-port-like burst buffer synchronized to pattern generator clock domain. Use Value: 36-bit width supports parallel 4-byte instruction/data fetch; HSTL I/O sustains clean edges at 334 MT/s under heavy capacitive load. |
Use Scenario: Real-time buffering of digitized IF samples from phased-array radar receivers prior to FFT processing. IC Role / Device Role / Timing Role: Low-jitter, pipeline-friendly memory staging raw ADC data streams. Use Value: Synchronous self-timed writes guarantee consistent write latency; ZQ calibration maintains SNR over wide temperature swings (−40°C to +85°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1518V18 | 4M × 18 organization (72 Mbit), same 165-BGA package, identical timing and I/O specs | Requires wider data bus (18-bit × 2 channels) instead of 36-bit single channel; suits dual-lane interconnects | Select when system layout favors two 18-bit buses over one 36-bit bus; pin-compatible but address mapping differs |
| IS61WV102436BLL | 1M × 36 QDR-II+ SRAM, 350 MHz interface, 1.8 V core, 165-BGA; no DLL or echo clocks | Lacks CQ/CQ and DLL; relies on external timing margining; higher peak bandwidth but less timing robustness | Choose for cost-sensitive designs where board-level deskew is feasible; not drop-in due to QDR-II+ protocol differences |
Compared with CY7C1518V18, CY7C1520V18 offers denser single-channel data path and simplified routing; versus IS61WV102436BLL, it trades peak speed for guaranteed timing closure via DLL and echo clocks-critical in thermally variable telecom environments.
Availability
CY7C1520V18 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, high-speed test equipment, and radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1520V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.
CY7C1520V18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, low-latency buffering in multi-gigabit serial infrastructure where echo-clock synchronization and DLL-assisted timing closure are mandatory.
FAQ
What is the function of the ZQ pin on CY7C1520V18?
The ZQ pin enables dynamic output impedance calibration. When connected to a 240 Ω resistor to ground, it sets the HSTL output driver impedance to 48 Ω (0.2 × 240 Ω), ensuring optimal signal integrity on matched-impedance transmission lines. Direct connection to VDDQ enables minimum-impedance mode; floating or grounding ZQ is prohibited.
Does CY7C1520V18 support single-clock operation?
Yes. When only K and K are supplied and C/C are left unconnected, the device defaults to single-clock mode: read data and echo clocks are driven relative to K/K edges instead of C/C. All timing parameters shift accordingly, and DLL remains active to align internal data launch to K/K.
How does the burst counter operate in CY7C1520V18?
The burst counter uses A0 as its least significant bit and increments linearly to generate the second 36-bit word address. For each LD assertion, the device reads/writes two consecutive 36-bit locations: one at the externally provided address and the next at address+1, eliminating need for external address sequencing logic.
Can CY7C1520V18 be used without enabling the DLL?
Yes-asserting DOFF LOW disables the DLL. However, AC timing parameters change significantly: data-to-CQ skew increases, and setup/hold margins shrink. Cypress specifies separate timing tables for DLL-on and DLL-off modes; disabling DLL is recommended only for prototyping or legacy system compatibility where timing裕度 exists.
CY7C1520V18-167BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1520V18-167BZXC FAQ
1.How can I place an order for CY7C1520V18-167BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1520V18-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1520V18-167BZXC reliable?
The price and inventory of CY7C1520V18-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520V18-167BZXC is usually 5 days.
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Once your CY7C1520V18-167BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1520V18-167BZXC?
For technical support, including CY7C1520V18-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520V18-167BZXC requirements.
6.How does Aetrix verify that CY7C1520V18-167BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1520V18-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520V18-167BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1520V18-167BZXC?
All CY7C1520V18-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520V18-167BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1520V18-167BZXC part is unused and in its original packaging.
Return procedure for CY7C1520V18-167BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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