Cypress Semiconductor Corp CY7C1521KV18-250BZXC
- Part No.:
- CY7C1521KV18-250BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1521KV18-250BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,432
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1521KV18-250BZXC from Cypress Semiconductor is a 72-Mbit (2M × 36) DDR II synchronous pipelined SRAM with four-word burst architecture, 250 MHz input clock, double-data-rate I/O at 500 MHz, and 1.8 V core supply with HSTL I/O. It supports programmable impedance matching via ZQ, echo clocks (CQ/CQ) for timing-critical data capture, and configurable read latency (1-cycle DDR-I or 1.5-cycle DDR-II) via DOFF pin. Used in high-bandwidth packet buffering and network switch fabric memory subsystems.
For engineers reviewing the CY7C1521KV18-250BZXC datasheet, CY7C1521KV18-250BZXC pinout, CY7C1521KV18-250BZXC application, or CY7C1521KV18-250BZXC equivalent, key selection criteria include DDR-II burst timing compliance, HSTL-18 I/O voltage tolerance (1.4–1.8 V), PLL-enabled data placement accuracy, and FBGA-165 mechanical compatibility with high-density routing constraints.
Technical Context
The device implements a synchronous pipelined architecture with dual-clock domain separation: K/K clocks control address and command registration, while C/C clocks govern output data timing. Internal burst logic uses A[1:0] to generate four sequential 36-bit words without external address incrementing.
Read latency is dynamically selectable: 1 cycle (DDR-I mode) when DOFF = LOW, or 1.5 cycles (DDR-II mode) when DOFF = HIGH. Echo clocks CQ/CQ are phase-aligned to C/C and referenced to device outputs, enabling controller-side deskew without per-device delay calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (2M × 36) - supports 36-bit wide data paths in telecom and networking ASIC interfaces. |
| Max Clock Frequency | 250 MHz (K/K) - enables 500 MT/s effective throughput with DDR I/O. |
| Read Latency | 1.5 cycles (DDR-II, DOFF = HIGH) or 1 cycle (DDR-I, DOFF = LOW) - determines minimum access interval in burst sequences. |
| I/O Voltage Range | 1.4 V to VDDQ (1.8 V) - compatible with both 1.5 V and 1.8 V HSTL-18 systems without level-shifting. |
| Output Drive | Variable HSTL output buffers - allows impedance tuning via ZQ pin to match 50 Ω PCB traces. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - supports fine-pitch routing and thermal dissipation in multi-SRAM stacks. |
| Core Supply | 1.8 V ± 0.1 V (VDD) - low-voltage operation reduces dynamic power in high-frequency memory subsystems. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR I/O pins; sampled on K/K rising edges during writes, driven on C/C rising edges during reads; tristated automatically when deselected. |
| K, K | Positive/negative input clocks | Rising edges latch all synchronous inputs (address, R/W, LD, BWS); define initiation of all transactions. |
| C, C | Positive/negative output data clocks | Control timing of Q[35:0] output edges; used with CQ/CQ for flight-time deskew across multiple SRAMs. |
| CQ, CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify controller-side data capture by eliminating board trace skew compensation. |
| DOFF | PLL disable control | Active-low pin that switches device between DDR-II (1.5-cycle latency, 250 MHz max) and DDR-I (1-cycle latency, 167 MHz max) modes. |
| ZQ | Impedance calibration reference | Connects to external resistor to ground (RQ); sets output driver impedance to 0.2 × RQ for precise 50 Ω termination matching. |
Key Features
| Feature | Design Value |
|---|---|
| Four-word burst architecture | Reduces external address bus toggling frequency by 4× versus single-word access, lowering EMI and routing complexity. |
| Programmable read latency | DOFF pin selects between 1-cycle (DDR-I) and 1.5-cycle (DDR-II) latency, enabling interoperability with legacy and next-gen controllers. |
| HSTL-18 I/O with variable drive | Supports 1.4–1.8 V VDDQ range and on-die impedance tuning via ZQ, eliminating need for external termination resistors. |
| JTAG 1149.1 test port | Enables boundary scan testing and in-system programming without requiring dedicated test pads or additional debug hardware. |
| PLL-based data placement | Internal phase-locked loop ensures accurate alignment of output data edges to C/C clocks, critical for >400 MT/s signal integrity. |
Applications
| Network Switch Buffer Memory | Telecom Line Card Packet FIFO |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-port Ethernet switches operating at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: High-throughput burst-access buffer providing deterministic 36-bit-wide data transfers synchronized to switch fabric clock domains. Use Value: Four-word burst + DDR-II timing delivers 500 MT/s bandwidth with minimal address bus activity, reducing PCB layer count and signal integrity risk. |
Use Scenario: Temporary storage of ATM or IP packets in OC-192/STM-64 line cards before classification and forwarding. IC Role / Device Role / Timing Role: Synchronous pipeline memory interfacing directly to SerDes PHYs and traffic management ASICs using HSTL-18 signaling. Use Value: Programmable DOFF pin allows seamless migration from DDR-I to DDR-II timing as controller silicon evolves, extending BOM life. |
| Baseband Processor Cache | Radar Signal Processing Buffer |
|
Use Scenario: L2 cache extension for multicore baseband processors in 4G/LTE femtocells handling real-time channel estimation and modulation. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM acting as shared memory between DSP cores and DMA engines. Use Value: 1.5-cycle DDR-II read latency minimizes pipeline stalls during burst-intensive FFT and convolution operations. |
Use Scenario: Real-time buffering of digitized RF samples in phased-array radar receivers prior to beamforming and Doppler processing. IC Role / Device Role / Timing Role: High-reliability, temperature-stable memory supporting deterministic read/write timing under rapid thermal cycling. Use Value: Echo clocks CQ/CQ eliminate inter-SRAM skew in multi-chip memory banks, ensuring coherent sample alignment across ADC channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102436B | 1024K × 36, 200 MHz max clock, no PLL, fixed 1-cycle latency, 3.3 V tolerant I/O | Limited to lower-speed legacy systems; lacks echo clocks and ZQ calibration | Select only if DDR-II timing and impedance tuning are unnecessary and 3.3 V interface compatibility is required. |
| Microchip SSTL28V160D | 16 Mbit (512K × 32), 166 MHz, LVDS I/O, no burst counter, asynchronous reset support | Smaller density, different I/O standard, no DDR-II mode or DOFF configurability | Consider only for space-constrained designs where 32-bit width and LVDS signaling outweigh bandwidth and latency requirements. |
Compared with IS61WV102436B and SSTL28V160D, CY7C1521KV18-250BZXC provides higher bandwidth (500 MT/s vs ≤332 MT/s), configurable latency, and system-level timing simplification via echo clocks-critical for multi-SRAM synchronization in high-speed infrastructure.
Availability
CY7C1521KV18-250BZXC is available at Aetrix Electronics and suitable for network switch buffer memory, telecom line card packet FIFO, and baseband processor cache applications requiring stable component supply, long-lifecycle support, and guaranteed FBGA-165 mechanical compatibility.
Supply support for CY7C1521KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
CY7C1521KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in telecom infrastructure, enterprise switching, and real-time signal processing systems.
FAQ
What is the function of the DOFF pin?
The DOFF pin is an active-low control that disables the internal PLL. When asserted LOW, the device operates in DDR-I mode with 1-cycle read latency and a maximum clock frequency of 167 MHz. When HIGH, it enables DDR-II mode with 1.5-cycle latency and full 250 MHz operation. Pull-up resistor (≤10 kΩ to VDDQ) is required for normal DDR-II use.
How does ZQ pin calibration work?
The ZQ pin connects to an external precision resistor (typically 240 Ω) to ground. The device measures this resistance and configures its output drivers to deliver 0.2 × RQ (e.g., 48 Ω) output impedance. This matches standard 50 Ω PCB traces and eliminates need for external series termination resistors on DQ lines.
Can C and C be omitted in system design?
Yes. When C/C are not provided, the device defaults to single-clock mode using K/K for both input and output timing. In this mode, read data is driven on K/K rising edges, and CQ/CQ are generated relative to K/K. However, echo clock functionality and flight-time deskew capability are lost, limiting maximum reliable data rate.
What is the role of BWS[3:0] signals?
BWS[3:0] are active-low byte write select signals that enable partial-word writes. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Only bytes with corresponding BWS asserted LOW are written; others retain prior values. All BWS are sampled synchronously on K/K rising edges.
CY7C1521KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1521KV18-250BZXC FAQ
1.How can I place an order for CY7C1521KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1521KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1521KV18-250BZXC reliable?
The price and inventory of CY7C1521KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1521KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1521KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1521KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1521KV18-250BZXC?
CY7C1521KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1521KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1521KV18-250BZXC?
For technical support, including CY7C1521KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1521KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1521KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1521KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1521KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1521KV18-250BZXC?
All CY7C1521KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1521KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1521KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1521KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1521KV18-250BZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

