Cypress Semiconductor Corp CY7C1523KV18-250BZXC
- Part No.:
- CY7C1523KV18-250BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1523KV18-250BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1523KV18-250BZXC from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR II Synchronous Pipelined SRAM with Separate I/O architecture, operating at 250 MHz clock frequency and delivering 500 MHz double-data-rate throughput. It features two-word burst reads/writes, echo clocks (CQ/CQ), programmable impedance via ZQ, and dual input/output clock domains (K/K and C/C) for precise timing control in high-speed memory subsystems used in network packet buffers and FPGA co-processor caches.
For engineers reviewing the CY7C1523KV18-250BZXC datasheet, CY7C1523KV18-250BZXC pinout, CY7C1523KV18-250BZXC application, or CY7C1523KV18-250BZXC equivalent, key selection criteria include DDR II SIO timing compliance, 1.8 V core/1.5–1.8 V I/O flexibility, DOFF-controlled latency mode switching (1-cycle vs. 1.5-cycle read), HSTL-compatible drive strength, and JTAG 1149.1 test access support.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a common 21-bit address bus. Read and write addresses are latched on alternate rising edges of K/K, enabling continuous burst operation without bus turnaround. Internal self-timed write circuitry eliminates external write pulse timing constraints.
DDR II SIO operation relies on matched output clocks (C/C) and echo clocks (CQ/CQ) to deskew data capture across multiple devices. The PLL enables accurate data placement when DOFF is HIGH; disabling it via DOFF LOW reverts behavior to DDR-I mode with 1-cycle latency and ≤167 MHz max frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (4M × 18), supporting 18-bit parallel data paths without multiplexing |
| Max Clock Frequency | 250 MHz K/K input clock - defines system bandwidth ceiling and cycle time (4 ns) |
| Data Rate | 500 MHz DDR - doubles effective throughput versus single-data-rate at same clock |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - directly impacts pipeline depth and controller timing margin |
| Supply Voltages | 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - supports mixed-voltage board designs with HSTL compatibility |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch footprint optimized for high-density routing and signal integrity |
| Impedance Control | ZQ pin calibrates output drivers to 0.2 × RQ (RQ to GND) - ensures consistent trace termination matching |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous data input | Latched on both rising edges of K/K during write - enables two-word burst writes per address cycle |
| Q[17:0] | Synchronous data output | Driven on rising edges of C/C (or K/K in single-clock mode) - synchronized to echo clocks for clean capture |
| K, K | Input clock pair | Rising edges latch all synchronous inputs (address, R/W, LD, BWS) - defines fundamental timing reference |
| C, C | Output clock pair | Control Q[17:0] timing and enable flight-time deskewing across multiple SRAMs on same bus |
| CQ, CQ | Echo clock outputs | Free-running copies of C/C - simplify receiver-side data capture by eliminating clock-to-data skew |
| DOFF | PLL disable control | Active LOW - selects DDR-I mode (1-cycle latency, ≤167 MHz) or DDR-II mode (1.5-cycle latency, 250 MHz) |
| ZQ | Impedance calibration input | Connects to external resistor to ground - sets output driver strength to match PCB trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling by 50% per transaction - lowers EMI and simplifies controller address sequencing |
| Separate I/O (SIO) interface | Eliminates bidirectional bus turnaround delays - enables concurrent read/write port access with no direction control overhead |
| Programmable output drive strength | HSTL-compatible variable drive via ZQ calibration - maintains signal integrity across varying trace lengths and loads |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system programming - supports production test and debug without physical probe access |
| Single/dual clock domain operation | Flexible C/C or K/K output clocking - allows system-level timing optimization for controller clock tree topology |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: High-throughput line cards buffering variable-length Ethernet frames before classification and forwarding. IC Role / Device Role / Timing Role: Dedicated burst-access SRAM providing low-latency, deterministic read/write for packet header inspection and metadata tagging. Use Value: Two-word burst + DDR II SIO delivers 500 Mbps sustained bandwidth per 18-bit port - matches 10Gbps+ PHY data rates without controller stalls. |
Use Scenario: Off-chip cache for Xilinx or Intel FPGA-based vision processing pipelines requiring rapid access to intermediate frame buffers. IC Role / Device Role / Timing Role: Synchronous pipelined memory acting as low-latency scratchpad between FPGA fabric and external DDR3/4 controllers. Use Value: 1.5-cycle DDR-II read latency and echo clocks (CQ/CQ) reduce FPGA I/O timing closure effort - enables >200 MHz controller clock domain alignment. |
| Telecom Baseband Processing | Industrial Real-Time Controller |
|
Use Scenario: LTE/5G baseband units performing channel estimation and precoding with strict deterministic memory access deadlines. IC Role / Device Role / Timing Role: Deterministic-latency SRAM serving as coefficient storage and FFT result buffer in multi-core DSP clusters. Use Value: DOFF-selectable latency modes allow runtime trade-off between bandwidth (250 MHz DDR-II) and timing margin (167 MHz DDR-I) - adapts to thermal throttling events. |
Use Scenario: PLC motion control modules executing servo loop updates at 10 kHz with jitter < 100 ns, requiring guaranteed memory response. IC Role / Device Role / Timing Role: Synchronous SRAM providing jitter-free data exchange between ARM Cortex-R real-time cores and FPGA-accelerated I/O engines. Use Value: Self-timed writes and fixed 1.5-cycle read latency eliminate software wait-state insertion - ensures worst-case access bounded to 6 ns (250 MHz). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-15JIN | 256-Kbit (32K × 8), 15 ns async access, 3.3 V only, no DDR or burst | Lower density, simpler interface - suitable for legacy microcontroller boot RAM or small FIFOs | Select only if bandwidth < 100 MB/s and DDR timing not required |
| IS61WV102418BLL-10BLI | 18-Mbit (512K × 36), 10 ns async, 3.3/2.5 V, no echo clocks or ZQ | Higher word width but lower density and no DDR - fits wide-bus, low-latency non-burst systems | Choose when 36-bit parallel interface needed and clock synchronization not critical |
Compared with AS7C3256B-15JIN and IS61WV102418BLL-10BLI, CY7C1523KV18-250BZXC uniquely delivers 72-Mbit density with DDR-II SIO, echo clocks, and programmable impedance - making it irreplaceable for systems demanding >400 MB/s sustained throughput with sub-6 ns deterministic latency.
Availability
CY7C1523KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor caches, telecom baseband processing, and industrial real-time controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1523KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure markets.
The CY7C1523KV18 belongs to Cypress's DDR II SIO SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in FPGA- and ASIC-based systems where bus turnaround overhead and clock skew must be eliminated.
FAQ
What is the function of the DOFF pin?
The DOFF pin controls internal PLL operation: when asserted HIGH, the device operates in DDR-II mode with 1.5-cycle read latency and 250 MHz maximum frequency; when asserted LOW, the PLL is disabled and the device reverts to DDR-I timing with 1-cycle latency and ≤167 MHz operation. Pull-up resistor (≤10 kΩ to VDDQ) is required for normal DDR-II use.
How does the ZQ pin affect output drive strength?
ZQ connects to an external resistor (RQ) tied to ground, enabling on-die calibration of HSTL output drivers to 0.2 × RQ. This matches output impedance to PCB trace impedance (typically 50 Ω), minimizing reflections and improving signal integrity. Connecting ZQ directly to VDDQ enables minimum impedance mode; floating or grounding ZQ is prohibited.
Can C and C clocks be omitted in system design?
Yes - when C and C are not provided, the device uses K and K as output clocks (single-clock mode). In this configuration, Q[17:0] data is driven on rising edges of K/K, and CQ/CQ are generated relative to K/K. Echo clock functionality remains active, but deskewing capability across multiple devices is reduced compared to dual-clock operation.
What is the role of BWS0 and BWS1 in byte write operations?
BWS0 and BWS1 are active-LOW byte write select signals that control which 9-bit segments of D[17:0] are written: BWS0 enables D[8:0], BWS1 enables D[17:9]. Both must be LOW to write full 18-bit words; asserting either HIGH preserves corresponding byte contents during partial writes - essential for efficient metadata updates without full-word overwrites.
CY7C1523KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1523KV18-250BZXC FAQ
1.How can I place an order for CY7C1523KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1523KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1523KV18-250BZXC reliable?
The price and inventory of CY7C1523KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1523KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1523KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1523KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1523KV18-250BZXC?
CY7C1523KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1523KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1523KV18-250BZXC?
For technical support, including CY7C1523KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1523KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1523KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1523KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1523KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1523KV18-250BZXC?
All CY7C1523KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1523KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1523KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1523KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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