Cypress Semiconductor Corp CY7C1525JV18-250BZC
- Part No.:
- CY7C1525JV18-250BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1525JV18-250BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1525JV18 from Cypress Semiconductor is an 8M × 9 (72-Mbit) QDR® II SRAM with separate read/write ports, 267 MHz operation, DDR interfaces on both ports (534 Mbps effective data rate), and 1.5-cycle read latency with DLL enabled. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1525JV18 datasheet, CY7C1525JV18 pinout, CY7C1525JV18 application, or CY7C1525JV18 equivalent, key selection criteria include its dual-clock DDR timing architecture, HSTL I/O compliance, 165-ball FBGA package, and support for depth expansion via RPS/WPS control - all critical for deterministic low-latency buffer design.
Technical Context
The CY7C1525JV18 implements a synchronous pipelined QDR II architecture with physically independent read and write data paths, eliminating bus turnaround overhead. Its dual-input clock system (K/K for address/control/data capture; C/C for output timing) enables precise skew management across high-speed PCB traces.
It uses echo clocks (CQ/CQ) referenced to C/C for source-synchronous data capture at the controller, and supports DLL-enabled 1.5-cycle read latency or DLL-off QDR I mode (1-cycle latency, ≤167 MHz). Address inputs are multiplexed and latched on alternating K-clock edges for read/write port separation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (8M × 9 organization) |
| Max Clock Frequency | 267 MHz - sets maximum sustained bandwidth of 534 MB/s per port |
| Data Interface | Double Data Rate (DDR) on both read and write ports - transfers two 9-bit words per K-cycle |
| Read Latency | 1.5 cycles (DLL enabled) or 1 cycle (DLL disabled via DOFF pin) - directly impacts pipeline depth in real-time systems |
| Supply Voltages | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V - enables low-power, noise-resilient HSTL-18 signaling |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - supports high-density routing and thermal dissipation in multi-layer telecom PCBs |
| JTAG Support | IEEE 1149.1-compliant TAP - enables boundary-scan testing without external test fixtures |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data input | 9-bit parallel data sampled on rising edge of K clock; drives internal write register during WPS assertion |
| Q[8:0] | Synchronous read data output | 9-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS is deasserted |
| RPS | Read port select (active LOW) | Enables read burst initiation on next K rising edge; controls Q[8:0] output enable and tri-state behavior |
| WPS | Write port select (active LOW) | Enables write operation on next K rising edge; gates D[8:0] into write path and activates BWS0 |
| BWS0 | Byte write select (active LOW) | Controls write enable for full 9-bit D[8:0] word; ignored if WPS is inactive |
| K / K | Positive/negative input clocks | Edge-aligned differential pair capturing all synchronous inputs (address, RPS, WPS, D[8:0]) on rising K edge |
| C / C | Positive/negative output clocks | Edge-aligned differential pair controlling Q[8:0] output timing and enabling flight-time deskew across multiple devices |
| CQ / CQ | Echo clocks referenced to C/C | Free-running source-synchronous clocks for controller-side data capture; aligned to C/C with minimal jitter |
| DOFF | DLL disable control (active LOW) | Switches device from QDR II (1.5-cycle latency, 267 MHz) to QDR I mode (1-cycle latency, ≤167 MHz) |
| ZQ | Output impedance calibration input | Connects to external 240 Ω resistor to ground to tune Q[8:0]/CQ/CQ drive strength to match 50 Ω trace impedance |
| VDDQ | I/O power supply | Supplies 1.4–1.8 V to output drivers and input receivers; decoupling required per HSTL-18 spec |
| VDD | Core power supply | Supplies 1.8 V ±0.1 V to memory array and logic; requires tight regulation for timing stability |
| VREF | HSTL reference voltage | Static 0.75 V reference for input threshold and AC measurement; must be stable within ±1% for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables true concurrent read+write operations without bus contention or turnaround cycles - essential for full-duplex packet buffering |
| 2-word burst architecture | Delivers two 9-bit words per access cycle - matches typical ATM/POS cell or Ethernet frame segment size for efficient data packing |
| Variable-drive HSTL outputs | Supports programmable drive strength via ZQ calibration - maintains signal integrity across varying trace lengths and loads in backplane designs |
| Delay Lock Loop (DLL) | Aligns internal data launch to C/C clock edges with sub-100 ps jitter - ensures setup/hold margin at 534 Mbps DDR rates |
| JTAG 1149.1 test access | Enables in-system boundary-scan validation of interconnects to FPGA/ASIC controllers - reduces test time and fixture cost |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress IP packets in multi-gigabit routers before classification, queuing, or forwarding. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a zero-wait-state, deterministic latency buffer between SERDES and traffic manager ASIC. Use Value: Concurrent read/write eliminates arbitration delay; 267 MHz DDR interface sustains ≥534 MB/s throughput per port for 10Gbps+ line rates. | Use Scenario: Holding voice-over-IP (VoIP) payload buffers and signaling message queues in carrier-grade DSLAMs and MSANs. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory for real-time jitter buffer management and call control state storage. Use Value: DLL-enabled 1.5-cycle latency ensures predictable 3.75 ns read response; HSTL I/O withstands noisy telecom board environments. |
| FPGA-Based Protocol Acceleration | High-Speed Test Equipment Memory |
Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection tasks in FPGA-accelerated NICs. IC Role / Device Role / Timing Role: Co-processor memory tightly coupled to FPGA fabric via dedicated read/write AXI streams. Use Value: Multiplexed address bus reduces FPGA pin count; RPS/WPS signals enable fine-grained port arbitration in hardware state machines. | Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) for semiconductor characterization. IC Role / Device Role / Timing Role: High-throughput acquisition buffer synchronized to precision sampling clocks and pattern generators. Use Value: Echo clocks (CQ/CQ) allow controller to lock data capture to exact sample edges; 165-ball FBGA supports dense, low-inductance layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | 36-Mbit (2M × 18), 166 MHz max, QDR II+, no echo clocks, LVDS I/O | Lower density and bandwidth; suited for mid-range switching, not 10G+ line cards | Select only if system clock <167 MHz and LVDS interface preferred over HSTL |
| ISSI IS61WV102418B | 18-Mbit (512K × 36), 166 MHz, asynchronous SRAM, single-port, CMOS I/O | No DDR, no dual-port, no DLL - lacks concurrency and timing determinism for real-time buffering | Only viable for non-critical, low-speed control-plane storage where latency and bandwidth are secondary |
Compared with IDT72T36150L10BG and IS61WV102418B, CY7C1525JV18 uniquely delivers 72-Mbit density, 267 MHz DDR operation, echo-clock–assisted capture, and HSTL-18 compatibility - making it the sole fit for deterministic, full-duplex 10Gbps+ packet buffering.
Availability
CY7C1525JV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA-based protocol acceleration, and high-speed test equipment requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1525JV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The QDR® II SRAM product line was engineered specifically for deterministic, low-latency, high-throughput buffering in networking infrastructure - targeting core router, switch, and base station applications demanding concurrent read/write bandwidth.
FAQ
What is the function of the DOFF pin?
The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device operates in QDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. When DOFF is HIGH (via 10 kΩ pull-up), the DLL is active, enabling 1.5-cycle latency and full 267 MHz operation. This pin provides hardware-selectable timing modes without firmware intervention.
How does the ZQ pin affect signal integrity?
The ZQ pin connects to an external 240 Ω resistor to ground to calibrate the output driver impedance of Q[8:0], CQ, and CQ pins to 50 Ω (0.2 × 240 Ω). This matching minimizes reflections and ensures clean eye diagrams at 534 Mbps DDR rates. Leaving ZQ unconnected or tying it to GND violates HSTL-18 specifications and causes signal degradation.
Can CY7C1525JV18 be used with a single clock domain?
Yes - the device supports single-clock mode by connecting K to C and K to C. In this configuration, all data input and output timing references shift to the K/K clocks, eliminating the need for separate C/C generation. However, echo clocks (CQ/CQ) remain referenced to C/C, so they must still be generated or disabled per system requirements.
What is the role of BWS0 in write operations?
BWS0 is the byte write select signal for the full 9-bit D[8:0] data bus. When asserted LOW, it enables writing the entire 9-bit word to the addressed location. When HIGH, the corresponding write operation is ignored, preserving existing memory contents. It is sampled synchronously with D[8:0] on the rising edge of K and is only active when WPS is asserted.
CY7C1525JV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 8M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1525JV18-250BZC FAQ
1.How can I place an order for CY7C1525JV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1525JV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1525JV18-250BZC reliable?
The price and inventory of CY7C1525JV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1525JV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1525JV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1525JV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1525JV18-250BZC?
CY7C1525JV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1525JV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1525JV18-250BZC?
For technical support, including CY7C1525JV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1525JV18-250BZC requirements.
6.How does Aetrix verify that CY7C1525JV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1525JV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1525JV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1525JV18-250BZC?
All CY7C1525JV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1525JV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1525JV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1525JV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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