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Cypress Semiconductor Corp CY7C1525KV18-250BZC

Part No.:
CY7C1525KV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1525KV18-250BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:161

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Product details

Overview

CY7C1525KV18 from Cypress Semiconductor is an 8M × 9 (72-Mbit) QDR® II SRAM with separate read/write ports, 350 MHz clock support, DDR interfaces on both ports (700 MT/s effective data rate), and 1.8V core / 1.4–1.8V I/O supply. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1525KV18 datasheet, CY7C1525KV18 pinout, CY7C1525KV18 application, or CY7C1525KV18 equivalent, key selection criteria include burst depth (2-word), read latency (1 or 1.5 cycles depending on DOFF), FBGA-165 package compatibility, HSTL-18 I/O compliance, and JTAG 1149.1 testability.

Technical Context

The CY7C1525KV18 implements a synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed 22-bit address bus. Read and write operations are latched on alternate rising edges of the K clock, enabling true concurrency without bus turnaround.

It uses dual input clocks (K/K̄) for DDR timing control and echo clocks (CQ/CQ̄) to simplify high-speed data capture. A built-in PLL ensures precise data placement, while DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (8M × 9 organization)
Max Clock Frequency250 MHz - supports 500 MT/s DDR throughput per port
Read Latency1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines pipeline depth in controller design
I/O Voltage RangeVDDQ = 1.4 V to 1.8 V - compatible with 1.5V or 1.8V HSTL-18 systems
Core SupplyVDD = 1.8 V ± 0.1 V - fixed low-voltage core for power-constrained telecom applications
Burst Length2-word burst - fixed burst mode simplifies address generation logic
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB layouts

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[8:0]Synchronous write data inputs9-bit parallel data sampled on rising edge of K clock; supports byte-write via BWS0
Q[8:0]Synchronous read data outputs9-bit parallel output registered to C/C̄ clocks; echo-clocked for timing margin
K / K̄Input clocks for address/data latchingRising-edge-triggered; K used for address and D[8:0], K̄ for WPS/BWS
C / C̄Output clocks for Q[8:0] timingDrive read data registers; matched to CQ/CQ̄ for source-synchronous capture
CQ / CQ̄Echo clocksReplicate C/C̄ at device output; enable receiver-side deskew in FPGA/ASIC interfaces
WPSWrite port selectActive-low signal enabling write transaction; deassertion blocks D[8:0] acceptance
BWS0Byte write selectActive-low control for all 9 bits; enables partial writes without read-modify-write
DOFFRead latency mode selectHIGH → 1.5-cycle latency (pipelined); LOW → 1-cycle latency (QDR I compatibility)
TMS/TCK/TDI/TDOJTAG boundary scan interfaceIEEE 1149.1 compliant; supports production test and in-system debug

Key Features

FeatureDesign Value
Separate read/write portsEnables simultaneous 500 MT/s read + 500 MT/s write without arbitration or bus contention
2-word burst architectureReduces address bus toggling by 50% vs. single-word access; lowers system EMI
HSTL-18 I/O buffersProvides impedance-matched, low-noise signaling at 700 MT/s with programmable drive strength
On-chip PLLEliminates external clock synthesis; locks to K clock to align C/C̄ and CQ/CQ̄ with ±50 ps jitter
Full data coherencyGuarantees most recent written data appears on next read - no stale-data risk in burst sequences

Applications

Network Packet BufferingHigh-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet line cards with real-time classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency shared buffer between ingress parser and egress scheduler ASICs.

Use Value: Concurrent 500 MT/s reads and writes eliminate FIFO bottlenecks, enabling line-rate packet processing at OC-192.

Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) with >1 GS/s sampling rates.

IC Role / Device Role / Timing Role: High-bandwidth acquisition memory interfacing directly to ADC output and pattern generator input.

Use Value: 2-word burst + echo clocks reduce setup/hold violations, allowing reliable capture at 250 MHz system clock.

Baseband Signal ProcessingFPGA Co-Processor Cache

Use Scenario: Temporary storage of FFT coefficients and channel estimation data in LTE/5G baseband units.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed concurrently by multiple DSP cores via dedicated ports.

Use Value: 1-cycle read latency (DOFF = LOW) minimizes pipeline stalls in iterative algorithms like MMSE equalization.

Use Scenario: Off-chip cache for Xilinx Ultrascale+ or Intel Stratix 10 FPGA-based accelerators handling streaming video analytics.

IC Role / Device Role / Timing Role: High-throughput memory extension bridging FPGA fabric and external DDR4 subsystem.

Use Value: HSTL-18 I/O and FBGA-165 footprint ensure signal integrity and board-level compatibility with FPGA reference designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG36-bit bus, 10 ns access, 3.3V core/I/O, no echo clocks or PLLLimited to lower-frequency parallel bus systems; lacks DDR timing supportSelect only for legacy 3.3V designs requiring simple asynchronous interface
ISSI IS61WV102418BLL-10BLI1M × 18, 10 ns async access, 3.3V/2.5V, no burst or DDR capabilityNot suitable for QDR II use cases - no concurrent read/write or echo clockingConsider only for cost-sensitive non-pipelined buffer applications below 100 MHz

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C1525KV18 uniquely delivers 500 MT/s DDR bandwidth per port, source-synchronous echo clocks, and configurable 1/1.5-cycle latency - essential for modern packet-processing and test instrumentation where timing margin and concurrency are critical.

Availability

CY7C1525KV18 is available at Aetrix Electronics and suitable for network infrastructure, semiconductor test equipment, wireless baseband processing, and FPGA-accelerated computing requiring stable component supply across multi-year production cycles.

Supply support for CY7C1525KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II SRAM product line was designed specifically for ultra-high-bandwidth, low-latency buffering in networking and test equipment - prioritizing deterministic timing, concurrent access, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C1525KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimized QDR II performance; when LOW, it reduces latency to 1 cycle for backward compatibility with QDR I controllers. This setting affects internal pipeline staging but does not alter timing parameters like tAC or tHZ.

Can CY7C1525KV18 operate with only one clock domain (K-only)?

Yes - the device supports single-clock-domain operation using only the K clock for both address latching and data capture, with C and C̄ tied to K. However, this sacrifices timing margin: echo clocks (CQ/CQ̄) and separate C/C̄ are required to achieve full 250 MHz DDR performance with guaranteed setup/hold margins in high-speed PCB layouts.

What is the purpose of BWS0 in the CY7C1525KV18 pinout?

BWS0 (Byte Write Select 0) is an active-low signal that enables or disables writing to all 9 data bits (D[8:0]) during a write transaction. When deasserted (HIGH), incoming data is ignored; when asserted (LOW), D[8:0] is written to the addressed location. Unlike nibble-select variants, BWS0 controls the full 9-bit word in this x9 configuration.

Is the CY7C1525KV18 pin-compatible with other devices in the CY7C15xxKV18 family?

No - although all share the same 165-ball FBGA package and core pinout (K, C, CQ, DOFF, etc.), data bus width differs: CY7C1510KV18 is x8 (D[7:0]/Q[7:0]), CY7C1525KV18 is x9 (D[8:0]/Q[8:0]), CY7C1512KV18 is x18, and CY7C1514KV18 is x36. Pin assignments for D/Q signals and write-select lines (NWS vs. BWS) are configuration-specific and not interchangeable.

CY7C1525KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
8M x 9
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1525KV18-250BZC FAQ

1.How can I place an order for CY7C1525KV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1525KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1525KV18-250BZC reliable?

The price and inventory of CY7C1525KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1525KV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1525KV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1525KV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1525KV18-250BZC?

CY7C1525KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1525KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1525KV18-250BZC?

For technical support, including CY7C1525KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1525KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1525KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1525KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1525KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1525KV18-250BZC?

All CY7C1525KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1525KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1525KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1525KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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