Cypress Semiconductor Corp CY7C1525KV18-300BZC

Overview

CY7C1525KV18-300BZC from Cypress Semiconductor is an 8M × 9-bit (72-Mbit), 300 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (600 Mbps per port), and 1.8V core / 1.4–1.8V I/O supply. It delivers concurrent read-write transactions with 1-cycle (DOFF = LOW) or 1.5-cycle (DOFF = HIGH) read latency and is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1525KV18-300BZC datasheet, CY7C1525KV18-300BZC pinout, CY7C1525KV18-300BZC application, or CY7C1525KV18-300BZC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), JTAG 1149.1 compliance, HSTL-18 I/O compatibility, and FBGA-165 package thermal/mechanical constraints.

Technical Context

This QDR II SRAM uses dual independent clock domains: K/K for address/data capture and C/C for output timing, enabling precise DDR edge alignment without bus turnaround. Its internal PLL synchronizes data placement to minimize skew between read data and echo clocks (CQ/CQ).

The device implements synchronous self-timed writes with byte write select (BWS0) control for 9-bit data width, and supports depth expansion via RPS/WPS signals. All inputs are registered on K-clock rising edges; all outputs are registered on C-clock rising edges, ensuring deterministic timing at 300 MHz operation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZC suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418BLL-10TLI, CY7C1525KV18-300BZC uniquely delivers 72-Mbit density with 2-word DDR bursts, echo clocks, and configurable read latency-enabling higher throughput and tighter timing closure in modern switch fabric and baseband designs.

Availability

CY7C1525KV18-300BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, 4G LTE baseband processing, and high-performance test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1525KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with a focus on signal integrity and timing precision.

The QDR® II SRAM product line targets high-speed data-path applications demanding deterministic latency, concurrent access, and DDR bandwidth-specifically engineered for switch fabric, packet processing, and real-time baseband subsystems.

FAQ

What is the function of the DOFF pin on CY7C1525KV18-300BZC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin in systems with longer data paths; when LOW, it enables 1-cycle latency for minimal delay. This setting affects internal pipeline staging but does not alter burst length, clock frequency, or data width.

Can CY7C1525KV18-300BZC operate with only a single clock domain?

Yes-CY7C1525KV18-300BZC supports single-clock mode where K and C are driven by the same source. In this configuration, the device uses K for input registration and C for output registration, eliminating need for separate clock trees but requiring careful board-level skew control between K and C nets.

How does the BWS0 pin differ from NWS signals in CY7C1525KV18-300BZC?

BWS0 is the sole byte write select for the 9-bit data path in CY7C1525KV18-300BZC and controls write enable for all nine bits simultaneously. Unlike NWS0/NWS1 (used only in x8 devices), BWS0 is not nibble-granular-it's a full-width active-low write gate, making it simpler to interface but less flexible than nibble-select schemes.

Is the 165-ball FBGA package of CY7C1525KV18-300BZC compatible with standard reflow profiles?

Yes-the BZC suffix denotes a Pb-free 165-ball FBGA package qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3 and compatible with standard lead-free reflow profiles (peak 260°C). Board layout must observe 0.8 mm ball pitch, thermal pad grounding, and controlled impedance routing for K/C/CQ signals.