Cypress Semiconductor Corp CY7C1525KV18-333BZXC
- Part No.:
- CY7C1525KV18-333BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1525KV18-333BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1525KV18-333BZXC from Cypress Semiconductor is an 8M × 9 (72-Mbit) QDR® II SRAM with synchronous pipelined architecture, dual independent read/write ports, 333 MHz clock operation, DDR interfaces on both ports (666 MT/s effective data rate), and 1.8V core / 1.4–1.8V I/O supply. It delivers high-bandwidth buffering for network packet processing in telecom line cards.
For engineers reviewing the CY7C1525KV18-333BZXC datasheet, CY7C1525KV18-333BZXC pinout, CY7C1525KV18-333BZXC application, or CY7C1525KV18-333BZXC equivalent, key selection criteria include burst depth (2-word), read latency (1 or 1.5 cycles depending on DOFF), echo clock support (CQ/CQ), and FBGA-165 package compatibility with HSTL-18 I/O.
Technical Context
This SRAM implements true QDR II architecture with physically separate read and write data paths-no bus turnaround required. It uses two independent input clocks (K/K) for address/data capture and two output clocks (C/C) plus echo clocks (CQ/CQ) to align data sampling at the receiver under tight skew constraints.
The device integrates a PLL for precise internal timing control, supports synchronous self-timed writes, and provides full data coherency via pipelined read-after-write behavior. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes, enabling trade-offs between latency and throughput in real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (8M × 9 configuration) |
| Max Clock Frequency | 333 MHz - determines maximum sustained bandwidth of 6 Gbps (2 × 9-bit × 333 MHz) |
| Data Rate | 666 MT/s - double-data-rate transfer on both read and write ports |
| Read Latency | 1 or 1.5 cycles - selectable via DOFF pin; impacts pipeline depth in switch fabric designs |
| Core Supply | 1.8 V ±0.1 V - defines power rail stability requirements and decoupling design |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5V or 1.8V HSTL-18 logic families |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in dense PCB layouts |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data inputs | 9-bit parallel data sampled on rising edge of K clock; used for burst write operations |
| Q[8:0] | Synchronous read data outputs | 9-bit parallel data driven on rising edge of C clock; aligned with CQ echo clock |
| K / K | Input clocks (read/write) | Dual-phase clock pair for address and data latching; enables DDR timing without external phase alignment |
| C / C | Output clocks | Separate clocks for read data output timing; minimizes flight time mismatch vs. data signals |
| CQ / CQ | Echo clocks | Replica of C/C clocks output with matched delay; simplifies source-synchronous capture at FPGA/ASIC receiver |
| WPS | Write port select | Active-low signal enabling write transactions; deassertion disables write port and ignores D[8:0] |
| BWS0 | Byte write select | Active-low control for 9-bit write mask; allows partial writes without read-modify-write overhead |
| DOFF | Read latency mode select | HIGH = 1.5-cycle latency (higher throughput); LOW = 1-cycle latency (lower latency) |
| RPS | Read port select | Active-low signal enabling read transactions; deassertion disables read port and tristates Q[8:0] |
| VDDQ | I/O power supply | Supplies HSTL-18 output buffers; must be independently decoupled from core VDD |
| VREF | Reference voltage | Provides mid-supply reference for HSTL input receivers; requires stable 0.7×VDDQ bias |
| ZQ | Impedance calibration | Connects to external 240 Ω resistor to ground for dynamic output driver impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables concurrent access without arbitration delay-critical for full-duplex packet buffering in switches |
| 2-word burst architecture | Guarantees minimum 18-bit data transfer per access, reducing address overhead in streaming applications |
| Echo clock (CQ/CQ) support | Eliminates need for board-level trace length matching between clock and data nets in >300 MHz systems |
| Programmable drive strength | Allows dynamic adjustment of HSTL output impedance via ZQ calibration-improves signal integrity across PVT corners |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant test access for interconnect validation and production testing of high-density FBGA layout |
Applications
| Telecom Line Card Buffering | High-Speed Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in OC-192/STM-64 line interface modules. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, non-blocking buffer between SerDes PHY and traffic manager ASIC. Use Value: Concurrent read/write eliminates pipeline stalls during back-to-back packet bursts, sustaining 10+ Gbps line-rate throughput. | Use Scenario: Implementing shared memory for crossbar scheduler lookups and queue depth tracking in enterprise switches. IC Role / Device Role / Timing Role: High-bandwidth memory node providing synchronized access to multiple scheduler engines via dedicated ports. Use Value: 666 MT/s effective bandwidth ensures sub-10 ns average memory access latency for real-time scheduling decisions. |
| Network Processor Co-Processor Cache | Test Equipment Pattern Memory |
Use Scenario: Offloading packet classification table storage from main NPU core to reduce cache pressure in DPI engines. IC Role / Device Role / Timing Role: External L2-like cache supporting parallel rule-match and action-fetch operations. Use Value: 1.5-cycle latency mode (DOFF=HIGH) maximizes match-throughput for 100+ million rules/sec performance. | Use Scenario: Storing stimulus/response vectors for high-speed digital pattern generators in ATE systems. IC Role / Device Role / Timing Role: Deterministic-access memory delivering glitch-free waveform playback at 333 MHz clock rate. Use Value: Echo clocks (CQ/CQ) enable precise source-synchronous capture at tester pins, eliminating setup/hold violations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus width, 10 ns access time, 3.3V core/I/O, no echo clocks or DOFF latency control | Targeted at legacy telecom systems requiring wider data path but lower frequency (≤100 MHz) | Select when system uses 3.3V logic and requires x36 interface over x9; not suitable for 333 MHz QDR-II timing closure |
| ISSI IS61WV102418BLL-10BLI | 1M × 18 async SRAM, 10 ns access, single-port, 3.3V/2.5V, no DDR or burst capability | Used in low-cost control-plane buffering where concurrency and bandwidth are secondary to cost and simplicity | Choose only for non-critical, low-frequency buffering; lacks QDR-II's concurrent transaction capability and echo clock support |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C1525KV18-333BZXC uniquely delivers 333 MHz DDR dual-port operation with echo clocks and programmable latency-enabling deterministic, high-throughput memory access essential for modern packet-processing pipelines.
Availability
CY7C1525KV18-333BZXC is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed switch fabric, and network test equipment requiring stable component supply, long-lifecycle support, and guaranteed FBGA-165 packaging consistency.
Supply support for CY7C1525KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
This device belongs to Cypress's QDR® II SRAM product line, engineered specifically for high-bandwidth, low-latency packet buffering and switching applications where concurrent read/write access and precise timing control are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1525KV18-333BZXC?
The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for higher throughput; when LOW, it configures 1-cycle latency for minimal delay. This setting directly affects pipeline depth in connected logic and must be held stable during operation-no dynamic switching is supported.
Does CY7C1525KV18-333BZXC require external termination resistors?
Yes-HSTL-18 I/Os require source-series or parallel termination. VDDQ-referenced parallel termination (e.g., 50 Ω to VTT = VDDQ/2) is recommended for Q[8:0] outputs. D[8:0] inputs use on-die termination calibrated via ZQ pin connected to 240 Ω to ground, eliminating need for external resistors on write data lines.
Can CY7C1525KV18-333BZXC operate with only one clock domain (K = C)?
Yes-the device supports single-clock-domain operation where K and C are tied together. In this mode, read data is registered on the same clock edge as address, resulting in fixed 1-cycle latency regardless of DOFF state. However, echo clock (CQ) functionality is lost, increasing timing margin requirements on PCB layout.
Is JTAG boundary scan supported on CY7C1525KV18-333BZXC, and how is it enabled?
Yes-IEEE 1149.1 JTAG is fully implemented. It is enabled by holding TMS HIGH and applying five TCK pulses during power-up reset. Once active, the TAP controller supports IDCODE, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. No external pull-ups or configuration pins are needed-the feature is always present and functional after proper reset sequencing.
CY7C1525KV18-333BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 8M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1525KV18-333BZXC FAQ
1.How can I place an order for CY7C1525KV18-333BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1525KV18-333BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1525KV18-333BZXC reliable?
The price and inventory of CY7C1525KV18-333BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1525KV18-333BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1525KV18-333BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1525KV18-333BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1525KV18-333BZXC?
CY7C1525KV18-333BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1525KV18-333BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1525KV18-333BZXC?
For technical support, including CY7C1525KV18-333BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1525KV18-333BZXC requirements.
6.How does Aetrix verify that CY7C1525KV18-333BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1525KV18-333BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1525KV18-333BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1525KV18-333BZXC?
All CY7C1525KV18-333BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1525KV18-333BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1525KV18-333BZXC part is unused and in its original packaging.
Return procedure for CY7C1525KV18-333BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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