Cypress Semiconductor Corp CY7C1525V18-200BZC
- Part No.:
- CY7C1525V18-200BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1525V18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1525V18 from Cypress Semiconductor is an 8M × 9 (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 250 MHz clock operation, DDR interfaces on both ports (500 MT/s effective data rate), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers full data coherency and synchronous self-timed writes for high-throughput packet buffering in network line cards.
For engineers reviewing the CY7C1525V18 datasheet, CY7C1525V18 pinout, CY7C1525V18 application, or CY7C1525V18 equivalent, key selection criteria include its dual-clock DDR timing architecture, 9-bit wide x8M depth configuration, HSTL I/O compatibility, echo clock support (CQ/CQ), and JTAG 1149.1 test access.
Technical Context
The CY7C1525V18 implements a true QDR-II architecture with physically independent read and write data paths-no bus turnaround required. Its 2-word burst transfers occur on every rising edge of K/K (write) and C/C (read), enabling concurrent read/write operations at full bandwidth.
It uses a Delay Lock Loop (DLL) for precise output data placement relative to C/C clocks, and supports echo clocks (CQ/CQ) referenced to C/C to simplify high-speed data capture. Address inputs are multiplexed across both ports, latched on alternating edges of K/K, reducing pin count while maintaining full port independence.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (8M × 9 organization) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s DDR data transfers per port |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - supports HSTL Class I/II outputs with programmable drive strength |
| Core Voltage | VDD = 1.8 V ± 0.1 V - low-power 1.8V core with separate I/O rail for signal integrity |
| Burst Length | 2-word burst - delivers two 9-bit words per access cycle, optimizing throughput for packet headers |
| Timing Architecture | Dual input clocks (K/K) + dual output clocks (C/C) - eliminates flight-time skew between devices in parallel configurations |
| Write Select Granularity | Byte Write Select (BWS0) - enables 9-bit partial writes without disturbing adjacent data |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data input | 9-bit parallel data sampled on rising edge of K clock; supports partial writes via BWS0 |
| Q[8:0] | Synchronous read data output | 9-bit parallel data driven on rising edges of C/C clocks; tri-stated when RPS inactive |
| K / K | Positive/negative input clocks | Edge-aligned clocks for address/data/control sampling; K only used for rising-edge latching |
| C / C | Positive/negative output clocks | Deskew-capable clocks for Q[8:0] and CQ/CQ; enable matched flight time across multi-device systems |
| CQ / CQ | Echo clocks | Free-running copies of C/C synchronized to output clock domain; simplify source-synchronous capture at controller |
| RPS / WPS | Read/Write Port Select | Active-low enables; independently control read and write transactions without arbitration logic |
| BWS0 | Byte Write Select | Active-low enables full 9-bit write; no nibble-level select (unlike x8 variant) |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q[8:0]/CQ/CQ output impedance to 0.2×RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables simultaneous read and write to same memory location without bus contention or turnaround delay |
| 250 MHz DDR interface | Delivers 900 MB/s aggregate bandwidth (450 MB/s per port) at minimal system timing overhead |
| Delay Lock Loop (DLL) | Aligns Q[8:0] output edges precisely to C/C clock transitions, reducing setup/hold margin requirements |
| JTAG 1149.1 compliance | Supports boundary-scan testing and in-system debug without requiring additional test pads or probes |
| HSTL Class I/II outputs | Configurable drive strength ensures signal integrity on high-speed backplanes up to 500 MT/s |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO buffer with zero-latency concurrent access. Use Value: Eliminates bus turnaround delays, enabling deterministic 250 MHz packet processing with full 9-bit word alignment for header parsing. |
Use Scenario: Buffering TDM and ATM cell payloads in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: High-bandwidth shared memory for traffic shaping and queue management across multiple DSP cores. Use Value: Sustains 500 MT/s sustained throughput with echo clocks (CQ/CQ) ensuring reliable capture across temperature and voltage variation. |
| High-Speed Test Equipment | Avionics Data Recorders |
Use Scenario: Capturing real-time waveform samples from multi-channel ADCs in automated test systems. IC Role / Device Role / Timing Role: Write-port receives interleaved sample streams; read-port feeds analysis engine with minimal latency. Use Value: 2-word burst mode matches typical ADC pipeline depth, while DLL-controlled outputs meet tight jitter budgets (<15 ps). |
Use Scenario: Storing flight telemetry and sensor logs in DO-254-certified avionics recorders. IC Role / Device Role / Timing Role: Radiation-tolerant (industrial temp grade) memory buffer with JTAG visibility for built-in self-test. Use Value: JTAG 1149.1 support enables traceable boundary-scan validation during production and field maintenance cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus width, 10 ns access, 3.3V core/I/O, no echo clocks or DLL | Lower density (36Mbit), higher voltage, asynchronous timing model | Select when legacy 3.3V system integration or simpler timing closure outweighs bandwidth and power advantages |
| ISSI IS61WV102418B | 1M × 18 sync SRAM, 166 MHz max, single clock domain, no DDR or burst | Half the bandwidth, no concurrent read/write, lacks CQ/CQ deskew capability | Select for cost-sensitive embedded control buffers where QDR-II features are unnecessary |
Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1525V18 provides 2× higher effective bandwidth, 1.8V core power savings, and hardware-assisted timing deskew-critical for 10G+ packet processing but requires tighter layout control for DDR clock routing.
Availability
CY7C1525V18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment, and avionics data recorders requiring stable component supply and long-term industrial temperature support.
Supply support for CY7C1525V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in packet-switched infrastructure-optimized for deterministic concurrent access and signal integrity at >500 MT/s.
FAQ
What is the function of the ZQ pin on CY7C1525V18?
The ZQ pin calibrates the output driver impedance of Q[8:0], CQ, and CQ to match the system data bus. It must be connected to a precision resistor (typically 100 Ω) to ground; connecting directly to VDDQ enables minimum impedance mode. Leaving ZQ floating or tied to GND violates specification and causes output timing violations.
Can CY7C1525V18 operate in single-clock mode?
Yes-when C and C are tied together and driven by K (or K), the device enters single-clock mode. In this mode, Q[8:0] is clocked by K/K, CQ/CQ are derived from K/K, and all timing references shift to the K clock domain. The DLL remains active unless disabled via DOFF.
How does the BWS0 signal differ from NWS0/NWS1 in CY7C1525V18?
CY7C1525V18 uses BWS0 (Byte Write Select) for full 9-bit write enable-there is no nibble-level select. NWS0/NWS1 exist only in the x8 variant (CY7C1510V18) to control D[3:0] and D[7:4]. BWS0 assertion enables writing all 9 bits; deassertion holds the entire word unchanged.
Is the DOFF pin required to be connected for normal operation?
No-DOFF is optional. When left unconnected or pulled HIGH, the internal DLL operates normally for precise output timing. Pulling DOFF LOW disables the DLL, reverting to basic flip-flop output timing with increased jitter and reduced timing margin; this mode is not recommended for 250 MHz operation.
CY7C1525V18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 8M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1525V18-200BZC FAQ
1.How can I place an order for CY7C1525V18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1525V18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1525V18-200BZC reliable?
The price and inventory of CY7C1525V18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1525V18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1525V18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1525V18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1525V18-200BZC?
CY7C1525V18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1525V18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1525V18-200BZC?
For technical support, including CY7C1525V18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1525V18-200BZC requirements.
6.How does Aetrix verify that CY7C1525V18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1525V18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1525V18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1525V18-200BZC?
All CY7C1525V18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1525V18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1525V18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1525V18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1525V18-200BZC Tags

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STMicroelectronics
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STMicroelectronics

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