Cypress Semiconductor Corp CY7C1545KV18-400BZC
- Part No.:
- CY7C1545KV18-400BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1545KV18-400BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:800
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Product details
Overview
CY7C1545KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 2.0-cycle read latency, 400 MHz clock operation (800 MT/s data rate), HSTL I/O, and 1.8 V core / 1.4–1.8 V I/O supply. It delivers concurrent read/write throughput for high-speed packet buffering in network switches and routers.
For engineers reviewing the CY7C1545KV18 datasheet, CY7C1545KV18 pinout, CY7C1545KV18 application, or CY7C1545KV18 equivalent, this page provides verified specifications, FBGA-165 pin mapping, QDR II+ burst timing behavior, and validated alternatives for memory subsystem design.
Technical Context
The CY7C1545KV18 implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its four-word burst transfers 144 bits per read or write cycle at 400 MHz, achieving 28.8 GB/s aggregate bandwidth across dual DDR interfaces.
It uses K and K input clocks for precise edge-aligned sampling of address and control signals, with echo clocks CQ/CQ synchronized to K/K for reliable high-speed data capture. The internal PLL enables accurate data placement at full speed; DOFF pin selects between QDR II+ (2-cycle latency) and QDR I (1-cycle latency) modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 400 MHz - supports 800 MT/s DDR data rate on both ports |
| Read Latency | 2.0 clock cycles - fixed when DOFF = HIGH; enables deterministic timing for pipeline scheduling |
| Core Supply | 1.8 V ± 0.1 V - defines minimum power rail stability requirement for internal logic |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system buses |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB layout |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity up to 400 MHz |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | 36-bit wide parallel data bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous read data outputs | 36-bit wide DDR output bus aligned to CQ/CQ; tri-stated when RPS is deasserted |
| RPS | Read port select (active LOW) | Enables read burst initiation on next K edge; controls Q[35:0] driver enable and QVLD assertion |
| WPS | Write port select (active LOW) | Enables write burst initiation on next K edge; gates D[35:0] and BWS[3:0] sampling |
| BWS[3:0] | Byte write select (active LOW) | Four independent 9-bit byte masks; BWS0–BWS3 each control one 9-bit segment of D[35:0] |
| K / K | Differential clock inputs | Primary timing references - all synchronous operations triggered on rising edges; K drives read path, K drives write path |
| CQ / CQ | Echo clock outputs | Free-running copies of K/K with matched skew; used by external logic to latch Q[35:0] with minimal setup/hold margin |
| QVLD | Valid data indicator | Asserted coincident with first valid Q[35:0] word in burst; edge-aligned to CQ/CQ for timing-critical capture |
| DOFF | PLL disable control | When LOW, disables internal PLL and reverts device to QDR I mode (1-cycle latency, ≤167 MHz max) |
| ZQ | Output impedance calibration | Connects to external 240 Ω resistor to ground to tune CQ/CQ/Q[35:0] drive strength to match 50 Ω transmission lines |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround delay and contention, enabling true concurrent access without arbitration logic |
| Four-word burst architecture | Reduces effective address bus frequency by 4× - only one address needed per 144-bit transfer |
| 2.0-cycle read latency (DOFF = HIGH) | Provides predictable, fixed pipeline depth for deterministic memory controller scheduling in ASIC/FPGA designs |
| HSTL I/O with programmable drive | Ensures signal integrity at 400 MHz while allowing drive strength tuning to match PCB trace impedance |
| JTAG 1149.1 boundary scan | Enables production test and debug of solder joints and interconnects without physical probe access |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized to line-rate clocks. Use Value: 28.8 GB/s aggregate bandwidth and zero-turnaround architecture eliminate backpressure bottlenecks in 10G/40G switch fabric designs. |
Use Scenario: Capturing real-time waveform samples at >1 GS/s in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-throughput memory buffer interfacing directly with FPGA-based sequencers and DACs. Use Value: 400 MHz clock + DDR interface delivers sustained 28.8 GB/s write/read throughput required for multi-channel vector pattern generation. |
| Telecom Baseband Processing | AI Accelerator On-Chip Cache |
|
Use Scenario: Temporary storage of OFDM symbol data during channel estimation and equalization in 5G NR baseband units. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory co-located with DSP cores for symbol-level buffering. Use Value: Fixed 2-cycle read latency enables tight loop timing closure in FPGA-based baseband pipelines operating at 400 MHz. |
Use Scenario: Serving as L2 cache for tensor compute engines in edge AI inference accelerators. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed concurrently by multiple MAC clusters during matrix tile processing. Use Value: 36-bit wide interface and four-word burst reduce memory controller complexity versus narrow SDR alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150 | 72-Mbit QDR II+ (2M × 36), 333 MHz max, 1.8 V core, HSTL I/O, same FBGA-165 package | Lower max frequency (333 MHz vs. 400 MHz); identical burst and latency behavior | Select when system clock is ≤333 MHz and legacy IDT compatibility is required |
| ISSI IS61WV102436B | 36-Mbit synchronous SRAM (1M × 36), 167 MHz max, single-port, SSTL-2 I/O, TSOPII-100 package | Half density, half speed, single-port only, no burst or echo clocks | Use only for cost-sensitive, lower-bandwidth applications where QDR architecture is not mandatory |
Compared with IDT72T36150 and IS61WV102436B, CY7C1545KV18 delivers 20% higher bandwidth and deterministic 2-cycle latency critical for real-time networking stacks, while maintaining pin compatibility with industry-standard QDR II+ layouts.
Availability
CY7C1545KV18 is available at Aetrix Electronics and suitable for network infrastructure, high-speed test instrumentation, telecom baseband processing, and AI accelerator memory subsystems requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1545KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.
CY7C1545KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory access in packet-switched networks and real-time signal processing platforms.
FAQ
What is the function of the DOFF pin on CY7C1545KV18?
The DOFF pin controls internal PLL operation: when HIGH, the PLL is active and the device operates in QDR II+ mode with 2.0-cycle read latency at up to 400 MHz; when LOW, the PLL is disabled and the device reverts to QDR I mode with 1-cycle latency and a maximum clock frequency of 167 MHz. This allows backward compatibility with legacy QDR I controllers.
How does the ZQ pin affect output drive strength?
The ZQ pin connects to an external 240 Ω resistor to ground to calibrate the output impedance of Q[35:0], CQ, and CQ pins to approximately 50 Ω (0.2 × RQ). This matching minimizes signal reflections on high-speed PCB traces. Leaving ZQ unconnected or tying it to GND violates specification and causes undefined drive strength.
Can CY7C1545KV18 be used with a 1.5 V I/O supply?
Yes - the device supports VDDQ from 1.4 V to 1.8 V, explicitly including 1.5 V operation. HSTL Class I input thresholds and variable-drive output buffers are designed for reliable signaling across this range, making it compatible with 1.5 V FPGA I/O banks without level-shifting.
What is the role of BWS[3:0] during a write operation?
BWS[3:0] are active-LOW byte write enable signals that independently gate 9-bit segments of the 36-bit D[35:0] bus: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Only bytes with asserted (LOW) BWS signals are written; others retain prior values, enabling partial-word updates without read-modify-write cycles.
CY7C1545KV18-400BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1545KV18-400BZC FAQ
1.How can I place an order for CY7C1545KV18-400BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1545KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1545KV18-400BZC reliable?
The price and inventory of CY7C1545KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1545KV18-400BZC is usually 5 days.
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Once your CY7C1545KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1545KV18-400BZC?
For technical support, including CY7C1545KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1545KV18-400BZC requirements.
6.How does Aetrix verify that CY7C1545KV18-400BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1545KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1545KV18-400BZC meets industry standards.
7.What is the process for return or replacement of CY7C1545KV18-400BZC?
All CY7C1545KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1545KV18-400BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1545KV18-400BZC part is unused and in its original packaging.
Return procedure for CY7C1545KV18-400BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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