Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C1545KV18-400BZC

Part No.:
CY7C1545KV18-400BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1545KV18-400BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:800

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1545KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 2.0-cycle read latency, 400 MHz clock operation (800 MT/s data rate), HSTL I/O, and 1.8 V core / 1.4–1.8 V I/O supply. It delivers concurrent read/write throughput for high-speed packet buffering in network switches and routers.

For engineers reviewing the CY7C1545KV18 datasheet, CY7C1545KV18 pinout, CY7C1545KV18 application, or CY7C1545KV18 equivalent, this page provides verified specifications, FBGA-165 pin mapping, QDR II+ burst timing behavior, and validated alternatives for memory subsystem design.

Technical Context

The CY7C1545KV18 implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its four-word burst transfers 144 bits per read or write cycle at 400 MHz, achieving 28.8 GB/s aggregate bandwidth across dual DDR interfaces.

It uses K and K input clocks for precise edge-aligned sampling of address and control signals, with echo clocks CQ/CQ synchronized to K/K for reliable high-speed data capture. The internal PLL enables accurate data placement at full speed; DOFF pin selects between QDR II+ (2-cycle latency) and QDR I (1-cycle latency) modes.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 400 MHz - supports 800 MT/s DDR data rate on both ports
Read Latency 2.0 clock cycles - fixed when DOFF = HIGH; enables deterministic timing for pipeline scheduling
Core Supply 1.8 V ± 0.1 V - defines minimum power rail stability requirement for internal logic
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system buses
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB layout
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity up to 400 MHz

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs 36-bit wide parallel data bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0]
Q[35:0] Synchronous read data outputs 36-bit wide DDR output bus aligned to CQ/CQ; tri-stated when RPS is deasserted
RPS Read port select (active LOW) Enables read burst initiation on next K edge; controls Q[35:0] driver enable and QVLD assertion
WPS Write port select (active LOW) Enables write burst initiation on next K edge; gates D[35:0] and BWS[3:0] sampling
BWS[3:0] Byte write select (active LOW) Four independent 9-bit byte masks; BWS0–BWS3 each control one 9-bit segment of D[35:0]
K / K Differential clock inputs Primary timing references - all synchronous operations triggered on rising edges; K drives read path, K drives write path
CQ / CQ Echo clock outputs Free-running copies of K/K with matched skew; used by external logic to latch Q[35:0] with minimal setup/hold margin
QVLD Valid data indicator Asserted coincident with first valid Q[35:0] word in burst; edge-aligned to CQ/CQ for timing-critical capture
DOFF PLL disable control When LOW, disables internal PLL and reverts device to QDR I mode (1-cycle latency, ≤167 MHz max)
ZQ Output impedance calibration Connects to external 240 Ω resistor to ground to tune CQ/CQ/Q[35:0] drive strength to match 50 Ω transmission lines

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround delay and contention, enabling true concurrent access without arbitration logic
Four-word burst architecture Reduces effective address bus frequency by 4× - only one address needed per 144-bit transfer
2.0-cycle read latency (DOFF = HIGH) Provides predictable, fixed pipeline depth for deterministic memory controller scheduling in ASIC/FPGA designs
HSTL I/O with programmable drive Ensures signal integrity at 400 MHz while allowing drive strength tuning to match PCB trace impedance
JTAG 1149.1 boundary scan Enables production test and debug of solder joints and interconnects without physical probe access

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized to line-rate clocks.

Use Value: 28.8 GB/s aggregate bandwidth and zero-turnaround architecture eliminate backpressure bottlenecks in 10G/40G switch fabric designs.

Use Scenario: Capturing real-time waveform samples at >1 GS/s in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: High-throughput memory buffer interfacing directly with FPGA-based sequencers and DACs.

Use Value: 400 MHz clock + DDR interface delivers sustained 28.8 GB/s write/read throughput required for multi-channel vector pattern generation.

Telecom Baseband Processing AI Accelerator On-Chip Cache

Use Scenario: Temporary storage of OFDM symbol data during channel estimation and equalization in 5G NR baseband units.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory co-located with DSP cores for symbol-level buffering.

Use Value: Fixed 2-cycle read latency enables tight loop timing closure in FPGA-based baseband pipelines operating at 400 MHz.

Use Scenario: Serving as L2 cache for tensor compute engines in edge AI inference accelerators.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed concurrently by multiple MAC clusters during matrix tile processing.

Use Value: 36-bit wide interface and four-word burst reduce memory controller complexity versus narrow SDR alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36150 72-Mbit QDR II+ (2M × 36), 333 MHz max, 1.8 V core, HSTL I/O, same FBGA-165 package Lower max frequency (333 MHz vs. 400 MHz); identical burst and latency behavior Select when system clock is ≤333 MHz and legacy IDT compatibility is required
ISSI IS61WV102436B 36-Mbit synchronous SRAM (1M × 36), 167 MHz max, single-port, SSTL-2 I/O, TSOPII-100 package Half density, half speed, single-port only, no burst or echo clocks Use only for cost-sensitive, lower-bandwidth applications where QDR architecture is not mandatory

Compared with IDT72T36150 and IS61WV102436B, CY7C1545KV18 delivers 20% higher bandwidth and deterministic 2-cycle latency critical for real-time networking stacks, while maintaining pin compatibility with industry-standard QDR II+ layouts.

Availability

CY7C1545KV18 is available at Aetrix Electronics and suitable for network infrastructure, high-speed test instrumentation, telecom baseband processing, and AI accelerator memory subsystems requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1545KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.

CY7C1545KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory access in packet-switched networks and real-time signal processing platforms.

FAQ

What is the function of the DOFF pin on CY7C1545KV18?

The DOFF pin controls internal PLL operation: when HIGH, the PLL is active and the device operates in QDR II+ mode with 2.0-cycle read latency at up to 400 MHz; when LOW, the PLL is disabled and the device reverts to QDR I mode with 1-cycle latency and a maximum clock frequency of 167 MHz. This allows backward compatibility with legacy QDR I controllers.

How does the ZQ pin affect output drive strength?

The ZQ pin connects to an external 240 Ω resistor to ground to calibrate the output impedance of Q[35:0], CQ, and CQ pins to approximately 50 Ω (0.2 × RQ). This matching minimizes signal reflections on high-speed PCB traces. Leaving ZQ unconnected or tying it to GND violates specification and causes undefined drive strength.

Can CY7C1545KV18 be used with a 1.5 V I/O supply?

Yes - the device supports VDDQ from 1.4 V to 1.8 V, explicitly including 1.5 V operation. HSTL Class I input thresholds and variable-drive output buffers are designed for reliable signaling across this range, making it compatible with 1.5 V FPGA I/O banks without level-shifting.

What is the role of BWS[3:0] during a write operation?

BWS[3:0] are active-LOW byte write enable signals that independently gate 9-bit segments of the 36-bit D[35:0] bus: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Only bytes with asserted (LOW) BWS signals are written; others retain prior values, enabling partial-word updates without read-modify-write cycles.

CY7C1545KV18-400BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1545KV18-400BZC FAQ

1.How can I place an order for CY7C1545KV18-400BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1545KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1545KV18-400BZC reliable?

The price and inventory of CY7C1545KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1545KV18-400BZC is usually 5 days.

3.What payment methods are accepted for CY7C1545KV18-400BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1545KV18-400BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1545KV18-400BZC?

CY7C1545KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1545KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1545KV18-400BZC?

For technical support, including CY7C1545KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1545KV18-400BZC requirements.

6.How does Aetrix verify that CY7C1545KV18-400BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1545KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1545KV18-400BZC meets industry standards.

7.What is the process for return or replacement of CY7C1545KV18-400BZC?

All CY7C1545KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1545KV18-400BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1545KV18-400BZC part is unused and in its original packaging.

Return procedure for CY7C1545KV18-400BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1545KV18-400BZC Tags

  • CY7C1545KV18-400BZC
  • CY7C1545KV18-400BZC PDF
  • CY7C1545KV18-400BZC Datasheet
  • CY7C1545KV18-400BZC Specifications
  • CY7C1545KV18-400BZC Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C1545KV18-400BZC
  • Buy CY7C1545KV18-400BZC
  • CY7C1545KV18-400BZC Price
  • CY7C1545KV18-400BZC Distributor
  • CY7C1545KV18-400BZC Supplier
  • CY7C1545KV18-400BZC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER