Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C1545KV18-450BZXI

Part No.:
CY7C1545KV18-450BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1545KV18-450BZXI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:125

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1545KV18-450BZXI from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 450 MHz clock operation, 2.0-cycle read latency, DDR interfaces on independent read/write ports, and HSTL I/O supporting 1.4–1.8 V VDDQ. It delivers 900 MT/s data throughput in high-speed networking buffers and packet processing engines.

For engineers reviewing the CY7C1545KV18-450BZXI datasheet, CY7C1545KV18-450BZXI pinout, CY7C1545KV18-450BZXI application, or CY7C1545KV18-450BZXI equivalent, this device serves as a synchronous burst SRAM optimized for concurrent read/write traffic in FPGA-attached line cards, telecom switching fabrics, and real-time protocol accelerators where bus turnaround elimination and deterministic latency are critical.

Technical Context

The CY7C1545KV18-450BZXI implements a true dual-port QDR II+ architecture with physically separate read and write data paths-no shared bidirectional bus-enabling simultaneous access without arbitration delay. Its PLL-synchronized echo clocks (CQ/CQ) align output timing to system capture logic, while DOFF pin control allows runtime switching between 2-cycle (QDR II+) and 1-cycle (QDR I) read latency modes.

All address and control inputs are registered on K/K rising edges; data outputs are edge-aligned to CQ/CQ. The device uses synchronous self-timed writes and supports byte-selectable writes via four BWS signals (BWS0–BWS3), enabling partial-word updates without disturbing adjacent bytes in 36-bit words.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 450 MHz - enables 900 MT/s DDR bandwidth per port
Read Latency 2.0 clock cycles (DOFF = HIGH) - deterministic timing for pipeline-constrained systems
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4–1.8 V - supports mixed-voltage board designs
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 450 MHz
Package 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-pin-count memory
Operating Temperature –40 °C to +85 °C - qualified for industrial and telecom infrastructure environments

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXI suffix).

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit parallel data sampled on K/K rising edges during active WPS; supports partial writes via BWS[3:0]
Q[35:0] Synchronous read data output 36-bit parallel data driven on K/K rising edges; valid indicated by QVLD aligned to CQ/CQ
A[18:0] Multiplexed address input 19-bit address latched on K rising edge for both read and write ports; supports 2M-depth addressing
RPS / WPS Port select controls Active-low synchronous enables - RPS initiates read burst, WPS initiates write burst; independent port activation
CQ / CQ DDR echo clocks Free-running, phase-aligned copies of K/K - simplify high-speed data capture without external delay tuning
DOFF PLL enable/disable LOW disables internal PLL, reverts to QDR I mode (1-cycle latency, ≤167 MHz); HIGH enables full QDR II+ operation
ZQ Output impedance calibration Connects to external resistor to ground to set CQ/Q[35:0] drive strength to 0.2×RQ; prevents signal reflection on stub-loaded buses

Key Features

Feature Design Value
Independent read/write ports Eliminates bus turnaround overhead and data contention - enables sustained 900 MT/s full-duplex throughput
Four-word burst architecture Transfers 4 × 36-bit words per address cycle - reduces address bus frequency by 4× versus single-word access
Programmable output impedance (ZQ) Calibrates CQ and Q[35:0] drive strength to match PCB trace impedance - improves signal integrity without external termination
JTAG 1149.1 test access port Enables boundary scan testing and in-system programming - supports production test and debug of dense memory interconnects
DOFF-configurable latency mode Hardware-selectable 1-cycle (QDR I) or 2-cycle (QDR II+) read latency - allows reuse across legacy and next-gen designs

Applications

High-Speed Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/40G Ethernet switch ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-turnaround buffer between ingress parser and egress scheduler pipelines.

Use Value: Concurrent read/write eliminates arbitration stalls, enabling deterministic 2-cycle read response and continuous 900 MT/s write streaming.

Use Scenario: Frame buffering in OTN/framer-based optical transport modules requiring synchronized access to time-division multiplexed data.

IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly with SerDes PHYs and DSP cores via HSTL buses.

Use Value: Echo clocks (CQ/CQ) align output sampling to FPGA IDELAYCTRL, reducing setup/hold margin requirements by >150 ps.

FPGA-Accelerated Protocol Processing Real-Time Network Monitoring

Use Scenario: Deep packet inspection engines implemented on Xilinx Ultrascale+ FPGAs performing parallel rule matching on live traffic streams.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory holding rule tables and state context for parallel match units.

Use Value: Byte-write select (BWS[3:0]) enables atomic 8-bit updates to match counters without corrupting adjacent 36-bit entries.

Use Scenario: In-line network probes capturing flow statistics and anomaly signatures at wire speed for security analytics platforms.

IC Role / Device Role / Timing Role: Burst-accessed FIFO buffer feeding statistical aggregation logic with timestamped packet samples.

Use Value: QVLD pin provides unambiguous data-valid indication synchronized to echo clocks - eliminates metastability risk in high-frequency capture logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36150L10BG 36-Mbit (1M × 36), 1000 MHz DDR interface, 1.5V core, no DOFF latency selection Limited density (½ capacity); lacks QDR II+ burst coherency and ZQ calibration Select when lower cost and simpler timing closure outweigh need for 72-Mbit depth and impedance tuning
ISSI IS61WV102436BLL-150BLI 36-Mbit (1M × 36), 150 MHz async SRAM, no DDR, no echo clocks, no PLL Asynchronous interface only; unsuitable for 450 MHz burst systems requiring deterministic latency Consider only for legacy control-plane buffers where bandwidth < 300 MB/s and latency tolerance > 10 ns

Compared with IDT72T36150L10BG and IS61WV102436BLL-150BLI, CY7C1545KV18-450BZXI uniquely delivers 72-Mbit density with 2-cycle deterministic latency, on-die impedance calibration, and hardware-selectable QDR I/II+ modes-making it the only option meeting full-duplex 900 MT/s requirements in modern packet-processing architectures.

Availability

CY7C1545KV18-450BZXI is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, FPGA-based protocol accelerators, and real-time monitoring systems requiring stable component supply across multi-year production cycles.

Supply support for CY7C1545KV18-450BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

CY7C1545KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure where bus turnaround elimination and precise timing alignment are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1545KV18-450BZXI?

The DOFF (PLL Disable) pin is an active-low control that disables the internal Phase-Locked Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. When held HIGH (typically via 10 kΩ pull-up), the PLL is enabled, supporting full QDR II+ operation at 450 MHz with 2-cycle latency. This pin allows hardware-level mode selection without firmware intervention.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external precision resistor (typically 50 Ω) to ground, enabling on-die calibration of CQ, CQ, and Q[35:0] output driver impedance. This sets output strength to 0.2 × RQ (e.g., 10 Ω for 50 Ω reference), matching common PCB trace impedances and minimizing reflections. Leaving ZQ unconnected or tied to GND violates specification and causes undefined drive strength, risking signal integrity failure above 200 MHz.

Can CY7C1545KV18-450BZXI perform partial writes without reading-modify-write cycles?

Yes. Four independent byte-write select signals (BWS0–BWS3) allow selective updating of individual 8-bit segments within each 36-bit word. Each BWS controls nine bits: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. When a BWS is deasserted (HIGH), its corresponding byte remains unchanged during the write cycle-no read-modify-write sequence is required.

What is the role of CQ and CQ echo clocks in system timing design?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They are sourced from the same internal PLL path as the data outputs and provide a timing reference for capturing Q[35:0] at the receiver. Because CQ/CQ track data path delays, they eliminate the need for manual PCB trace length matching or external delay elements-simplifying high-speed layout and improving timing margin by up to 200 ps compared to using K/K directly.

CY7C1545KV18-450BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1545KV18-450BZXI FAQ

1.How can I place an order for CY7C1545KV18-450BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1545KV18-450BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1545KV18-450BZXI reliable?

The price and inventory of CY7C1545KV18-450BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1545KV18-450BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1545KV18-450BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1545KV18-450BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1545KV18-450BZXI?

CY7C1545KV18-450BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1545KV18-450BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1545KV18-450BZXI?

For technical support, including CY7C1545KV18-450BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1545KV18-450BZXI requirements.

6.How does Aetrix verify that CY7C1545KV18-450BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1545KV18-450BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1545KV18-450BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1545KV18-450BZXI?

All CY7C1545KV18-450BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1545KV18-450BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1545KV18-450BZXI part is unused and in its original packaging.

Return procedure for CY7C1545KV18-450BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1545KV18-450BZXI Tags

  • CY7C1545KV18-450BZXI
  • CY7C1545KV18-450BZXI PDF
  • CY7C1545KV18-450BZXI Datasheet
  • CY7C1545KV18-450BZXI Specifications
  • CY7C1545KV18-450BZXI Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C1545KV18-450BZXI
  • Buy CY7C1545KV18-450BZXI
  • CY7C1545KV18-450BZXI Price
  • CY7C1545KV18-450BZXI Distributor
  • CY7C1545KV18-450BZXI Supplier
  • CY7C1545KV18-450BZXI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER