Cypress Semiconductor Corp CY7C1548KV18-450BZC
- Part No.:
- CY7C1548KV18-450BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1548KV18-450BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,928
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1548KV18 from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR II+ synchronous SRAM with two-word burst architecture, 2.0-cycle read latency, and 450 MHz clock operation. It delivers 900 Mbps data transfer via double-data-rate interface, uses HSTL I/O with 1.8 V core/1.4–1.8 V I/O supply, and integrates echo clocks (CQ/CQ) and QVLD for precise high-speed data capture in networking and telecom buffer applications.
For engineers reviewing the CY7C1548KV18 datasheet, CY7C1548KV18 pinout, CY7C1548KV18 application, or CY7C1548KV18 equivalent, key selection criteria include DDR II+ timing compliance, 165-ball FBGA package compatibility, DOFF-controlled latency mode switching (2.0-cycle vs. 1-cycle), and JTAG 1149.1 test access support for system-level validation.
Technical Context
The device implements a synchronous pipelined SRAM core with dual-edge DDR interface: address and control signals are latched on rising edges of K clock only, while write data is registered on both K and K rising edges, and read data is driven synchronously on both K and K rising edges. Internal organization comprises two 2M × 18 arrays enabling concurrent burst access.
It features an integrated PLL for accurate data placement, echo clocks CQ/CQ aligned to K/K for simplified receiver timing, and QVLD signal edge-aligned to CQ/CQ to indicate valid output data windows. The DOFF pin selects between DDR II+ (2-cycle latency, up to 450 MHz) and DDR I mode (1-cycle latency, ≤167 MHz), with distinct AC timing requirements per mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit, 4M × 18 (two 2M × 18 arrays) |
| Max Clock Frequency | 450 MHz - enables 900 Mbps DDR data rate |
| Read Latency | 2.0 clock cycles (DOFF = HIGH); 1 cycle (DOFF = LOW) |
| Supply Voltages | VDD = 1.8 V ± 0.1 V; VDDQ = 1.4 V to 1.8 V - supports mixed-voltage I/O interfaces |
| I/O Standard | HSTL Class I inputs, variable-drive HSTL outputs - ensures signal integrity at >400 MHz |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density memory subsystems |
| Special Functions | Integrated PLL, echo clocks (CQ/CQ), QVLD, ZQ impedance calibration, JTAG 1149.1 TAP |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; sampled on K/K rising edges for writes, driven on K/K rising edges for reads |
| K / K | Differential input clocks | K captures address/control; both K and K register write data and drive read data - defines DDR timing reference |
| CQ / CQ | Output echo clocks | Free-running, K-synchronized clocks for external data capture - eliminates per-device skew compensation |
| QVLD | Valid data indicator | Edge-aligned with CQ/CQ; asserts during valid data windows - enables reliable latch timing in FPGA/ASIC receivers |
| DOFF | PLL disable control | Active-LOW; disables internal PLL to switch to DDR I mode (1-cycle latency, ≤167 MHz) - provides backward compatibility |
| ZQ | Impedance calibration reference | Connects to external resistor to ground; tunes CQ/CQ/DQ output impedance to 0.2 × RQ - matches PCB trace impedance |
| LD | Load strobe | Sampled on K rising edge; initiates burst transaction - defines address and R/W direction for next two words |
| BWS[1:0] | Byte write select | Active-LOW controls DQ[8:0] (BWS0) and DQ[17:9] (BWS1); enables partial-word writes without read-modify-write overhead |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling by 50% versus single-word SRAMs - lowers EMI and simplifies controller logic |
| DDR II+ with 2.0-cycle latency | Delivers deterministic 450 MHz operation with guaranteed setup/hold margins - eliminates dynamic latency tuning in ASIC/FPGA designs |
| Integrated echo clocks (CQ/CQ) | Eliminates need for board-level clock forwarding or deskew circuitry - reduces routing complexity and interconnect jitter |
| QVLD synchronized to echo clocks | Provides unambiguous data validity window referenced to CQ/CQ edges - enables single-cycle capture in high-speed receivers |
| ZQ impedance calibration | Compensates for process/voltage/temperature drift in output driver impedance - maintains signal integrity across operating conditions |
Applications
| High-Speed Network Packet Buffer | Telecom Line Card Data Cache |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in 10G/25G line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port burst SRAM acting as ingress/egress FIFO buffer; K/K clocks synchronized to SERDES reference; CQ/CQ used for FPGA data capture. Use Value: 2-word burst + 450 MHz clock enables full packet buffering at wire speed without pipeline stalls or external arbitration logic. |
Use Scenario: Caching real-time voice/video payload in multi-channel TDM-over-IP gateways requiring sub-10 ns timing precision. IC Role / Device Role / Timing Role: Synchronous DDR II+ SRAM providing deterministic read/write access; QVLD aligns with FPGA sampling clock to eliminate metastability risk. Use Value: Integrated PLL and echo clocks ensure <±50 ps data-eye alignment across temperature - meets GR-1089 EMC and ITU-T G.823 jitter specs. |
| Baseband Processing Memory | Radar Signal Processing Buffer |
|
Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE/5G baseband ASICs. IC Role / Device Role / Timing Role: Burst-access SRAM interfaced to ASIC's DDR controller; DOFF pin tied HIGH for 2-cycle latency mode to match processing pipeline depth. Use Value: HSTL I/O and 1.4 V VDDQ reduce switching power by 35% vs. SSTL-18 - critical for thermally constrained RF modules. |
Use Scenario: Capturing and buffering high-resolution chirp samples in phased-array radar front-ends operating at 400+ MSPS. IC Role / Device Role / Timing Role: Low-latency memory buffer feeding FPGA-based beamforming engines; ZQ calibration maintains 50 Ω output match over -40°C to +105°C. Use Value: 165-ball FBGA footprint allows dense placement adjacent to ADC/DAC; 1.8 V core minimizes noise coupling into analog sections. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256PFS-15BIN | QDR-II, 36-Mbit (2M × 18), 300 MHz max, no integrated PLL or echo clocks | Lacks CQ/CQ and QVLD; requires external clock forwarding and capture logic | Select when cost sensitivity outweighs timing margin needs and system clocking infrastructure already supports QDR-II timing |
| IS61WV102418BLL-15BLI | Async SRAM, 18-Mbit (512K × 36), 15 ns access, single-data-rate, no burst or DDR interface | No clock domain crossing support; incompatible with DDR II+ controller interfaces | Only viable for legacy systems where DDR II+ features are unused and bandwidth demand ≤1.2 Gbps |
Compared with AS7C36256PFS-15BIN and IS61WV102418BLL-15BLI, CY7C1548KV18 uniquely delivers 450 MHz DDR II+ operation with integrated echo clocks and QVLD-enabling direct FPGA interface without external timing compensation, while its 72-Mbit density supports deeper buffering in space-constrained telecom and defense platforms.
Availability
CY7C1548KV18 is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card caches, baseband processing memories, and radar signal processing buffers requiring stable component supply and long-term industrial availability.
Supply support for CY7C1548KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
CY7C1548KV18 belongs to Cypress's QDR II+/DDR II+ SRAM product line, designed specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched infrastructure and real-time signal processing systems.
FAQ
What is the function of the DOFF pin?
The DOFF pin is an active-low PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH (or pulled up via ≤10 kΩ resistor), the PLL is enabled for DDR II+ mode with 2.0-cycle latency and up to 450 MHz clocking. This pin directly determines timing mode and frequency capability.
How does ZQ calibration work and what external component is required?
ZQ calibration adjusts the output driver impedance of DQ, CQ, and CQ pins to match the system data bus. A precision resistor (RQ) must be connected between ZQ and ground; the device sets output impedance to 0.2 × RQ. For example, a 240 Ω resistor yields 48 Ω driver impedance. ZQ must never be left floating or tied to GND - doing so disables calibration and risks signal integrity failure.
Can CY7C1548KV18 operate with only the K clock, or is K mandatory?
K is mandatory for full DDR II+ functionality. While address and control signals use only K, write data registration and read data driving require both K and K rising edges. Omitting K breaks DDR timing: write data cannot be latched correctly, and read data will not appear on both clock edges. The device will not operate reliably in DDR mode without both differential clocks present and properly terminated.
What is the role of QVLD, and how should it be used in FPGA interface design?
QVLD is a synchronous output that pulses HIGH during valid data windows on DQ[17:0], edge-aligned precisely with CQ and CQ. In FPGA designs, QVLD should be used as the enable signal for the input register capturing DQ data - not as a clock. This avoids metastability and ensures sampling occurs only when data meets setup/hold relative to CQ/CQ, eliminating need for manual timing closure of wide DDR buses.
CY7C1548KV18-450BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1548KV18-450BZC FAQ
1.How can I place an order for CY7C1548KV18-450BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1548KV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1548KV18-450BZC reliable?
The price and inventory of CY7C1548KV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1548KV18-450BZC is usually 5 days.
3.What payment methods are accepted for CY7C1548KV18-450BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1548KV18-450BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1548KV18-450BZC?
CY7C1548KV18-450BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1548KV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1548KV18-450BZC?
For technical support, including CY7C1548KV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1548KV18-450BZC requirements.
6.How does Aetrix verify that CY7C1548KV18-450BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1548KV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1548KV18-450BZC meets industry standards.
7.What is the process for return or replacement of CY7C1548KV18-450BZC?
All CY7C1548KV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1548KV18-450BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1548KV18-450BZC part is unused and in its original packaging.
Return procedure for CY7C1548KV18-450BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1548KV18-450BZC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

