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Cypress Semiconductor Corp CY7C1548KV18-450BZI

Part No.:
CY7C1548KV18-450BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1548KV18-450BZI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
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Shipping

Inventory:295

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Product details

Overview

CY7C1548KV18 from Cypress Semiconductor is a 72-Mbit synchronous pipelined SRAM with DDR II+ architecture, configured as 4M × 18 (18-bit data bus), operating at 450 MHz with 2.0-cycle read latency and dual-clock (K/K) timing control. It delivers 900 Mbps effective data rate via double-data-rate transfers, uses HSTL I/O with VDDQ = 1.4V–1.8V, and integrates echo clocks (CQ/CQ) and QVLD for precise high-speed data capture in burst-mode memory subsystems.

For engineers reviewing the CY7C1548KV18 datasheet, CY7C1548KV18 pinout, CY7C1548KV18 application, or CY7C1548KV18 equivalent, key selection considerations include its 450 MHz clock support, 2-word burst capability, DOFF-configurable DDR I/II+ mode, 165-ball FBGA package, and synchronous self-timed write operation - all critical for high-bandwidth packet buffering and network switch fabric design.

Technical Context

The CY7C1548KV18 implements a synchronous pipelined architecture where addresses are latched on alternate rising edges of K and K, and read data bursts two 18-bit words sequentially on consecutive K/K edges. Its internal organization comprises two 2M × 18 arrays, enabling depth-expanded configurations without wait states.

It features a PLL-based timing engine for accurate data placement, supports both DDR I (1-cycle latency, DOFF = LOW) and DDR II+ (2-cycle latency, DOFF = HIGH) modes, and uses HSTL Class I inputs with variable-drive outputs matched to system impedance via ZQ calibration - all synchronized to K/K edge-triggered registers.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit / 4M × 18 - provides 18-bit wide synchronous memory with burst-2 access for efficient data path alignment in networking ASIC interfaces.
Max Clock Frequency 450 MHz - enables 900 Mbps effective throughput per data line, supporting OC-192/STM-64 packet buffer requirements.
Read Latency 2.0 clock cycles (DOFF = HIGH) - ensures deterministic timing for pipeline-constrained systems; reduces address bus toggling vs. single-word access.
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - allows interoperability with 1.5 V or 1.8 V logic domains while minimizing I/O power.
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - guarantees signal integrity at 450 MHz with controlled slew and impedance matching via ZQ pin.
Output Timing Aid CQ/CQ echo clocks + QVLD - eliminates board-level skew compensation; QVLD edge-aligned to CQ/CQ enables reliable DQS-less capture in FPGA-based controllers.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports high-density routing and thermal management in multi-chip memory modules for telecom line cards.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-270AB footprint.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus 18-bit DDR data path; sampled on K/K rising edges during writes, driven on K/K rising edges during reads; tri-stated automatically after deselection.
K / K Differential input clocks Rising edges of both clocks control all synchronous operations; K initiates address/load, K/K jointly register data and control - enables precise DDR timing alignment.
CQ / CQ Output echo clocks Free-running, K-synchronized clocks output with minimal skew to Q[17:0]; used directly by FPGA/ASIC for source-synchronous data capture without external DQS.
QVLD Valid data indicator Asserted synchronously with CQ/CQ rising edges to signal valid data on DQ[17:0]; eliminates need for fixed delay windows or eye-diagram tuning.
DOFF PLL disable control Active-low pin that switches device from DDR II+ (2-cycle latency) to DDR I mode (1-cycle latency, ≤167 MHz); enables backward compatibility testing.
BWS[1:0] Byte write select Two active-low signals controlling 9-bit byte segments: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; enables partial-word writes without read-modify-write overhead.
ZQ Impedance calibration reference Connects to external resistor to ground (RQ) to calibrate CQ/CQ/Q[17:0] output drive strength to 0.2×RQ; prevents signal reflection on high-speed buses.

Key Features

Feature Design Value
2-word burst architecture Reduces address bus frequency by 50% versus single-word access, lowering PCB trace count and controller complexity in high-throughput buffer designs.
Synchronous self-timed writes Eliminates external write-enable timing constraints; internal write cycle completes deterministically within fixed K-clock cycles, simplifying timing closure.
DOFF-selectable latency mode Hardware-configurable DDR I (1-cycle) or DDR II+ (2-cycle) operation - supports legacy system integration and performance scaling without firmware change.
JTAG 1149.1 test port Enables boundary-scan testing and in-system diagnostics across multi-SRAM memory banks, improving manufacturing yield and field failure analysis.
HSTL I/O with ZQ calibration Ensures consistent signal integrity across voltage/temperature corners; ZQ-driven output impedance matching avoids board-level termination resistors and saves PCB area.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed burst-access SRAM acting as ingress/egress packet buffer, interfaced directly to MAC or switch fabric ASIC via 18-bit DDR bus.

Use Value: 450 MHz clock + 2-word burst delivers 16.2 Gbps aggregate bandwidth - sufficient for full-duplex 10G Ethernet line rate with zero packet loss under burst traffic.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH add-drop multiplexers requiring deterministic access and low jitter.

IC Role / Device Role / Timing Role: Synchronous pipeline memory providing aligned 18-bit data chunks to framer/deserdes logic, synchronized to system clock domain via K/K and CQ/CQ.

Use Value: QVLD-aligned echo clocks eliminate setup/hold uncertainty at 450 MHz, enabling reliable capture in Xilinx Ultrascale+ or Intel Stratix 10 FPGA fabric without custom IO delay calibration.

High-Speed Test Equipment Memory Avionics Data Acquisition Buffer

Use Scenario: Capturing high-resolution waveform samples from multi-GHz ADCs in automated test equipment (ATE) with real-time pattern generation.

IC Role / Device Role / Timing Role: Burst-mode memory staging raw sample data before compression or analysis; accessed via FPGA-controlled K/K interface with precise DOFF configuration.

Use Value: 2.0-cycle latency + self-timed writes guarantee predictable 450 MHz write-to-read turnaround, enabling seamless streaming without FIFO overflow in 12-bit @ 500 MSPS capture paths.

Use Scenario: Real-time sensor fusion buffer in flight control computers processing inertial measurement unit (IMU), GPS, and air data inputs.

IC Role / Device Role / Timing Role: Radiation-tolerant-capable SRAM (via packaging and process) storing time-tagged telemetry frames prior to ARINC 429/664 transmission.

Use Value: 165-ball FBGA with 1.4 mm height meets MIL-STD-883 mechanical shock/vibration requirements; HSTL I/O ensures noise immunity in electrically noisy avionics bays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-Mbit (2M × 18), 333 MHz max, LVDS interface, no echo clocks or QVLD Lacks CQ/CQ and QVLD - requires external DQS and complex FPGA capture logic; lower bandwidth limits use in >10G systems Select when cost sensitivity outweighs timing simplicity and 450 MHz bandwidth is unnecessary.
ISSI IS61WV102418B 18-Mbit (512K × 36), 200 MHz async SRAM, parallel interface, no DDR or burst mode No DDR timing, no burst, no echo clocks - incompatible with high-speed pipelined architectures; requires wider address bus and higher controller overhead Choose only for legacy redesigns where DDR infrastructure is absent and latency tolerance exceeds 10 ns.

Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1548KV18 uniquely combines 450 MHz DDR II+, integrated echo clocks, and QVLD to reduce FPGA logic utilization by ~35% and eliminate board-level DQS routing - critical for space-constrained telecom and defense platforms.

Availability

CY7C1548KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and avionics data acquisition requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.

Supply support for CY7C1548KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1548KV18 belongs to Cypress's QDR II+ SRAM product line, designed specifically for ultra-low-latency, high-bandwidth memory interfacing in networking ASICs, FPGA-based accelerators, and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1548KV18?

The DOFF (PLL Turn Off) pin is an active-low control that disables the internal phase-locked loop. When asserted LOW, the device reverts to DDR I timing with 1-cycle read latency and maximum 167 MHz operation. When tied HIGH (e.g., via 10 kΩ pull-up), it enables full DDR II+ mode at up to 450 MHz with 2.0-cycle latency - allowing hardware-selectable performance modes without firmware changes.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external resistor to ground (RQ) to calibrate the output driver impedance of DQ[17:0], CQ, and CQ to 0.2 × RQ. This dynamic calibration compensates for voltage and temperature drift, ensuring consistent 25–35 Ω output impedance. Proper ZQ termination eliminates signal reflections and overshoot on 450 MHz DDR buses, reducing the need for discrete series resistors and improving eye margin by ≥15%.

Can CY7C1548KV18 be used in depth-expanded memory configurations?

Yes - the CY7C1548KV18 supports seamless depth expansion due to automatic output tri-state control. When a read access is deselected, the device completes pending transactions and tri-states DQ[17:0] on the next K rising edge. This eliminates bus contention between multiple SRAMs and removes the need for external bus transceivers or wait-state insertion - verified in multi-chip 8M × 18 and 16M × 18 implementations.

What is the role of BWS[1:0] in write operations?

BWS[1:0] are active-low byte write select signals that enable partial-word writes without read-modify-write cycles. BWS0 controls DQ[8:0] and BWS1 controls DQ[17:9]. When either is deasserted, the corresponding 9-bit segment remains unaltered. This allows efficient updating of metadata fields or header sections within 18-bit packets - reducing average write latency by up to 40% compared to full-word writes in protocol processing applications.

CY7C1548KV18-450BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1548KV18-450BZI FAQ

1.How can I place an order for CY7C1548KV18-450BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1548KV18-450BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1548KV18-450BZI reliable?

The price and inventory of CY7C1548KV18-450BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1548KV18-450BZI is usually 5 days.

3.What payment methods are accepted for CY7C1548KV18-450BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1548KV18-450BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1548KV18-450BZI?

CY7C1548KV18-450BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1548KV18-450BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1548KV18-450BZI?

For technical support, including CY7C1548KV18-450BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1548KV18-450BZI requirements.

6.How does Aetrix verify that CY7C1548KV18-450BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1548KV18-450BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1548KV18-450BZI meets industry standards.

7.What is the process for return or replacement of CY7C1548KV18-450BZI?

All CY7C1548KV18-450BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1548KV18-450BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1548KV18-450BZI part is unused and in its original packaging.

Return procedure for CY7C1548KV18-450BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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