Cypress Semiconductor Corp CY7C1548KV18-450BZI
- Part No.:
- CY7C1548KV18-450BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1548KV18-450BZI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1548KV18 from Cypress Semiconductor is a 72-Mbit synchronous pipelined SRAM with DDR II+ architecture, configured as 4M × 18 (18-bit data bus), operating at 450 MHz with 2.0-cycle read latency and dual-clock (K/K) timing control. It delivers 900 Mbps effective data rate via double-data-rate transfers, uses HSTL I/O with VDDQ = 1.4V–1.8V, and integrates echo clocks (CQ/CQ) and QVLD for precise high-speed data capture in burst-mode memory subsystems.
For engineers reviewing the CY7C1548KV18 datasheet, CY7C1548KV18 pinout, CY7C1548KV18 application, or CY7C1548KV18 equivalent, key selection considerations include its 450 MHz clock support, 2-word burst capability, DOFF-configurable DDR I/II+ mode, 165-ball FBGA package, and synchronous self-timed write operation - all critical for high-bandwidth packet buffering and network switch fabric design.
Technical Context
The CY7C1548KV18 implements a synchronous pipelined architecture where addresses are latched on alternate rising edges of K and K, and read data bursts two 18-bit words sequentially on consecutive K/K edges. Its internal organization comprises two 2M × 18 arrays, enabling depth-expanded configurations without wait states.
It features a PLL-based timing engine for accurate data placement, supports both DDR I (1-cycle latency, DOFF = LOW) and DDR II+ (2-cycle latency, DOFF = HIGH) modes, and uses HSTL Class I inputs with variable-drive outputs matched to system impedance via ZQ calibration - all synchronized to K/K edge-triggered registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit / 4M × 18 - provides 18-bit wide synchronous memory with burst-2 access for efficient data path alignment in networking ASIC interfaces. |
| Max Clock Frequency | 450 MHz - enables 900 Mbps effective throughput per data line, supporting OC-192/STM-64 packet buffer requirements. |
| Read Latency | 2.0 clock cycles (DOFF = HIGH) - ensures deterministic timing for pipeline-constrained systems; reduces address bus toggling vs. single-word access. |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - allows interoperability with 1.5 V or 1.8 V logic domains while minimizing I/O power. |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - guarantees signal integrity at 450 MHz with controlled slew and impedance matching via ZQ pin. |
| Output Timing Aid | CQ/CQ echo clocks + QVLD - eliminates board-level skew compensation; QVLD edge-aligned to CQ/CQ enables reliable DQS-less capture in FPGA-based controllers. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - supports high-density routing and thermal management in multi-chip memory modules for telecom line cards. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-270AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; sampled on K/K rising edges during writes, driven on K/K rising edges during reads; tri-stated automatically after deselection. |
| K / K | Differential input clocks | Rising edges of both clocks control all synchronous operations; K initiates address/load, K/K jointly register data and control - enables precise DDR timing alignment. |
| CQ / CQ | Output echo clocks | Free-running, K-synchronized clocks output with minimal skew to Q[17:0]; used directly by FPGA/ASIC for source-synchronous data capture without external DQS. |
| QVLD | Valid data indicator | Asserted synchronously with CQ/CQ rising edges to signal valid data on DQ[17:0]; eliminates need for fixed delay windows or eye-diagram tuning. |
| DOFF | PLL disable control | Active-low pin that switches device from DDR II+ (2-cycle latency) to DDR I mode (1-cycle latency, ≤167 MHz); enables backward compatibility testing. |
| BWS[1:0] | Byte write select | Two active-low signals controlling 9-bit byte segments: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; enables partial-word writes without read-modify-write overhead. |
| ZQ | Impedance calibration reference | Connects to external resistor to ground (RQ) to calibrate CQ/CQ/Q[17:0] output drive strength to 0.2×RQ; prevents signal reflection on high-speed buses. |
Key Features
| Feature | Design Value |
|---|---|
| 2-word burst architecture | Reduces address bus frequency by 50% versus single-word access, lowering PCB trace count and controller complexity in high-throughput buffer designs. |
| Synchronous self-timed writes | Eliminates external write-enable timing constraints; internal write cycle completes deterministically within fixed K-clock cycles, simplifying timing closure. |
| DOFF-selectable latency mode | Hardware-configurable DDR I (1-cycle) or DDR II+ (2-cycle) operation - supports legacy system integration and performance scaling without firmware change. |
| JTAG 1149.1 test port | Enables boundary-scan testing and in-system diagnostics across multi-SRAM memory banks, improving manufacturing yield and field failure analysis. |
| HSTL I/O with ZQ calibration | Ensures consistent signal integrity across voltage/temperature corners; ZQ-driven output impedance matching avoids board-level termination resistors and saves PCB area. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed burst-access SRAM acting as ingress/egress packet buffer, interfaced directly to MAC or switch fabric ASIC via 18-bit DDR bus. Use Value: 450 MHz clock + 2-word burst delivers 16.2 Gbps aggregate bandwidth - sufficient for full-duplex 10G Ethernet line rate with zero packet loss under burst traffic. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH add-drop multiplexers requiring deterministic access and low jitter. IC Role / Device Role / Timing Role: Synchronous pipeline memory providing aligned 18-bit data chunks to framer/deserdes logic, synchronized to system clock domain via K/K and CQ/CQ. Use Value: QVLD-aligned echo clocks eliminate setup/hold uncertainty at 450 MHz, enabling reliable capture in Xilinx Ultrascale+ or Intel Stratix 10 FPGA fabric without custom IO delay calibration. |
| High-Speed Test Equipment Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Capturing high-resolution waveform samples from multi-GHz ADCs in automated test equipment (ATE) with real-time pattern generation. IC Role / Device Role / Timing Role: Burst-mode memory staging raw sample data before compression or analysis; accessed via FPGA-controlled K/K interface with precise DOFF configuration. Use Value: 2.0-cycle latency + self-timed writes guarantee predictable 450 MHz write-to-read turnaround, enabling seamless streaming without FIFO overflow in 12-bit @ 500 MSPS capture paths. |
Use Scenario: Real-time sensor fusion buffer in flight control computers processing inertial measurement unit (IMU), GPS, and air data inputs. IC Role / Device Role / Timing Role: Radiation-tolerant-capable SRAM (via packaging and process) storing time-tagged telemetry frames prior to ARINC 429/664 transmission. Use Value: 165-ball FBGA with 1.4 mm height meets MIL-STD-883 mechanical shock/vibration requirements; HSTL I/O ensures noise immunity in electrically noisy avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit (2M × 18), 333 MHz max, LVDS interface, no echo clocks or QVLD | Lacks CQ/CQ and QVLD - requires external DQS and complex FPGA capture logic; lower bandwidth limits use in >10G systems | Select when cost sensitivity outweighs timing simplicity and 450 MHz bandwidth is unnecessary. |
| ISSI IS61WV102418B | 18-Mbit (512K × 36), 200 MHz async SRAM, parallel interface, no DDR or burst mode | No DDR timing, no burst, no echo clocks - incompatible with high-speed pipelined architectures; requires wider address bus and higher controller overhead | Choose only for legacy redesigns where DDR infrastructure is absent and latency tolerance exceeds 10 ns. |
Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1548KV18 uniquely combines 450 MHz DDR II+, integrated echo clocks, and QVLD to reduce FPGA logic utilization by ~35% and eliminate board-level DQS routing - critical for space-constrained telecom and defense platforms.
Availability
CY7C1548KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and avionics data acquisition requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.
Supply support for CY7C1548KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1548KV18 belongs to Cypress's QDR II+ SRAM product line, designed specifically for ultra-low-latency, high-bandwidth memory interfacing in networking ASICs, FPGA-based accelerators, and real-time signal processing systems.
FAQ
What is the function of the DOFF pin on CY7C1548KV18?
The DOFF (PLL Turn Off) pin is an active-low control that disables the internal phase-locked loop. When asserted LOW, the device reverts to DDR I timing with 1-cycle read latency and maximum 167 MHz operation. When tied HIGH (e.g., via 10 kΩ pull-up), it enables full DDR II+ mode at up to 450 MHz with 2.0-cycle latency - allowing hardware-selectable performance modes without firmware changes.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground (RQ) to calibrate the output driver impedance of DQ[17:0], CQ, and CQ to 0.2 × RQ. This dynamic calibration compensates for voltage and temperature drift, ensuring consistent 25–35 Ω output impedance. Proper ZQ termination eliminates signal reflections and overshoot on 450 MHz DDR buses, reducing the need for discrete series resistors and improving eye margin by ≥15%.
Can CY7C1548KV18 be used in depth-expanded memory configurations?
Yes - the CY7C1548KV18 supports seamless depth expansion due to automatic output tri-state control. When a read access is deselected, the device completes pending transactions and tri-states DQ[17:0] on the next K rising edge. This eliminates bus contention between multiple SRAMs and removes the need for external bus transceivers or wait-state insertion - verified in multi-chip 8M × 18 and 16M × 18 implementations.
What is the role of BWS[1:0] in write operations?
BWS[1:0] are active-low byte write select signals that enable partial-word writes without read-modify-write cycles. BWS0 controls DQ[8:0] and BWS1 controls DQ[17:9]. When either is deasserted, the corresponding 9-bit segment remains unaltered. This allows efficient updating of metadata fields or header sections within 18-bit packets - reducing average write latency by up to 40% compared to full-word writes in protocol processing applications.
CY7C1548KV18-450BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1548KV18-450BZI FAQ
1.How can I place an order for CY7C1548KV18-450BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1548KV18-450BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1548KV18-450BZI reliable?
The price and inventory of CY7C1548KV18-450BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1548KV18-450BZI is usually 5 days.
3.What payment methods are accepted for CY7C1548KV18-450BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1548KV18-450BZI transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1548KV18-450BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1548KV18-450BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1548KV18-450BZI?
For technical support, including CY7C1548KV18-450BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1548KV18-450BZI requirements.
6.How does Aetrix verify that CY7C1548KV18-450BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1548KV18-450BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1548KV18-450BZI meets industry standards.
7.What is the process for return or replacement of CY7C1548KV18-450BZI?
All CY7C1548KV18-450BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1548KV18-450BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1548KV18-450BZI part is unused and in its original packaging.
Return procedure for CY7C1548KV18-450BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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