Cypress Semiconductor Corp CY7C1562XV18-366BZC
- Part No.:
- CY7C1562XV18-366BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1562XV18-366BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:119
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Product details
Overview
CY7C1562XV18-366BZC from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8 V core, QDR® II+ Xtreme SRAM with separate read/write ports, 2.5-cycle read latency, 450 MHz clock support, and DDR interfaces delivering 900 MT/s data rate. It enables high-bandwidth packet buffering in network line cards and telecom switching fabric where concurrent read/write operations at 450 MHz are required.
For engineers reviewing the CY7C1562XV18-366BZC datasheet, CY7C1562XV18-366BZC pinout, CY7C1562XV18-366BZC application, or CY7C1562XV18-366BZC equivalent, key selection criteria include burst depth (2-word), DOFF-controlled latency mode (2.5-cycle vs. 1-cycle), HSTL I/O compatibility (1.4–1.6 V VDDQ), echo clock timing (CQ/CQ), and JTAG 1149.1 test access.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 21-bit address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling full concurrency without bus turnaround.
It integrates a PLL for precise data placement and supports two operational modes: QDR-II+ mode (DOFF = HIGH, 2.5-cycle latency, up to 450 MHz) and QDR-I mode (DOFF = LOW, 1-cycle latency, up to 167 MHz). Echo clocks CQ and CQ are free-running and edge-aligned to K/K for simplified high-speed capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization) |
| Max Clock Frequency | 450 MHz - enables 900 MT/s DDR throughput per port |
| Read Latency | 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline-synchronized systems |
| Core / I/O Voltage | VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.6 V - supports 1.5 V HSTL I/O interface |
| Burst Length | Two-word burst - reduces address bus toggling frequency by 50% vs. single-word |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory modules |
| Standards Compliance | JTAG IEEE 1149.1 - enables boundary scan testing and system-level debug |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS0/BWS1 |
| Q[17:0] | Synchronous read data output | DDR output driven on K/K rising edges; tristated when RPS inactive |
| RPS / WPS | Read/Write Port Select | Active-low control; enables concurrent but independent port activation |
| K / K | Positive/Negative input clocks | Rising-edge-triggered; drive all synchronous inputs/outputs; no internal inversion |
| CQ / CQ | Read/Write echo clocks | Free-running, edge-aligned outputs for reliable DDR data capture at 450 MHz |
| QVLD | Valid data indicator | Asserted synchronously with CQ/CQ rising edge; signals valid Q[17:0] data |
| DOFF | PLL disable control | LOW forces QDR-I mode (1-cycle latency, ≤167 MHz); HIGH enables QDR-II+ mode |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune CQ/Q[17:0] output drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround overhead and prevents contention in full-duplex systems |
| Two-word burst architecture | Halves effective address bus frequency while maintaining peak bandwidth |
| HSTL-compatible I/Os | Supports 1.5 V signaling with variable drive strength calibrated via ZQ pin |
| Programmable latency mode | DOFF pin selects between 2.5-cycle (QDR-II+) and 1-cycle (QDR-I) read latency |
| Integrated PLL + echo clocks | Enables deterministic setup/hold margins for 900 MT/s DDR transfers at PCB level |
Applications
| Network Packet Buffering | Telecom Switch Fabric |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-in-first-out (FIFO) buffer with simultaneous ingress (write) and egress (read) paths. Use Value: 2.5-cycle latency and 450 MHz operation enable ≥1.6 Gbps sustained throughput per port without arbitration delay. |
Use Scenario: Interfacing line cards to centralized switch fabric in carrier-grade routers requiring non-blocking data flow. IC Role / Device Role / Timing Role: High-speed shared memory node supporting concurrent read/write access from multiple ASICs. Use Value: Independent RPS/WPS controls allow time-multiplexed access coordination across distributed control planes. |
| Baseband Processing | Test Equipment Memory Buffer |
|
Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE/5G baseband units. IC Role / Device Role / Timing Role: Burst-mode SRAM providing low-jitter, deterministic latency for real-time signal processing pipelines. Use Value: Echo clocks CQ/CQ align precisely with Q[17:0] transitions, simplifying FPGA capture logic at 450 MHz. |
Use Scenario: Capturing high-speed serial data streams (e.g., PCIe Gen3, SATA III) in automated test equipment for protocol analysis. IC Role / Device Role / Timing Role: Deep, dual-port memory buffer acquiring bursts of data while simultaneously streaming to host processor. Use Value: Full data coherency ensures latest-written data is always available on read, critical for real-time validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256PFS-15BIN | Asynchronous, 256K × 36, 3.3 V, no DDR or echo clocks | Lacks concurrent read/write; limited to ≤15 ns access, unsuitable for 450 MHz systems | Select only for legacy designs requiring pin-compatible drop-in replacement with relaxed timing |
| MT47H64M16HR-37E | DDR2 SDRAM, 64M × 16, 333 MHz, requires refresh and command sequencing | Higher density but adds controller complexity; not deterministic latency | Choose when cost-per-bit outweighs latency predictability and simplicity of SRAM interface |
Compared with AS7C36256PFS-15BIN and MT47H64M16HR-37E, CY7C1562XV18-366BZC delivers guaranteed 2.5-cycle latency, zero-refresh operation, and true concurrent access-critical for real-time packet processing where jitter and arbitration delay are unacceptable.
Availability
CY7C1562XV18-366BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, and baseband processing applications requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY7C1562XV18-366BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1562XV18 belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-throughput memory interfacing in networking and telecom infrastructure where bus turnaround elimination and sub-3-cycle latency are mandatory.
FAQ
What is the function of the DOFF pin?
The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR-II+ mode with 2.5-cycle read latency and supports up to 450 MHz; when pulled LOW, it disables the PLL and reverts to QDR-I mode with 1-cycle latency and a maximum frequency of 167 MHz. This allows backward compatibility and flexible timing tuning without changing hardware layout.
How does the two-word burst architecture improve system performance?
The two-word burst reduces address bus activity by half compared to single-word access-each clock cycle transfers two consecutive 18-bit words from one address location. This cuts address decode complexity, lowers PCB routing congestion, and maintains full 900 MT/s bandwidth while easing timing closure on the address path, especially in dense FPGA-based systems.
Can CY7C1562XV18-366BZC be used with 1.5 V I/O voltage?
Yes. The device specifies VDDQ = 1.4 V to 1.6 V, making 1.5 V fully compliant. Its HSTL-compatible I/O buffers are designed for this range, and output drive strength can be calibrated using the ZQ pin connected to an external resistor to ground-ensuring signal integrity across process/voltage/temperature corners.
What is the role of CQ and CQ echo clocks?
CQ and CQ are free-running, edge-aligned echo clocks synchronized to K and K respectively. They provide a clean, low-skew reference for capturing Q[17:0] data in the receiving FPGA or ASIC-eliminating the need for complex phase alignment circuitry and enabling robust 900 MT/s DDR data recovery without additional PLLs or delay-locked loops.
CY7C1562XV18-366BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 366 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1562XV18-366BZC FAQ
1.How can I place an order for CY7C1562XV18-366BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1562XV18-366BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1562XV18-366BZC reliable?
The price and inventory of CY7C1562XV18-366BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1562XV18-366BZC is usually 5 days.
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Note: Certain payment methods may incur a processing fee.
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CY7C1562XV18-366BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1562XV18-366BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1562XV18-366BZC?
For technical support, including CY7C1562XV18-366BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1562XV18-366BZC requirements.
6.How does Aetrix verify that CY7C1562XV18-366BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1562XV18-366BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1562XV18-366BZC meets industry standards.
7.What is the process for return or replacement of CY7C1562XV18-366BZC?
All CY7C1562XV18-366BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1562XV18-366BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1562XV18-366BZC part is unused and in its original packaging.
Return procedure for CY7C1562XV18-366BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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