Cypress Semiconductor Corp CY7C15632KV18-400BZXC

Overview

CY7C15632KV18-400BZXC from Infineon Technologies (formerly Cypress) is a 72-Mbit QDR® II+ SRAM with 4 M × 18 organization, 400 MHz maximum clock frequency, 2.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) package. It features separate read/write ports, DDR interfaces on both ports, echo clocks (CQ/CQ), and QVLD data-valid indicator - deployed in high-speed packet buffering for network line cards and telecom switching fabric.

For engineers reviewing the CY7C15632KV18-400BZXC datasheet, CY7C15632KV18-400BZXC pinout, CY7C15632KV18-400BZXC application, or CY7C15632KV18-400BZXC equivalent, key selection criteria include burst depth (4-word), I/O supply range (1.4 V to 1.8 V), HSTL-compatible interfaces, PLL-enabled timing accuracy, and JTAG 1149.1 test access support.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. All inputs (RPS, WPS, BWS[1:0], A[19:0], D[17:0]) are registered on rising edges of K/K clocks, and all outputs (Q[17:0], QVLD, CQ/CQ) are edge-aligned to those clocks. The internal PLL enables precise 2.5-cycle read latency timing when DOFF is HIGH.

Depth expansion is supported via RPS/WPS port-select signals, enabling multi-chip memory banks without external arbitration. Echo clocks CQ and CQ are free-running, phase-aligned replicas of K/K used for source-synchronous data capture; ZQ pin enables programmable output impedance matching to system trace impedance.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with AS7C36256P-15JCIN and IS61WV102418BLL-10BLI, CY7C15632KV18-400BZXC uniquely delivers concurrent 400 MHz DDR read/write with source-synchronous timing - making it irreplaceable in modern high-throughput, low-jitter data path designs.

Availability

CY7C15632KV18-400BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, and high-frequency trading engine applications requiring stable component supply, long-term lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C15632KV18-400BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR® II+ SRAM portfolio, including reliability testing, documentation updates, and long-term manufacturing commitment.

This device belongs to Infineon's high-performance memory product line, engineered specifically for deterministic-latency, high-bandwidth data buffering in networking, wireless infrastructure, and real-time financial systems.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when asserted LOW, reverting the device to QDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL enables precise 2.5-cycle latency at up to 400 MHz. This pin must be pulled up via ≤10 kΩ resistor for normal QDR II+ operation; floating or grounding it alters all AC timing parameters.

How does the ZQ pin calibrate output drive strength?

ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and configures CQ, CQ, and Q[17:0] output drivers to 0.2 × RQ impedance. This compensates for process/voltage/temperature variations and matches PCB trace impedance - improving signal integrity without requiring board-level termination resistors.

Can CY7C15632KV18-400BZXC operate with VDDQ = 1.5 V?

Yes - the datasheet explicitly states VDDQ supports 1.4 V to 1.8 V, including 1.5 V. At 1.5 V, HSTL output drive strength is reduced versus 1.8 V, but timing margins remain compliant at 400 MHz. System-level validation is recommended for marginal setups, especially with long traces or high fanout.

What is the role of RPS and WPS in depth expansion configurations?

RPS and WPS are active-LOW port-select signals that independently enable read or write access to the device. In depth-expanded systems, multiple CY7C15632KV18 devices share the same address/data buses, with RPS/WPS decoded from higher-order address bits to select individual chips - eliminating need for external bus arbiters or glue logic.