Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C15632KV18-400BZXI

Part No.:
CY7C15632KV18-400BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C15632KV18-400BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:292

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C15632KV18-400BZXI from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and dual DDR interfaces operating at 400 MHz (800 MT/s per port). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. Used in high-throughput packet buffering for network switches and routers.

For engineers reviewing the CY7C15632KV18-400BZXI datasheet, CY7C15632KV18-400BZXI pinout, CY7C15632KV18-400BZXI application, or CY7C15632KV18-400BZXI equivalent, key selection criteria include 4 M × 18 organization, DOFF-configurable latency (2.5-cycle vs. 1-cycle), HSTL I/O compatibility, PLL-based timing alignment, and depth expansion via RPS/WPS controls.

Technical Context

The device implements synchronous pipelined burst access with independent read and write ports sharing a multiplexed 20-bit address bus. Each port uses DDR signaling on K/K clocks, enabling 800 MT/s data transfer per port at 400 MHz input clock frequency. Internal organization is four 1 M × 18 arrays, supporting full data coherency across concurrent transactions.

Latency mode is selected by DOFF: HIGH enables QDR II+ mode (2.5-cycle read latency); LOW forces QDR I mode (1-cycle latency, ≤167 MHz operation). Echo clocks CQ/CQ are free-running, edge-aligned to K/K for simplified high-speed capture, while QVLD provides cycle-accurate output validity indication synchronized to CQ/CQ edges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4 M × 18 configuration)
Max Clock Frequency 400 MHz - sets maximum sustained throughput of 800 MT/s per port
Read Latency 2.5 cycles (DOFF = HIGH) - determines minimum read-to-read interval and pipeline depth
I/O Voltage Support VDDQ = 1.4 V to 1.8 V - enables interoperability with both 1.5 V and 1.8 V HSTL systems
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports high-density PCB layout with controlled impedance routing
Core Supply VDD = 1.8 V ± 0.1 V - defines power integrity requirements and noise margin for internal logic
JTAG Compliance IEEE 1149.1 - enables boundary-scan testing and system-level debug without additional test fixtures

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Latched on rising edges of K/K; support byte-write masking via BWS0/BWS1
Q[17:0] Synchronous read data outputs Driven on rising edges of K/K; tristated when RPS is deasserted
RPS / WPS Read/Write Port Select (active LOW) Enables independent port activation; allows depth expansion with multiple devices
K / K Positive/Negative input clocks Both used for DDR timing; all synchronous signals referenced to rising edges only
CQ / CQ Echo clocks (output) Free-running, edge-aligned to K/K; simplify timing closure for external latch circuits
QVLD Data validity indicator Asserted synchronously with CQ/CQ edges; confirms Q[17:0] contains valid burst word
DOFF PLL disable control (active LOW) Selects QDR II+ (2.5-cycle) vs. QDR I (1-cycle) latency mode and max frequency limit
ZQ Output impedance calibration input Connects to external resistor to ground to tune CQ/CQ/Q[17:0] drive strength to 0.2 × RQ

Key Features

Feature Design Value
Separate read/write data paths Eliminates bus turnaround overhead and prevents data contention in full-duplex traffic flows
Four-word burst architecture Reduces effective address bus frequency by 4× versus single-word access, easing routing and timing
HSTL Class I inputs / variable-drive outputs Ensures signal integrity at 800 MT/s with programmable drive strength matching trace impedance
On-chip PLL with echo clocks Delivers deterministic, low-jitter data placement; CQ/CQ enable source-synchronous capture without external delay lines
Byte-write select (BWS0/BWS1) Allows partial-word updates without read-modify-write cycles, preserving bandwidth in mixed-access workloads

Applications

High-Speed Network Switch Buffering Telecom Line Card Packet Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as non-blocking buffer between ingress parser and egress scheduler, with concurrent read/write at line rate.

Use Value: 2.5-cycle latency and 800 MT/s per port sustain 10 Gbps+ throughput without pipeline stalls or arbitration delays.

Use Scenario: Holding time-sensitive voice-over-IP (VoIP) payload buffers in carrier-grade DSLAM line cards.

IC Role / Device Role / Timing Role: Low-latency memory for jitter-buffer management, interfacing directly with DSP and SerDes PHYs.

Use Value: QVLD and echo clocks ensure precise data capture at 400 MHz, meeting sub-microsecond timing budgets for real-time audio processing.

PCIe-Based Accelerator Memory Test Equipment Pattern Generator

Use Scenario: Serving as local frame buffer in FPGA-accelerated PCIe gen3 add-in cards for video transcoding.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory accessed concurrently by PCIe DMA engine and video processing pipeline.

Use Value: Independent RPS/WPS controls allow seamless depth expansion across multiple CY7C15632KV18 devices without external arbitration logic.

Use Scenario: Generating deterministic high-speed digital stimulus patterns in automated test equipment (ATE) channel modules.

IC Role / Device Role / Timing Role: Burst-mode waveform storage element synchronized to system master clock via K/K and PLL.

Use Value: DOFF-selectable latency enables flexible trade-off between speed (2.5-cycle @ 400 MHz) and legacy compatibility (1-cycle @ ≤167 MHz).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-Mbit (2 M × 18), 10 ns async access; no DDR, no echo clocks, no QVLD Lower bandwidth, simpler timing, no PLL; suited for non-pipelined control-plane buffers Select when deterministic sub-10 ns latency is required and DDR complexity is undesirable
ISSI IS61WV102418BLL-10BLI 18-Mbit (512 K × 36), 10 ns async; single-port, no burst, no QDR architecture Cost-optimized for small buffers; lacks concurrency, echo clocks, or burst efficiency Choose for low-cost, low-power applications where 72-Mbit density and 800 MT/s are unnecessary

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C15632KV18-400BZXI delivers 4× higher density and 80× greater effective bandwidth via DDR + burst, but requires careful PLL lock and echo-clock routing-making it optimal for new high-speed designs, not drop-in replacements.

Availability

CY7C15632KV18-400BZXI is available at Aetrix Electronics and suitable for high-speed network switching, telecom line card buffering, and PCIe accelerator memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C15632KV18-400BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

This device belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-processing and real-time signal-path systems.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin selects between QDR II+ (DOFF = HIGH) and QDR I (DOFF = LOW) operational modes. In QDR II+ mode, the device achieves 2.5-cycle read latency at up to 500 MHz; in QDR I mode, latency drops to 1 cycle but maximum frequency is limited to 167 MHz. The PLL is disabled in QDR I mode, altering setup/hold timing margins and eliminating echo clock functionality.

How do CQ and CQ echo clocks improve system timing margin?

CQ and CQ are free-running output clocks synchronized to K and K, respectively, with fixed phase alignment. They provide a local, jitter-reduced timing reference for external latches capturing Q[17:0], eliminating the need for board-level delay tuning or fly-by routing. This reduces skew between data and capture clock, improving setup/hold margins at 400 MHz operation.

Can BWS0 and BWS1 be used to perform partial writes without reading existing data?

Yes. BWS0 controls D[8:0] and BWS1 controls D[17:9]; asserting either LOW enables writing only the corresponding 9-bit byte group while leaving unselected bytes unchanged. This is a true write-mask operation executed entirely within the SRAM's self-timed write circuitry-no read-modify-write sequence is required, preserving bandwidth and determinism.

What is the role of the ZQ pin, and how must it be connected?

ZQ calibrates output driver impedance for CQ, CQ, and Q[17:0] to match the system data bus. It must be connected to a precision resistor (RQ) tied to ground; output impedance is set to 0.2 × RQ. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode. ZQ must never be left floating or connected to GND, as this disables calibration and risks signal integrity failure.

CY7C15632KV18-400BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C15632KV18-400BZXI FAQ

1.How can I place an order for CY7C15632KV18-400BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C15632KV18-400BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C15632KV18-400BZXI reliable?

The price and inventory of CY7C15632KV18-400BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C15632KV18-400BZXI is usually 5 days.

3.What payment methods are accepted for CY7C15632KV18-400BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C15632KV18-400BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C15632KV18-400BZXI?

CY7C15632KV18-400BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C15632KV18-400BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C15632KV18-400BZXI?

For technical support, including CY7C15632KV18-400BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C15632KV18-400BZXI requirements.

6.How does Aetrix verify that CY7C15632KV18-400BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C15632KV18-400BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C15632KV18-400BZXI meets industry standards.

7.What is the process for return or replacement of CY7C15632KV18-400BZXI?

All CY7C15632KV18-400BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C15632KV18-400BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C15632KV18-400BZXI part is unused and in its original packaging.

Return procedure for CY7C15632KV18-400BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C15632KV18-400BZXI Tags

  • CY7C15632KV18-400BZXI
  • CY7C15632KV18-400BZXI PDF
  • CY7C15632KV18-400BZXI Datasheet
  • CY7C15632KV18-400BZXI Specifications
  • CY7C15632KV18-400BZXI Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C15632KV18-400BZXI
  • Buy CY7C15632KV18-400BZXI
  • CY7C15632KV18-400BZXI Price
  • CY7C15632KV18-400BZXI Distributor
  • CY7C15632KV18-400BZXI Supplier
  • CY7C15632KV18-400BZXI Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER