Cypress Semiconductor Corp CY7C15632KV18-500BZC
- Part No.:
- CY7C15632KV18-500BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C15632KV18-500BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:113
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Product details
Overview
CY7C15632KV18-500BZC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and dual DDR interfaces operating at 500 MHz (1000 MT/s). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V. Used in high-bandwidth packet buffering for network switches and routers.
For engineers reviewing the CY7C15632KV18-500BZC datasheet, CY7C15632KV18-500BZC pinout, CY7C15632KV18-500BZC application, or CY7C15632KV18-500BZC equivalent, key selection considerations include its 4 M × 18 organization, HSTL I/O compatibility, PLL-enabled 2.5-cycle latency mode, and FBGA-165 package with ZQ impedance calibration.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. All inputs (RPS, WPS, BWS[1:0], A[19:0], D[17:0]) are registered on rising edges of K/K clocks; all outputs (Q[17:0], QVLD, CQ/CQ) are edge-aligned to K/K.
It supports two operational modes: QDR II+ mode (DOFF = HIGH) with 2.5-cycle read latency and 500 MHz operation, and QDR I mode (DOFF = LOW) with 1-cycle latency up to 167 MHz. The integrated PLL enables precise data placement, while echo clocks simplify high-speed data capture without external delay compensation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4 M × 18 organization) |
| Max Clock Frequency | 500 MHz - enables 1000 MT/s DDR throughput per port |
| Read Latency | 2.5 cycles (with DOFF = HIGH) - deterministic timing for pipeline scheduling |
| VDD / VDDQ | Core: 1.8 V ± 0.1 V; I/O: 1.4–1.8 V - supports mixed-voltage system integration |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - matches FPGA/ASIC memory controllers |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory modules |
| Impedance Control | ZQ pin calibrates output driver impedance to 0.2 × RQ - ensures signal integrity on 50-Ω PCB traces |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS[1:0] |
| Q[17:0] | Synchronous read data output | DDR-aligned to K/K; tristated when RPS deasserted |
| RPS / WPS | Read/Write Port Select | Active-low enables port access; controls burst initiation and port isolation |
| BWS[1:0] | Byte Write Select | Independent control of D[8:0] (BWS0) and D[17:9] (BWS1); preserves unselected bytes |
| K / K | Primary clock inputs | Rising edges drive all registers; K used for read timing, K for write timing |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of K/K - eliminate board-level skew compensation |
| QVLD | Data validity indicator | Edge-aligned with CQ/CQ; signals valid Q[17:0] during each burst transfer |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune CQ/CQ/Q[17:0] driver strength |
| DOFF | PLL disable control | LOW forces QDR I mode (1-cycle latency, ≤167 MHz); HIGH enables full QDR II+ operation |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delays - enables true concurrent read/write at full bandwidth |
| Four-word burst architecture | Reduces address bus toggling frequency by 4× - lowers EMI and simplifies routing |
| Integrated PLL with echo clocks | Enables deterministic 2.5-cycle latency and eliminates external clock forwarding complexity |
| HSTL I/O with ZQ calibration | Ensures impedance-matched signaling across process/voltage/temperature variations |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system diagnostics without additional test fixtures |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Line-rate buffering of 10/40/100 GbE packet headers and metadata in switch ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero contention between parser and scheduler logic. Use Value: 1000 MT/s DDR throughput per port sustains full line-rate traffic without backpressure or packet loss. |
Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE). IC Role / Device Role / Timing Role: High-speed acquisition buffer synchronized to stimulus generator clocks via K/K and CQ/CQ alignment. Use Value: Echo clocks eliminate interconnect skew, enabling sub-nanosecond timing correlation between stimulus and capture paths. |
| Telecom Baseband Processing | AI Accelerator On-Chip Cache |
|
Use Scenario: Inter-processor communication buffer between DSP clusters in 5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Shared memory with independent read/write ports supporting parallel FFT and channel estimation pipelines. Use Value: Full data coherency ensures latest results are always available - no software cache coherency overhead. |
Use Scenario: Low-latency scratchpad for tensor compute engines in edge AI accelerators. IC Role / Device Role / Timing Role: Burst-access local memory serving as register file extension with deterministic 2.5-cycle read response. Use Value: Predictable latency enables compiler-aware instruction scheduling and eliminates pipeline stalls. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | 36-Mbit (2 M × 18), 350 MHz max, LVDS I/O, no echo clocks or ZQ | Lower density and bandwidth; requires external clock forwarding and termination tuning | Select when lower cost and legacy LVDS interface compatibility outweigh need for 72-Mbit capacity and HSTL simplicity |
| ISSI IS61WV102418BLL-10BLI | 18-Mbit (512 K × 36), 100 MHz async, single-port, CMOS I/O, no burst or DDR | Fundamentally different architecture - lacks concurrency, burst, or high-speed timing features | Only suitable for non-critical buffering where latency and bandwidth constraints are relaxed |
Compared with IDT72T36150L10BG and IS61WV102418BLL-10BLI, CY7C15632KV18-500BZC delivers 2× density, 43% higher bandwidth, integrated impedance control, and deterministic echo-clock timing - making it uniquely suited for next-generation packet processing and real-time instrumentation.
Availability
CY7C15632KV18-500BZC is available at Aetrix Electronics and suitable for network infrastructure, high-speed test equipment, telecom baseband systems, and AI accelerator designs requiring stable component supply and long-term manufacturability.
Supply support for CY7C15632KV18-500BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
CY7C15632KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in packet-forwarding and real-time signal processing systems.
FAQ
What is the function of the DOFF pin?
The DOFF pin disables the internal PLL when pulled LOW, forcing the device into QDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL enables full QDR II+ functionality including 2.5-cycle latency and 500 MHz operation. Pull-up resistor (≤10 kΩ to VDDQ) is required for normal use.
How does the ZQ pin affect signal integrity?
ZQ connects to an external resistor to ground to calibrate the output driver impedance of Q[17:0], CQ, and CQ pins to 0.2 × RQ. This ensures consistent 50-Ω matching across voltage and temperature, reducing reflections and jitter. Leaving ZQ unconnected or tied to GND violates specification and degrades timing margins.
Can CY7C15632KV18-500BZC be used with 1.5 V VDDQ?
Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. HSTL Class I input thresholds and variable-drive output buffers are fully compatible at 1.5 V, enabling interoperability with 1.5 V FPGA memory controllers without level shifters.
What is the role of CQ and CQ echo clocks?
CQ and CQ are free-running, phase-aligned copies of K and K clocks, respectively. They provide a local timing reference at the receiver end, eliminating the need for board-level delay matching between clock and data traces. This simplifies PCB layout and improves setup/hold margin in >500 MHz systems.
CY7C15632KV18-500BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 500 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C15632KV18-500BZC FAQ
1.How can I place an order for CY7C15632KV18-500BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C15632KV18-500BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C15632KV18-500BZC reliable?
The price and inventory of CY7C15632KV18-500BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C15632KV18-500BZC is usually 5 days.
3.What payment methods are accepted for CY7C15632KV18-500BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C15632KV18-500BZC transactions.
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CY7C15632KV18-500BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C15632KV18-500BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C15632KV18-500BZC?
For technical support, including CY7C15632KV18-500BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C15632KV18-500BZC requirements.
6.How does Aetrix verify that CY7C15632KV18-500BZC is sourced from the original manufacturer or authorized distributors?
All CY7C15632KV18-500BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C15632KV18-500BZC meets industry standards.
7.What is the process for return or replacement of CY7C15632KV18-500BZC?
All CY7C15632KV18-500BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C15632KV18-500BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C15632KV18-500BZC part is unused and in its original packaging.
Return procedure for CY7C15632KV18-500BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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