Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C15632KV18-500BZC

Part No.:
CY7C15632KV18-500BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C15632KV18-500BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:113

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C15632KV18-500BZC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and dual DDR interfaces operating at 500 MHz (1000 MT/s). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C15632KV18-500BZC datasheet, CY7C15632KV18-500BZC pinout, CY7C15632KV18-500BZC application, or CY7C15632KV18-500BZC equivalent, key selection considerations include its 4 M × 18 organization, HSTL I/O compatibility, PLL-enabled 2.5-cycle latency mode, and FBGA-165 package with ZQ impedance calibration.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. All inputs (RPS, WPS, BWS[1:0], A[19:0], D[17:0]) are registered on rising edges of K/K clocks; all outputs (Q[17:0], QVLD, CQ/CQ) are edge-aligned to K/K.

It supports two operational modes: QDR II+ mode (DOFF = HIGH) with 2.5-cycle read latency and 500 MHz operation, and QDR I mode (DOFF = LOW) with 1-cycle latency up to 167 MHz. The integrated PLL enables precise data placement, while echo clocks simplify high-speed data capture without external delay compensation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4 M × 18 organization)
Max Clock Frequency 500 MHz - enables 1000 MT/s DDR throughput per port
Read Latency 2.5 cycles (with DOFF = HIGH) - deterministic timing for pipeline scheduling
VDD / VDDQ Core: 1.8 V ± 0.1 V; I/O: 1.4–1.8 V - supports mixed-voltage system integration
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - matches FPGA/ASIC memory controllers
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory modules
Impedance Control ZQ pin calibrates output driver impedance to 0.2 × RQ - ensures signal integrity on 50-Ω PCB traces

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input Latched on rising edges of K/K; supports byte-write via BWS[1:0]
Q[17:0] Synchronous read data output DDR-aligned to K/K; tristated when RPS deasserted
RPS / WPS Read/Write Port Select Active-low enables port access; controls burst initiation and port isolation
BWS[1:0] Byte Write Select Independent control of D[8:0] (BWS0) and D[17:9] (BWS1); preserves unselected bytes
K / K Primary clock inputs Rising edges drive all registers; K used for read timing, K for write timing
CQ / CQ Echo clock outputs Free-running, phase-aligned copies of K/K - eliminate board-level skew compensation
QVLD Data validity indicator Edge-aligned with CQ/CQ; signals valid Q[17:0] during each burst transfer
ZQ Output impedance calibration Connects to external resistor to ground to tune CQ/CQ/Q[17:0] driver strength
DOFF PLL disable control LOW forces QDR I mode (1-cycle latency, ≤167 MHz); HIGH enables full QDR II+ operation

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delays - enables true concurrent read/write at full bandwidth
Four-word burst architecture Reduces address bus toggling frequency by 4× - lowers EMI and simplifies routing
Integrated PLL with echo clocks Enables deterministic 2.5-cycle latency and eliminates external clock forwarding complexity
HSTL I/O with ZQ calibration Ensures impedance-matched signaling across process/voltage/temperature variations
JTAG 1149.1 test access port Supports boundary scan testing and in-system diagnostics without additional test fixtures

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Line-rate buffering of 10/40/100 GbE packet headers and metadata in switch ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero contention between parser and scheduler logic.

Use Value: 1000 MT/s DDR throughput per port sustains full line-rate traffic without backpressure or packet loss.

Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE).

IC Role / Device Role / Timing Role: High-speed acquisition buffer synchronized to stimulus generator clocks via K/K and CQ/CQ alignment.

Use Value: Echo clocks eliminate interconnect skew, enabling sub-nanosecond timing correlation between stimulus and capture paths.

Telecom Baseband Processing AI Accelerator On-Chip Cache

Use Scenario: Inter-processor communication buffer between DSP clusters in 5G massive MIMO baseband units.

IC Role / Device Role / Timing Role: Shared memory with independent read/write ports supporting parallel FFT and channel estimation pipelines.

Use Value: Full data coherency ensures latest results are always available - no software cache coherency overhead.

Use Scenario: Low-latency scratchpad for tensor compute engines in edge AI accelerators.

IC Role / Device Role / Timing Role: Burst-access local memory serving as register file extension with deterministic 2.5-cycle read response.

Use Value: Predictable latency enables compiler-aware instruction scheduling and eliminates pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36150L10BG 36-Mbit (2 M × 18), 350 MHz max, LVDS I/O, no echo clocks or ZQ Lower density and bandwidth; requires external clock forwarding and termination tuning Select when lower cost and legacy LVDS interface compatibility outweigh need for 72-Mbit capacity and HSTL simplicity
ISSI IS61WV102418BLL-10BLI 18-Mbit (512 K × 36), 100 MHz async, single-port, CMOS I/O, no burst or DDR Fundamentally different architecture - lacks concurrency, burst, or high-speed timing features Only suitable for non-critical buffering where latency and bandwidth constraints are relaxed

Compared with IDT72T36150L10BG and IS61WV102418BLL-10BLI, CY7C15632KV18-500BZC delivers 2× density, 43% higher bandwidth, integrated impedance control, and deterministic echo-clock timing - making it uniquely suited for next-generation packet processing and real-time instrumentation.

Availability

CY7C15632KV18-500BZC is available at Aetrix Electronics and suitable for network infrastructure, high-speed test equipment, telecom baseband systems, and AI accelerator designs requiring stable component supply and long-term manufacturability.

Supply support for CY7C15632KV18-500BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C15632KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in packet-forwarding and real-time signal processing systems.

FAQ

What is the function of the DOFF pin?

The DOFF pin disables the internal PLL when pulled LOW, forcing the device into QDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL enables full QDR II+ functionality including 2.5-cycle latency and 500 MHz operation. Pull-up resistor (≤10 kΩ to VDDQ) is required for normal use.

How does the ZQ pin affect signal integrity?

ZQ connects to an external resistor to ground to calibrate the output driver impedance of Q[17:0], CQ, and CQ pins to 0.2 × RQ. This ensures consistent 50-Ω matching across voltage and temperature, reducing reflections and jitter. Leaving ZQ unconnected or tied to GND violates specification and degrades timing margins.

Can CY7C15632KV18-500BZC be used with 1.5 V VDDQ?

Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. HSTL Class I input thresholds and variable-drive output buffers are fully compatible at 1.5 V, enabling interoperability with 1.5 V FPGA memory controllers without level shifters.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of K and K clocks, respectively. They provide a local timing reference at the receiver end, eliminating the need for board-level delay matching between clock and data traces. This simplifies PCB layout and improves setup/hold margin in >500 MHz systems.

CY7C15632KV18-500BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
500 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C15632KV18-500BZC FAQ

1.How can I place an order for CY7C15632KV18-500BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C15632KV18-500BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C15632KV18-500BZC reliable?

The price and inventory of CY7C15632KV18-500BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C15632KV18-500BZC is usually 5 days.

3.What payment methods are accepted for CY7C15632KV18-500BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C15632KV18-500BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C15632KV18-500BZC?

CY7C15632KV18-500BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C15632KV18-500BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C15632KV18-500BZC?

For technical support, including CY7C15632KV18-500BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C15632KV18-500BZC requirements.

6.How does Aetrix verify that CY7C15632KV18-500BZC is sourced from the original manufacturer or authorized distributors?

All CY7C15632KV18-500BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C15632KV18-500BZC meets industry standards.

7.What is the process for return or replacement of CY7C15632KV18-500BZC?

All CY7C15632KV18-500BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C15632KV18-500BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C15632KV18-500BZC part is unused and in its original packaging.

Return procedure for CY7C15632KV18-500BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C15632KV18-500BZC Tags

  • CY7C15632KV18-500BZC
  • CY7C15632KV18-500BZC PDF
  • CY7C15632KV18-500BZC Datasheet
  • CY7C15632KV18-500BZC Specifications
  • CY7C15632KV18-500BZC Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C15632KV18-500BZC
  • Buy CY7C15632KV18-500BZC
  • CY7C15632KV18-500BZC Price
  • CY7C15632KV18-500BZC Distributor
  • CY7C15632KV18-500BZC Supplier
  • CY7C15632KV18-500BZC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER