Cypress Semiconductor Corp CY7C15632KV18-500BZXC
- Part No.:
- CY7C15632KV18-500BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C15632KV18-500BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:136
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Product details
Overview
CY7C15632KV18-500BZXC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, 500 MHz clock operation, and separate read/write DDR ports delivering 1000 MT/s data rate. It operates at 1.8 V core (±0.1 V) and supports 1.4–1.8 V I/O supply, housed in a 165-ball FBGA (13 × 15 × 1.4 mm), and targets high-bandwidth packet buffering in network switches and routers.
For engineers reviewing the CY7C15632KV18-500BZXC datasheet, CY7C15632KV18-500BZXC pinout, CY7C15632KV18-500BZXC application, or CY7C15632KV18-500BZXC equivalent, key selection criteria include its 2.5-cycle read latency mode (DOFF = HIGH), echo clock (CQ/CQ) timing support, HSTL I/O compatibility, and depth expansion via RPS/WPS port selects.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. All synchronous inputs (RPS, WPS, BWS[1:0], A[19:0], D[17:0]) are registered on rising edges of K and K clocks, enabling concurrent transactions without bus turnaround.
It integrates a PLL for precise data placement and uses echo clocks (CQ/CQ) aligned to K/K for simplified high-speed data capture. The QVLD signal indicates valid output data edge-aligned to CQ/CQ, and ZQ enables programmable output impedance matching to system bus termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4 M × 18 configuration) |
| Max Clock Frequency | 500 MHz - enables 1000 MT/s DDR throughput per port |
| Read Latency | 2.5 cycles (with DOFF = HIGH) - determines minimum read-to-read interval |
| Core Supply Voltage | 1.8 V ± 0.1 V - defines power rail tolerance and noise margin |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with both 1.5 V and 1.8 V HSTL systems |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - specifies board layout footprint and thermal profile |
| Data Bus Width | 18-bit bidirectional per port - sets parallel data path granularity for burst transfers |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; drives 18-bit word into memory during active WPS cycle |
| Q[17:0] | Synchronous read data output | Drives bursted 18-bit words on rising edges of K/K; tristated when RPS is deasserted |
| RPS / WPS | Read/Write port select | Active-low enables independent port activation; enables depth expansion via port isolation |
| BWS[1:0] | Byte write select | Controls 9-bit byte writes: BWS0 → D[8:0], BWS1 → D[17:9]; preserves unselected bytes |
| K / K | Input clocks | Rising edges control all synchronous registers; K used for read outputs, K for write inputs |
| CQ / CQ | Echo clocks | Free-running, phase-aligned copies of K/K; simplify timing closure for source-synchronous capture |
| QVLD | Valid data indicator | Asserted edge-aligned to CQ/CQ; signals validity of current Q[17:0] word during burst |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune CQ/CQ/Q[17:0] output drive strength to 0.2×RQ |
| DOFF | PLL disable control | LOW disables PLL, reverts to QDR I mode (1-cycle latency, ≤167 MHz); HIGH enables QDR II+ mode |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write DDR ports | Eliminates data bus turnaround, enabling true concurrent read/write at full bandwidth |
| Four-word burst architecture | Reduces effective address bus frequency by 4× versus single-word access for same throughput |
| Programmable output impedance (ZQ) | Enables dynamic matching to PCB trace impedance without external termination resistors |
| Edge-aligned QVLD with echo clocks | Provides deterministic, jitter-tolerant data valid window for FPGA/ASIC capture logic |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system diagnostics without additional test fixtures |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Line-rate buffering of Ethernet frames in 10/25/40 GbE switch fabric ASICs. IC Role / Device Role / Timing Role: Dedicated burst-access SRAM providing low-latency, concurrent read/write for ingress/egress queues. Use Value: 2.5-cycle latency and 1000 MT/s DDR ports sustain full line-rate throughput without pipeline stalls. |
Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE). IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA-based pattern engines. Use Value: Echo clocks (CQ/CQ) and QVLD enable reliable source-synchronous sampling at 500 MHz clock domain. |
| Telecom Baseband Processing | Defense Radar Signal Processing |
|
Use Scenario: Frame-level data exchange between DSP cores and RF front-end in 4G/5G base stations. IC Role / Device Role / Timing Role: Synchronous burst memory supporting deterministic latency for OFDM symbol processing pipelines. Use Value: Full data coherency and port-isolated RPS/WPS ensure no read-after-write corruption during burst transfers. |
Use Scenario: Pulse-Doppler radar digital beamforming buffers requiring radiation-tolerant, high-reliability memory. IC Role / Device Role / Timing Role: Radiation-hardened SRAM with JTAG boundary scan for in-field diagnostics and fault isolation. Use Value: Neutron soft error immunity and 1.8 V core reduce single-event upset susceptibility in airborne platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L5PF | 36-Mbit (2 M × 18), 500 MHz, QDR II, 2-cycle latency, 165-ball FBGA | Half density, no DOFF-selectable latency mode, lacks ZQ calibration | Choose when lower capacity suffices and impedance tuning is not required |
| ISSI IS61WV102418BLL-10BLI | 18-Mbit (512 K × 36), 100 MHz, asynchronous SRAM, 36-bit bus, SOJ package | No DDR, no burst, no echo clocks, no QVLD, significantly lower bandwidth | Choose only for legacy designs where QDR timing and features are unnecessary |
Compared with IDT72T3615L5PF and IS61WV102418BLL-10BLI, CY7C15632KV18-500BZXC delivers double density, selectable latency modes, and system-level timing aids (CQ/CQ, QVLD, ZQ), making it uniquely suited for next-generation networking and test instrumentation requiring deterministic 1000 MT/s throughput.
Availability
CY7C15632KV18-500BZXC is available at Aetrix Electronics and suitable for network switch fabric design, high-speed ATE memory subsystems, telecom baseband processing, and defense radar signal buffering requiring stable component supply across multi-year production cycles.
Supply support for CY7C15632KV18-500BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with global manufacturing and quality certification.
This device belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, high-throughput memory interfaces in packet-switched infrastructure where concurrent read/write and sub-3-cycle latency are critical.
FAQ
What is the function of the DOFF pin?
The DOFF pin controls PLL operation: when pulled HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency and full 500 MHz capability; when pulled LOW, the PLL is disabled and the device reverts to QDR I timing with 1-cycle latency and maximum 167 MHz operation. This dual-mode flexibility allows backward compatibility while enabling peak performance.
How does the ZQ pin affect system design?
ZQ connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[17:0], CQ, and CQ pins to 0.2×RQ (e.g., 48 Ω). This eliminates need for discrete series termination resistors, reduces PCB component count, and improves signal integrity across temperature and voltage variations in high-speed HSTL interfaces.
Can CY7C15632KV18-500BZXC support depth expansion?
Yes - depth expansion is implemented using RPS (read port select) and WPS (write port select) signals. Multiple devices can be stacked with shared address/data buses and individual RPS/WPS lines asserted per device, enabling seamless memory capacity scaling without external logic or address decoding overhead.
What timing role do CQ and CQ serve?
CQ and CQ are free-running echo clocks synchronized to K and K, respectively. They provide source-synchronous timing references for capturing Q[17:0] data in receiving logic (e.g., FPGA input registers), eliminating setup/hold uncertainty caused by clock skew and PCB trace mismatch in high-speed DDR interfaces.
CY7C15632KV18-500BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 500 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C15632KV18-500BZXC FAQ
1.How can I place an order for CY7C15632KV18-500BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C15632KV18-500BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C15632KV18-500BZXC reliable?
The price and inventory of CY7C15632KV18-500BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C15632KV18-500BZXC is usually 5 days.
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Once your CY7C15632KV18-500BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C15632KV18-500BZXC?
For technical support, including CY7C15632KV18-500BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C15632KV18-500BZXC requirements.
6.How does Aetrix verify that CY7C15632KV18-500BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C15632KV18-500BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C15632KV18-500BZXC meets industry standards.
7.What is the process for return or replacement of CY7C15632KV18-500BZXC?
All CY7C15632KV18-500BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C15632KV18-500BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C15632KV18-500BZXC part is unused and in its original packaging.
Return procedure for CY7C15632KV18-500BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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