Cypress Semiconductor Corp CY7C15632KV18-500BZXI

Overview

CY7C15632KV18-500BZXI from Infineon Technologies (formerly Cypress) is a 72-Mbit QDR® II+ SRAM with separate read/write ports, 500 MHz clock operation, 2.5-cycle read latency, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 1000 MT/s DDR data transfer on both ports, supports full data coherency, and operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V - deployed in high-bandwidth packet buffering for telecom line cards.

For engineers reviewing the CY7C15632KV18-500BZXI datasheet, CY7C15632KV18-500BZXI pinout, CY7C15632KV18-500BZXI application, or CY7C15632KV18-500BZXI equivalent, key selection criteria include burst depth (four-word), echo clock timing (CQ/CQ), QVLD validity signaling, DOFF-configurable latency mode (QDR I vs. QDR II+), and HSTL-compatible 18-bit bidirectional data interface.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 20-bit address bus. All inputs (A, D, RPS, WPS, BWS, DOFF, ZQ) are registered on rising edges of K/K clocks, and all outputs (Q, QVLD, CQ, CQ) are edge-aligned to those clocks. The internal PLL enables precise 2.5-cycle read latency when DOFF = HIGH.

It uses four-word burst transfers per access, delivering 72 bits per cycle across two clock edges (DDR), achieving 18 Gb/s aggregate bandwidth. Depth expansion is supported via RPS/WPS port selects, and byte-write control (BWS0/BWS1) allows selective 9-bit writes without disturbing adjacent bytes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with AS7C36256P-15TIN and IS61WV102418BLL-10BLI, CY7C15632KV18-500BZXI uniquely delivers 1000 MT/s DDR throughput, deterministic 2.5-cycle latency with QVLD validation, and echo-clock–assisted timing closure - essential for 500 MHz system designs where bus turnaround and jitter margin are critical.

Availability

CY7C15632KV18-500BZXI is available at Aetrix Electronics and suitable for telecom infrastructure, network processor subsystems, and 5G baseband units requiring stable component supply, long-term lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C15632KV18-500BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR SRAM portfolio, including legacy Cypress-developed devices like the CY7C15632KV18 series.

This device belongs to Infineon's high-performance synchronous SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory interfacing in networking, wireless infrastructure, and test instrumentation.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin is an active-low PLL disable control. When pulled HIGH (via 10 kΩ pull-up), the internal PLL enables QDR II+ mode with 2.5-cycle read latency and 500 MHz operation. When pulled LOW, the device reverts to QDR I timing with 1-cycle latency and maximum 167 MHz frequency. This hardware-selectable mode allows backward compatibility without changing board layout or firmware.

How do CQ and CQ echo clocks improve system timing closure?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide deterministic, low-jitter strobes that align precisely with valid Q[17:0] data edges. This eliminates the need for complex PCB trace length matching or external delay elements when interfacing with FPGAs or ASICs, reducing timing margin uncertainty by up to 150 ps in 500 MHz designs.

Can CY7C15632KV18-500BZXI operate with VDDQ = 1.5 V?

Yes. The device supports VDDQ from 1.4 V to 1.8 V, explicitly including 1.5 V operation. HSTL Class I input thresholds and variable-drive output buffers are fully characterized at 1.5 V, ensuring reliable signal integrity and compatibility with common 1.5 V FPGA I/O banks without level-shifting circuitry.

What is the role of the ZQ pin, and how must it be connected?

ZQ is an output impedance calibration input. It must be connected to a precision resistor (typically 100 Ω) tied to ground to calibrate CQ, CQ, and Q[17:0] driver strength to match the system's data bus impedance. Connecting ZQ directly to VDDQ enables minimum drive strength mode; leaving it unconnected or tying to GND violates specifications and risks signal integrity failure.