Cypress Semiconductor Corp CY7C1563V18-400BZXC
- Part No.:
- CY7C1563V18-400BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1563V18-400BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:208
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Product details
Overview
CY7C1563V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II+ SRAM with separate read/write ports, 400 MHz clock support, 2.5-cycle read latency, and DDR interfaces on both ports delivering 800 MT/s effective data rate. It uses HSTL I/O, DLL-based timing alignment, and 165-ball FBGA packaging for high-speed networking and packet buffering applications.
For engineers reviewing the CY7C1563V18 datasheet, CY7C1563V18 pinout, CY7C1563V18 application, or CY7C1563V18 equivalent, key selection criteria include burst depth (4-word), port independence, echo clock (CQ/CQ) timing support, QVLD validity signaling, and VDDQ range (1.4V to 1.8V) compatibility with system I/O voltage planning.
Technical Context
This device implements synchronous pipelined QDR-II+ architecture with independent read and write address/data paths latched on alternating rising edges of K and K clocks. Its dual DDR interfaces eliminate bus turnaround, enabling concurrent read and write operations without contention.
The internal Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to K/K for precise data capture at 400 MHz, while QVLD provides edge-aligned valid-data indication. Address inputs are multiplexed across both ports using only 20 pins (A[19:0]) for the 4M × 18 configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18-bit organization) |
| Max Clock Frequency | 400 MHz - enables 800 MT/s DDR throughput per port |
| Read Latency | 2.5 clock cycles - deterministic timing for pipeline scheduling |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports mixed-voltage system interfacing |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 4× vs. single-word access |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 400 MHz |
| Timing Reference | DLL-synchronized CQ/CQ echo clocks - eliminates external deskew circuitry |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[19:0] | Address Input | Multiplexed address bus for both read and write ports; 20 pins address full 4M depth |
| D[17:0] | Write Data Input | 18-bit synchronous input sampled on rising edges of K/K; supports byte-level writes via BWS[1:0] |
| Q[17:0] | Read Data Output | 18-bit DDR output driven on rising edges of K/K; tri-stated when RPS is deasserted |
| RPS / WPS | Port Select | Active-low synchronous controls: RPS enables read burst; WPS enables write burst |
| K / K | Clock Inputs | Differential clock pair; rising edges latch all synchronous inputs and drive outputs |
| CQ / CQ | Echo Clock Outputs | Free-running, DLL-aligned copies of K/K for source-synchronous data capture |
| QVLD | Data Valid Indicator | Output pulse edge-aligned with CQ/CQ; signals validity of Q[17:0] during read bursts |
| ZQ | Impedance Calibration | Connects to external resistor to ground to calibrate output driver impedance (0.2 × RQ) |
| DOFF | DLL Disable | Active-low pin; disables DLL to fall back to QDR-I mode (≤167 MHz) if needed |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround overhead and enables true concurrent memory access in packet-forwarding pipelines |
| 4-Word Burst Architecture | Reduces address bus switching activity by 75%, lowering EMI and simplifying PCB routing |
| QVLD Validity Signal | Provides unambiguous, clock-edge-aligned indication of valid output data-critical for reliable high-speed capture |
| HSTL I/O with ZQ Calibration | Ensures consistent signal integrity across voltage/temperature/process corners via on-die impedance tuning |
| JTAG 1149.1 Test Access | Enables boundary-scan testing and in-system debug without requiring additional test pads or probes |
Applications
| High-Speed Network Switch Buffering | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing and forwarding Ethernet frames in multi-gigabit switch ASICs where low-latency, deterministic memory access is required. IC Role / Device Role / Timing Role: Dedicated buffer memory providing simultaneous ingress (write) and egress (read) paths for cut-through switching. Use Value: 2.5-cycle latency and 400 MHz operation enable sub-20 ns read-to-output timing, meeting IEEE 802.3ae jitter budgets. | Use Scenario: Temporary storage of ATM cells or IP packets in carrier-grade line cards operating at OC-192/STM-64 rates. IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store between framer and processor subsystems with independent clock domains. Use Value: Separate K/K clocks and echo clocks (CQ/CQ) allow precise source-synchronous capture without external PLLs or delay lines. |
| Baseband Processing in 4G LTE eNodeB | Real-Time Video Frame Buffering |
Use Scenario: Holding intermediate FFT/IFFT results and channel estimation data in LTE physical layer processing units. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfaced directly to FPGA-based DSP engines with matched timing paths. Use Value: 72-Mbit density and 800 MT/s effective bandwidth sustain >6.4 GB/s aggregate throughput across read/write ports. | Use Scenario: Storing uncompressed 1080p60 YUV422 video frames in broadcast production switchers requiring zero-frame-delay switching. IC Role / Device Role / Timing Role: Frame buffer memory supporting simultaneous write (ingest) and read (output) at pixel-clock rates up to 148.5 MHz. Use Value: QVLD signal and DLL-aligned echo clocks ensure pixel-accurate data capture without FIFO-based resynchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1565V18 | 2M × 36-bit (72-Mbit), same speed grade but wider data bus and fewer depth bits | Better suited for 36-bit datapath systems (e.g., certain DSP buses); requires different address decoding logic | Select when system data path is naturally 36-bit and depth expansion is not required |
| AS7C3256A-15JCIN | Asynchronous 32K × 8 SRAM, no DDR, no DLL, 15 ns access, 3.3V only | Lacks concurrency, burst, or echo clock features; limited to low-speed control-plane buffering | Only viable for non-critical, low-bandwidth backup buffers where QDR-II+ features are unnecessary |
Compared with CY7C1565V18, CY7C1563V18 offers higher depth (4M vs. 2M) at narrower width (18-bit), better matching to 16/18-bit bus architectures; versus AS7C3256A-15JCIN, it delivers 53× higher effective bandwidth and deterministic latency essential for real-time traffic.
Availability
CY7C1563V18 is available at Aetrix Electronics and suitable for high-speed network switches, telecom line cards, and LTE baseband processing systems requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1563V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
The QDR-II+ SRAM product line targets applications demanding ultra-low latency, concurrent access, and deterministic timing-especially in packet infrastructure and real-time signal processing.
FAQ
What is the function of the DOFF pin on CY7C1563V18?
The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this mode, the device reverts to QDR-I timing behavior with maximum clock frequency reduced to 167 MHz. This fallback mode allows interoperability with legacy controllers or simplified timing validation, though all QDR-II+ advantages-including 400 MHz operation and echo clock precision-are lost.
How does the ZQ pin affect signal integrity?
The ZQ pin connects to an external resistor to ground (typically 100 Ω) to calibrate the output driver impedance of Q[17:0], CQ, and CQ pins to 0.2 × RQ (e.g., 20 Ω). This dynamic calibration compensates for voltage, temperature, and process variations, ensuring consistent HSTL waveform shape and reducing reflection-induced jitter at 400 MHz.
Can CY7C1563V18 operate with only one clock input?
No. The device requires both K and K clock inputs to function correctly. These differential clocks control separate register stages for read and write data paths. Using only K violates the timing architecture: K samples write data and address, while K samples read address and drives read data. Omitting either clock prevents valid operation per the QDR-II+ specification.
What is the role of BWS[1:0] in CY7C1563V18?
BWS[1:0] are active-low byte write select signals that enable selective updating of 9-bit subwords within the 18-bit D[17:0] bus. BWS0 controls D[8:0], and BWS1 controls D[17:9]. When a BWS bit is HIGH, the corresponding byte remains unchanged during the write cycle-preserving prior data without requiring a read-modify-write sequence.
CY7C1563V18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1563V18-400BZXC FAQ
1.How can I place an order for CY7C1563V18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1563V18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1563V18-400BZXC reliable?
The price and inventory of CY7C1563V18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1563V18-400BZXC is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1563V18-400BZXC transactions.
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CY7C1563V18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1563V18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1563V18-400BZXC?
For technical support, including CY7C1563V18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1563V18-400BZXC requirements.
6.How does Aetrix verify that CY7C1563V18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1563V18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1563V18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1563V18-400BZXC?
All CY7C1563V18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1563V18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1563V18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1563V18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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