Cypress Semiconductor Corp CY7C1563XV18-600BZXC

Overview

CY7C1563XV18-600BZXC from Infineon Technologies (formerly Cypress) is a 72-Mbit QDR® II+ Xtreme SRAM with 4M × 18 organization, 2.5-cycle read latency, 600 MHz clock frequency, and DDR interfaces on independent read/write ports. It delivers 1200 MT/s data throughput using HSTL I/O, 1.8 V core supply, and 1.5 V I/O supply, deployed in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1563XV18-600BZXC datasheet, CY7C1563XV18-600BZXC pinout, CY7C1563XV18-600BZXC application, or CY7C1563XV18-600BZXC equivalent, key selection criteria include burst depth (four-word), echo clock timing (CQ/CQ), QVLD validity signaling, DOFF-configurable PLL mode, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual-clock DDR interface uses K and K inputs-both rising-edge-triggered-to latch address/data and drive outputs, enabling concurrent read and write operations without arbitration delay.

The integrated PLL supports precise data placement at 600 MHz, while DOFF pin control allows dynamic switching between QDR II+ (2.5-cycle latency) and legacy QDR I (1-cycle latency) timing modes. Echo clocks CQ and CQ are phase-aligned to K/K and simplify high-speed data capture in SerDes-adjacent systems.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with IDT72T3615L10PA and IS61WV102418B, CY7C1563XV18-600BZXC delivers 4× higher density, 6× greater bandwidth, and deterministic source-synchronous timing-making it irreplaceable in modern packet-processing and real-time video architectures requiring sub-ns jitter control.

Availability

CY7C1563XV18-600BZXC is available at Aetrix Electronics and suitable for network infrastructure, telecom line cards, high-speed test equipment, and real-time video processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1563XV18-600BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and long-term supply commitment for the QDR® II+ Xtreme SRAM family.

This device belongs to Infineon's high-performance synchronous SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory subsystems in networking, communications, and instrumentation applications.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when asserted LOW, reverting the device to QDR I timing mode with 1-cycle read latency and maximum 167 MHz operation. In normal QDR II+ mode (DOFF HIGH), the PLL enables 2.5-cycle latency at 600 MHz. Timing parameters differ significantly between modes-designers must select appropriate AC specs from the relevant section of the datasheet based on DOFF state.

How do CQ and CQ echo clocks improve system timing margin?

CQ and CQ are free-running, phase-aligned copies of K and K generated internally and output with minimal skew. They provide a local clock reference at the receiver to capture Q[17:0] data, eliminating flight-time mismatch between clock and data paths. This source-synchronous scheme relaxes PCB routing constraints and ensures robust setup/hold margins at 1200 MT/s, especially over temperature and voltage variations.

Can CY7C1563XV18-600BZXC be used in depth-expanded configurations?

Yes-depth expansion is supported via RPS and WPS pins. Multiple devices can share the same address and data buses while using independent port selects to activate specific units. Each device responds only when its RPS or WPS is asserted, enabling seamless expansion beyond 4M × 18 without external logic. Byte write selects (BWS[1:0]) remain per-device for granular write control.

What is the role of the ZQ pin, and how should it be connected?

ZQ calibrates output driver impedance for CQ, CQ, and Q[17:0] to match the system data bus (typically 50 Ω). It must be connected to a precision resistor (RQ) tied to ground; impedance is set to 0.2 × RQ. For example, a 240 Ω resistor yields 48 Ω output drive. Direct connection to VDDQ enables minimum impedance mode; floating or grounding ZQ is prohibited and may cause undefined behavior.