Cypress Semiconductor Corp CY7C1564XV18-366BZC
- Part No.:
- CY7C1564XV18-366BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1564XV18-366BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:235
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Product details
Overview
CY7C1564XV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with dual independent read/write ports, 450 MHz clock operation (900 Mbps DDR data rate), 2.5-cycle read latency when DOFF = HIGH, and HSTL I/O interface supporting 1.5 V VDDQ. It delivers high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1564XV18 datasheet, CY7C1564XV18 pinout, CY7C1564XV18 application, or CY7C1564XV18 equivalent, key selection criteria include burst depth (two 36-bit words per cycle), echo clock timing (CQ/CQ), QVLD validity signaling, PLL-enabled low-latency modes, and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
The CY7C1564XV18 implements a synchronous pipelined architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its two-word burst transfers 72 bits per K/K clock cycle-enabling sustained 900 MB/s bandwidth at 450 MHz.
It uses a Phase-Locked Loop (PLL) to align CQ/CQ echo clocks with K/K for precise DDR capture timing, while the DOFF pin selects between QDR-II+ mode (2.5-cycle latency, up to 450 MHz) and QDR-I mode (1-cycle latency, ≤167 MHz). Address inputs A[19:0] are multiplexed for both ports and latched on alternating rising edges of K and K.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 450 MHz - enables 900 Mbps DDR data transfer rate on both ports |
| Read Latency | 2.5 cycles (DOFF = HIGH) - determines minimum time from address valid to first Q[x] output |
| I/O Voltage | VDDQ = 1.4–1.6 V - supports 1.5 V HSTL-compatible signaling with programmable drive strength |
| Core Voltage | VDD = 1.8 V ± 0.1 V - defines internal logic and array operating margin |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - provides controlled impedance routing for >400 MHz signal integrity |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - ensures timing closure in FPGA-ASIC interconnects |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous read data output | Driven on rising edges of K/K; tristated when RPS is deasserted |
| RPS | Read port select (active LOW) | Enables read burst; QVLD edge-aligned with CQ/CQ indicates valid Q[35:0] |
| WPS | Write port select (active LOW) | Initiates write burst; ignored if port deselected |
| BWS[3:0] | Byte write select (active LOW) | Controls 9-bit byte lanes: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27] |
| K / K | Positive/negative input clocks | Rising edges latch all synchronous inputs; K drives read path, K drives write path |
| CQ / CQ | Echo clocks (output) | Free-running, phase-aligned copies of K/K for source-synchronous data capture |
| DOFF | PLL disable control (active LOW) | Switches device between QDR-II+ (2.5-cycle, 450 MHz) and QDR-I (1-cycle, ≤167 MHz) modes |
| QVLD | Valid data indicator | Asserted coincident with first valid Q[35:0] word; synchronized to CQ/CQ edges |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune CQ/CQ/Q[35:0] drive strength to system bus Z₀ |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Delivers 72 bits per clock cycle without address bus re-use, reducing controller address generation load |
| Dual independent DDR ports | Enables concurrent read and write operations - no bus contention or turnaround delay |
| Programmable PLL with DOFF control | Allows dynamic switching between high-throughput (450 MHz, 2.5-cycle) and low-latency (167 MHz, 1-cycle) modes |
| HSTL I/O with ZQ calibration | Ensures signal integrity across 0.8 mm pitch FBGA; eliminates need for external termination resistors |
| QVLD + echo clocks (CQ/CQ) | Provides deterministic, source-synchronous timing for FPGA/ASIC receivers - simplifies high-speed timing closure |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with zero-latency read-after-write requirements. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking FIFO buffer, accepting ingress traffic on write port while simultaneously servicing egress scheduling on read port. Use Value: Eliminates bus turnaround delays, enabling full-duplex 10 Gbps+ throughput with deterministic 2.5-cycle read response. | Use Scenario: Capturing real-time waveform samples from multi-channel ADCs in automated test systems requiring simultaneous acquisition and analysis. IC Role / Device Role / Timing Role: High-bandwidth memory staging buffer interfacing directly with FPGA-based pattern generators and comparators. Use Value: Sustains 900 MB/s bidirectional data flow, matching FPGA fabric bandwidth and minimizing sample loss during burst capture. |
| Baseband Processing in Wireless Infrastructure | Real-Time Video Frame Buffering |
Use Scenario: Holding intermediate FFT/IFFT results and channel estimation data in LTE/5G baseband units where low-latency memory access impacts modulation accuracy. IC Role / Device Role / Timing Role: Pipelined SRAM providing synchronized read/write access to DSP/FPGA accelerators performing parallel symbol processing. Use Value: 2.5-cycle latency and echo-clock alignment ensure tight timing margins for sub-μs processing loops in OFDM symbol chains. | Use Scenario: Buffering uncompressed 4K video frames between image sensor interfaces and video compression engines in broadcast encoders. IC Role / Device Role / Timing Role: Dual-port frame store allowing concurrent write of incoming pixel streams and read of processed macroblocks for encoding. Use Value: Two-word burst transfers 72 bits/cycle - sufficient for 10-bit 4:2:2 YUV pixel pairs, sustaining 60 fps at UHD resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120 | 36-bit QDR-II, 333 MHz max, 2-cycle latency, no DOFF mode switching | Lacks QDR-II+ Xtreme's 450 MHz capability and PLL-based latency flexibility | Select when legacy QDR-II timing compliance is required and 333 MHz bandwidth suffices |
| ISSI IS61WV102432BLL | 1M × 32 sync SRAM, 200 MHz, single-port, asynchronous read/write enable | No DDR interface, no echo clocks, no burst architecture - lower bandwidth, simpler timing | Select for cost-sensitive, non-concurrent applications where 200 MHz burstless access meets throughput needs |
Compared with IDT72T36120 and IS61WV102432BLL, the CY7C1564XV18 uniquely delivers 450 MHz DDR bandwidth with selectable 2.5-cycle or 1-cycle latency via DOFF, making it optimal for next-generation packet processing and real-time signal capture where timing agility and peak throughput are co-critical.
Availability
CY7C1564XV18 is available at Aetrix Electronics and suitable for network infrastructure, wireless baseband processing, high-speed test instrumentation, and real-time video encoding requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1564XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.
The QDR® II+ Xtreme SRAM product line targets high-speed packet buffering and real-time data streaming systems requiring deterministic latency, concurrent access, and DDR bandwidth without bus turnaround penalties.
FAQ
What is the function of the DOFF pin on CY7C1564XV18?
The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR-II+ mode with 2.5-cycle read latency and up to 450 MHz clock frequency; when pulled LOW, the PLL is disabled and the device reverts to QDR-I timing with 1-cycle latency and maximum 167 MHz operation. This allows runtime mode selection based on system timing budget.
How does the ZQ pin affect signal integrity?
The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to match the PCB trace characteristic impedance. This calibration reduces signal reflections and ensures clean eye diagrams at 450 MHz, eliminating the need for discrete series termination resistors.
Can CY7C1564XV18 perform read and write operations simultaneously?
Yes - the CY7C1564XV18 has fully independent read and write ports with separate data buses (Q[35:0] and D[35:0]), clocks (K and K), and port selects (RPS/WPS). Concurrent transactions are supported without arbitration or bus contention, enabling true full-duplex memory access essential for packet buffering and real-time streaming.
What is the purpose of QVLD and how is it timed?
QVLD is a synchronous output that asserts coincident with the first valid word of a read burst on Q[35:0]. It is edge-aligned with CQ and CQ echo clocks - not with K/K - providing a receiver-friendly strobe that accounts for internal propagation delay. This eliminates setup/hold uncertainty for FPGA capture logic using echo-clock sampling.
CY7C1564XV18-366BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 366 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1564XV18-366BZC FAQ
1.How can I place an order for CY7C1564XV18-366BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1564XV18-366BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1564XV18-366BZC reliable?
The price and inventory of CY7C1564XV18-366BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1564XV18-366BZC is usually 5 days.
3.What payment methods are accepted for CY7C1564XV18-366BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1564XV18-366BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1564XV18-366BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1564XV18-366BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1564XV18-366BZC?
For technical support, including CY7C1564XV18-366BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1564XV18-366BZC requirements.
6.How does Aetrix verify that CY7C1564XV18-366BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1564XV18-366BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1564XV18-366BZC meets industry standards.
7.What is the process for return or replacement of CY7C1564XV18-366BZC?
All CY7C1564XV18-366BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1564XV18-366BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1564XV18-366BZC part is unused and in its original packaging.
Return procedure for CY7C1564XV18-366BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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