Cypress Semiconductor Corp CY7C1564XV18-450BZC
- Part No.:
- CY7C1564XV18-450BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1564XV18-450BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,145
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Product details
Overview
CY7C1564XV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 450 MHz clock support (900 Mbps DDR data rate), 2.5-cycle read latency when DOFF = HIGH, and HSTL I/Os operating at 1.4–1.6 V VDDQ. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1564XV18 datasheet, CY7C1564XV18 pinout, CY7C1564XV18 application, or CY7C1564XV18 equivalent, key selection criteria include burst depth (2-word), PLL-enabled timing precision, echo clock (CQ/CQ) synchronization, byte write select granularity (BWS[3:0]), and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
The CY7C1564XV18 implements a synchronous pipelined architecture with independent K (positive) and K (negative) input clocks-both rising edges drive DDR data transfers on dedicated read (Q[35:0]) and write (D[35:0]) ports. Address inputs (A[19:0]) are multiplexed and latched alternately on K/K edges to support 2M × 36 organization.
It integrates a Phase-Locked Loop (PLL) for precise data placement and includes echo clocks (CQ/CQ) aligned to K/K for simplified high-speed capture. The QVLD signal provides edge-aligned valid-data indication, while DOFF enables runtime switching between QDR-II+ (2.5-cycle latency) and QDR-I (1-cycle latency) modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Maximum Clock Frequency | 450 MHz - enables 900 Mbps per data pin via DDR interface |
| Read Latency | 2.5 clock cycles (with DOFF = HIGH); supports deterministic timing for pipeline-constrained systems |
| I/O Voltage (VDDQ) | 1.4 V to 1.6 V - compatible with 1.5 V HSTL-18 signaling and impedance-controlled routing |
| Core Supply (VDD) | 1.8 V ± 0.1 V - low-power operation with tight regulation requirement |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - supports fine-pitch, high-density routing for backplane interfaces |
| Burst Length | Two 36-bit words per access - reduces address bus toggling and simplifies controller logic |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | Latched on rising edges of K/K; supports full 36-bit parallel writes |
| Q[35:0] | Synchronous read data output | DDR outputs driven on K/K rising edges; tristated when RPS inactive |
| A[19:0] | Multiplexed address input | Shared by read/write ports; 20 bits address 2M × 36 array |
| RPS / WPS | Active-low port select | Enables independent read/write arbitration without bus contention |
| BWS[3:0] | Byte write select | Four independent 9-bit byte masks (D[8:0], D[17:9], D[26:18], D[35:27]) |
| K / K | Dual DDR clock inputs | Rising edges control all synchronous operations; no internal clock division |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of K/K for source-synchronous capture |
| QVLD | Valid data indicator | Edge-aligned with CQ/CQ; signals validity of current Q[35:0] transfer |
| DOFF | PLL disable control | LOW forces QDR-I mode (1-cycle latency, ≤167 MHz); HIGH enables QDR-II+ timing |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune CQ/Q output driver impedance (0.2 × RQ) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates data bus turnaround delays and avoids contention in full-duplex traffic buffers |
| Two-word burst architecture | Halves effective address bus frequency versus single-word devices, easing controller design |
| HSTL-18 I/O with variable drive | Ensures signal integrity at 450 MHz with programmable output strength matching PCB trace impedance |
| Integrated PLL with echo clocks | Enables sub-cycle timing margin for >400 MHz system interfaces without external delay compensation |
| JTAG 1149.1 boundary scan | Supports production test and board-level debug without requiring additional probe points |
Applications
| Telecom Line Card Buffering | High-Speed Packet Switching |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/40G Ethernet line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking first-in-first-out (FIFO) buffer with simultaneous read/write at 450 MHz. Use Value: 2.5-cycle latency and echo clocks enable reliable capture at 900 Mbps DDR without complex deskew circuitry. |
Use Scenario: Supporting concurrent lookup table updates and forwarding decisions in multi-layer switches. IC Role / Device Role / Timing Role: High-bandwidth memory for TCAM-assisted forwarding engines requiring atomic read-modify-write cycles. Use Value: Independent RPS/WPS and BWS[3:0] allow selective byte writes during active reads-preserving data coherency. |
| Baseband Processing in 5G RU | Real-Time Video Frame Buffering |
|
Use Scenario: Interfacing FPGA-based digital front-end (DFE) modules with radio unit (RU) processors in O-RAN compliant systems. IC Role / Device Role / Timing Role: Low-latency shared memory for IQ sample exchange between uplink/downlink processing paths. Use Value: 1.8 V core + 1.5 V I/O reduces power density while maintaining 450 MHz throughput for massive MIMO beamforming. |
Use Scenario: Storing uncompressed 4K video frames in broadcast-grade encoder/decoder hardware. IC Role / Device Role / Timing Role: Burst-access frame buffer supporting dual-stream read/write for deinterlacing and motion estimation. Use Value: Full data coherency ensures most recent pixel data is always available-critical for real-time artifact reduction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10BG | 36-Mbit (1M × 36), 333 MHz max, LVDS I/O, no integrated PLL | Lower bandwidth; requires external clock management IC for echo timing | Select when cost sensitivity outweighs need for 450 MHz and on-die PLL simplification |
| ISSI IS61WV102436B | 36-Mbit (1M × 36), asynchronous interface, 15 ns access, no DDR or burst | No concurrent read/write; unsuitable for real-time streaming applications | Only consider for legacy control-plane memory where timing determinism is secondary |
Compared with IDT72T36120L10BG and IS61WV102436B, the CY7C1564XV18 uniquely delivers 72-Mbit density, 450 MHz DDR throughput, and integrated echo clocks-enabling simpler, higher-performance designs in packet-processing and baseband subsystems.
Availability
CY7C1564XV18 is available at Aetrix Electronics and suitable for telecom infrastructure, 5G radio units, and high-speed packet switching applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1564XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.
The QDR® II+ Xtreme SRAM product line was designed specifically for deterministic, low-latency, high-throughput memory interfacing in networking and wireless infrastructure-emphasizing concurrent access, timing precision, and signal integrity at multi-Gbps rates.
FAQ
What is the function of the DOFF pin on CY7C1564XV18?
The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR-II+ mode with 2.5-cycle read latency and full 450 MHz capability; when pulled LOW, it reverts to QDR-I timing with 1-cycle latency and reduced maximum frequency (≤167 MHz). This allows runtime mode switching without changing clock sources or controller firmware.
How does the ZQ pin affect signal integrity?
The ZQ pin calibrates the output driver impedance of Q[35:0], CQ, and CQ pins to match the system data bus. Connecting ZQ to a resistor (RQ) to ground sets output impedance to 0.2 × RQ; connecting directly to VDDQ enables minimum impedance mode. Incorrect ZQ termination causes signal reflections and timing violations above 300 MHz.
Can CY7C1564XV18 be used without the PLL enabled?
Yes-asserting DOFF LOW disables the PLL and places the device in QDR-I mode, supporting 1-cycle latency and operation up to 167 MHz. However, echo clocks (CQ/CQ) remain functional but lose PLL-derived phase alignment, requiring external timing compensation for reliable >200 MHz capture.
What is the purpose of BWS[3:0] in write operations?
BWS[3:0] are active-low byte write selects that independently gate four 9-bit segments of the 36-bit D[35:0] bus. When a BWS bit is deasserted, its corresponding byte remains unaltered during the write cycle-enabling partial updates without read-modify-write overhead, critical for metadata patching in packet buffers.
CY7C1564XV18-450BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1564XV18-450BZC FAQ
1.How can I place an order for CY7C1564XV18-450BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1564XV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1564XV18-450BZC reliable?
The price and inventory of CY7C1564XV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1564XV18-450BZC is usually 5 days.
3.What payment methods are accepted for CY7C1564XV18-450BZC?
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Once your CY7C1564XV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1564XV18-450BZC?
For technical support, including CY7C1564XV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1564XV18-450BZC requirements.
6.How does Aetrix verify that CY7C1564XV18-450BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1564XV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1564XV18-450BZC meets industry standards.
7.What is the process for return or replacement of CY7C1564XV18-450BZC?
All CY7C1564XV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1564XV18-450BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1564XV18-450BZC part is unused and in its original packaging.
Return procedure for CY7C1564XV18-450BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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