Cypress Semiconductor Corp CY7C1564XV18-450BZXC
- Part No.:
- CY7C1564XV18-450BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1564XV18-450BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:213
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Product details
Overview
CY7C1564XV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 450 MHz clock operation (900 Mbps DDR data rate), 2.5-cycle read latency when DOFF = HIGH, and HSTL I/Os supporting 1.5 V VDDQ. It delivers full data coherency and synchronous self-timed writes for high-bandwidth packet buffering in network line cards.
For engineers reviewing the CY7C1564XV18 datasheet, CY7C1564XV18 pinout, CY7C1564XV18 application, or CY7C1564XV18 equivalent, key selection criteria include burst depth (2-word), dual-clock timing (K/K), echo clock support (CQ/CQ), QVLD signaling, and byte-write select granularity (BWS[3:0]) for precise memory update control.
Technical Context
The CY7C1564XV18 implements a true dual-port QDR II+ architecture with physically independent read and write data paths-no bus turnaround required. Its 20-bit address bus latches both read and write addresses on alternating rising edges of K and K clocks, enabling concurrent access to the 2M × 36 array.
It integrates a PLL for accurate data placement and supports two operational modes: QDR-II+ mode (2.5-cycle read latency, up to 450 MHz) when DOFF = HIGH, and QDR-I mode (1-cycle latency, ≤167 MHz) when DOFF = LOW. Echo clocks CQ and CQ are free-running, edge-aligned with K and K respectively, simplifying high-speed data capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 450 MHz - enables 900 MB/s per port via DDR interface |
| Read Latency | 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline-synchronized systems |
| I/O Voltage | VDDQ = 1.4–1.6 V - compatible with 1.5 V HSTL-18 interfaces |
| Core Voltage | VDD = 1.8 V ± 0.1 V - low-power 1.8 V core with separate I/O rail |
| Burst Length | Two 36-bit words per access - reduces address bus toggling by 50% vs. single-word |
| Write Select Granularity | BWS[3:0] - enables independent 9-bit byte writes across 36-bit data bus |
Pinout & Package
Package: 165-ball FBGA (13 mm × 15 mm × 1.4 mm), RoHS-compliant, with 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; supports full 36-bit parallel writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of K/K; tristated when RPS is deasserted |
| A[19:0] | Multiplexed address bus | 20-bit bus shared for read/write addressing; latched on alternating K/K edges |
| RPS / WPS | Active-low port enable controls | Independent gating of read/write operations; enables depth expansion |
| BWS[3:0] | Byte write select inputs | Four independent 9-bit write masks - preserves unselected bytes during partial writes |
| CQ / CQ | Output-synchronized echo clocks | Free-running, edge-aligned copies of K/K - eliminate clock skew in receiver capture logic |
| QVLD | Valid data indicator output | Asserted synchronously with CQ/CQ rising edges - signals valid Q[35:0] data window |
| DOFF | PLL disable input | LOW forces QDR-I timing (1-cycle latency); HIGH enables full QDR-II+ mode |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround overhead and prevents data contention in full-duplex traffic flows |
| Two-word burst architecture | Halves effective address bus frequency - critical for routing-constrained high-pin-count FPGAs |
| HSTL-18 I/O buffers with programmable drive | Ensures signal integrity at 900 Mbps while matching standard FPGA memory interfaces |
| On-chip PLL with echo clocks (CQ/CQ) | Enables source-synchronous capture without external delay compensation circuitry |
| QVLD strobe synchronized to echo clocks | Provides unambiguous data validity window - simplifies timing closure in ASIC/FPGA receivers |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switch fabric ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a zero-latency, concurrent-access buffer between ingress parser and egress scheduler pipelines. Use Value: 2.5-cycle read latency and 450 MHz clock enable sustained 900 MB/s throughput per port - matching line-rate traffic without backpressure. | Use Scenario: Holding real-time voice/video frame buffers in carrier-grade SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory for jitter-sensitive TDM time-slot assignment logic. Use Value: Full data coherency and synchronous self-timed writes guarantee atomic updates across 36-bit wide control registers - preventing frame misalignment. |
| High-Speed Test Equipment Memory | FPGA-Based Protocol Analyzer |
Use Scenario: Capturing multi-gigabit serial protocol traces (e.g., PCIe Gen4, SATA III) in real time. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to FPGA transceiver RX/TX lanes for lossless trace capture. Use Value: Two-word burst + DDR I/Os deliver 1.8 GB/s aggregate bandwidth - sufficient to record full-width 128-bit AXI4-Stream at 142 MHz. | Use Scenario: Deep packet inspection engine storing parsed packet metadata and payload fragments. IC Role / Device Role / Timing Role: Deterministic-latency memory for parallel rule-matching engines running on Xilinx Ultrascale+ FPGA fabric. Use Value: BWS[3:0] enables selective 9-bit field updates in metadata tables without disturbing adjacent entries - preserving state consistency during live updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit QDR-II, 333 MHz max, 1.8 V core, no DOFF mode switching | Fixed 2-cycle latency; lacks QDR-II+ 2.5-cycle mode and echo clocks | Select when strict 2-cycle timing and legacy QDR-II compatibility are required |
| ISSI IS61WV102432BLL-15BLI | 1M × 32 sync SRAM, 15 ns async read, no DDR, no dual-port | Asynchronous interface, lower density (32 Mbit), no burst or echo clock support | Select only for cost-sensitive, non-pipelined control-plane buffering where bandwidth < 200 MB/s suffices |
Compared with IDT72T3615L10BG and IS61WV102432BLL-15BLI, the CY7C1564XV18 uniquely supports configurable latency (1- or 2.5-cycle), echo-clock–assisted timing closure, and 450 MHz operation - making it optimal for next-generation packet-processing pipelines requiring deterministic high-throughput memory access.
Availability
CY7C1564XV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and FPGA-based protocol analyzer applications requiring stable component supply and long-term industrial availability.
Supply support for CY7C1564XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
The QDR® II+ Xtreme SRAM product line targets ultra-low-latency, high-bandwidth memory subsystems in packet-switched infrastructure - emphasizing concurrent read/write, deterministic timing, and FPGA-friendly signaling.
FAQ
What is the function of the DOFF pin on CY7C1564XV18?
The DOFF pin controls internal PLL operation: when pulled HIGH, the device runs in QDR-II+ mode with 2.5-cycle read latency and full 450 MHz capability; when pulled LOW, the PLL disables and the device reverts to QDR-I timing with 1-cycle latency and reduced maximum frequency (≤167 MHz). This allows hardware-selectable latency/bandwidth trade-offs without firmware changes.
How does the CY7C1564XV18 handle partial writes?
Partial writes are managed via four active-low Byte Write Select signals (BWS[3:0]), each controlling a 9-bit segment of the 36-bit D[35:0] bus. When a BWS bit is deasserted, the corresponding 9-bit byte remains unaltered in memory. This enables atomic updates to specific fields within wide data structures without requiring read-modify-write sequences.
What is the purpose of the CQ and CQ echo clocks?
CQ and CQ are free-running, edge-aligned output copies of the K and K input clocks. They provide source-synchronous timing references for downstream receivers, eliminating setup/hold uncertainty caused by PCB trace skew. Unlike system clocks, they track process/voltage/temperature variations of the SRAM's internal clock path - enabling robust data capture at 900 Mbps without external delay-locked loops.
Can CY7C1564XV18 be used in depth-expanded configurations?
Yes - depth expansion is supported using independent RPS (read port select) and WPS (write port select) inputs. Multiple devices can share the same address and data buses while being individually enabled per port, allowing seamless extension of memory depth (e.g., stacking two 2M × 36 devices to create 4M × 36) without external address decoding logic.
CY7C1564XV18-450BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1564XV18-450BZXC FAQ
1.How can I place an order for CY7C1564XV18-450BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1564XV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1564XV18-450BZXC reliable?
The price and inventory of CY7C1564XV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1564XV18-450BZXC is usually 5 days.
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Once your CY7C1564XV18-450BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1564XV18-450BZXC?
For technical support, including CY7C1564XV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1564XV18-450BZXC requirements.
6.How does Aetrix verify that CY7C1564XV18-450BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1564XV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1564XV18-450BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1564XV18-450BZXC?
All CY7C1564XV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1564XV18-450BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1564XV18-450BZXC part is unused and in its original packaging.
Return procedure for CY7C1564XV18-450BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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