Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Cypress Semiconductor Corp CY7C1565KV18-450BZC

Part No.:
CY7C1565KV18-450BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565KV18-450BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,066

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1565KV18-450BZC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 450 MHz maximum clock frequency, 2.5-cycle read latency, and separate read/write ports enabling concurrent transactions in high-bandwidth networking and packet buffering systems.

For engineers reviewing the CY7C1565KV18-450BZC datasheet, CY7C1565KV18-450BZC pinout, CY7C1565KV18-450BZC application, or CY7C1565KV18-450BZC equivalent, key selection criteria include DDR interface timing at 900 Mbps effective data rate, HSTL I/O compatibility, echo clock (CQ/CQ) support for precise data capture, and DOFF-controlled latency mode switching between QDR I (1-cycle) and QDR II+ (2.5-cycle) operation.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 19-bit address bus. Each port uses rising edges of complementary K/K clocks for input sampling and output registration, eliminating bus turnaround and supporting full-duplex operation.

It integrates a PLL for accurate data placement and supports programmable output impedance via ZQ calibration. The QVLD signal provides edge-aligned valid-data indication synchronized to CQ/CQ, while BWS[3:0] enables byte-selective writes across four 9-bit segments of the 36-bit data bus.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36), enabling large packet buffers without external depth expansion
Max Clock Frequency 450 MHz - sets maximum sustained bandwidth of 3.24 GB/s (4 × 36-bit × 450 MHz)
Read Latency 2.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable real-time trade-off between throughput and determinism
I/O Voltage VDDQ = 1.4 V to 1.8 V - supports both 1.5 V and 1.8 V HSTL interfaces for system voltage flexibility
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in space-constrained routers/switches
Data Interface DDR on both ports - transfers 4 words per 2 clock cycles, reducing address bus toggling and simplifying controller design
Core Supply VDD = 1.8 V ± 0.1 V - low-voltage core enabling power-efficient high-speed operation

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs Latched on rising edges of K/K; 36-bit parallel input path for burst writes
Q[35:0] Synchronous read data outputs Tri-stated when RPS deasserted; driven on rising edges of K/K with QVLD alignment
RPS / WPS Read/write port select Active-low enables independent port activation for concurrent access control
BWS[3:0] Byte write select Four independent 9-bit segment enables (BWS0–BWS3) for partial-word updates without read-modify-write
K / K Complementary input clocks Rising-edge-triggered timing reference for all synchronous I/O; no internal clock generation
CQ / CQ Echo clock outputs Free-running, phase-matched copies of K/K for simplified high-speed data capture in FPGA/ASIC receivers
DOFF PLL disable control Active-low switch between QDR II+ (2.5-cycle latency) and QDR I (1-cycle latency) modes
ZQ Output impedance calibration Connects to external resistor to ground to tune Q[35:0]/CQ/CQ drive strength to match PCB trace impedance

Key Features

Feature Design Value
Separate read/write ports Enables true full-duplex operation - no bus turnaround required, eliminating contention and timing dead zones
Four-word burst architecture Reduces address bus frequency by 4× versus single-word access, lowering EMI and routing complexity
QVLD valid-data indicator Edge-aligned with CQ/CQ to eliminate setup/hold uncertainty in high-speed capture logic
HSTL-compatible I/O Supports 1.5 V or 1.8 V VDDQ with variable-drive output buffers - matches FPGA transceiver standards directly
JTAG 1149.1 test access Enables boundary-scan testing of interconnects in dense memory subsystems without additional test fixtures

Applications

High-Speed Packet Buffering Network Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches operating at 10 Gbps+ line rates.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, with simultaneous read (scheduler fetch) and write (parser store).

Use Value: 2.5-cycle latency ensures deterministic scheduling window; 450 MHz clock supports ≥3.2 GB/s aggregate throughput matching multi-lane SerDes bandwidth.

Use Scenario: Interconnecting crossbar switch controllers and port ASICs in modular chassis-based routers.

IC Role / Device Role / Timing Role: Shared memory node providing low-latency, collision-free access for flow control tokens and queue state updates.

Use Value: Independent RPS/WPS allows concurrent token reads and state writes; echo clocks (CQ/CQ) simplify timing closure with FPGA-based switch fabric logic.

Telecom Line Card Buffering Test Equipment Pattern Memory

Use Scenario: Holding protocol-specific frame payloads (e.g., OTN, CPRI) during retiming and jitter attenuation in 5G fronthaul units.

IC Role / Device Role / Timing Role: Burst-access memory staging data between high-speed SERDES and lower-speed DSP processing blocks.

Use Value: Four-word burst reduces address strobe frequency, easing PCB layout; DOFF pin enables fallback to 1-cycle latency during debug or low-power modes.

Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for high-pin-count IC validation.

IC Role / Device Role / Timing Role: High-throughput pattern memory feeding parallel DUT channels with synchronized read/write bursts.

Use Value: 36-bit width matches common ATE channel groupings; ZQ calibration ensures signal integrity across long memory bus traces in rack-mounted testers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 72-Mbit QDR II, 1000 Mbps DDR rate, 1.8 V core, but lacks DOFF-configurable latency and ZQ calibration Fixed 2-cycle latency only; requires external impedance matching resistors Preferred where legacy QDR II timing compliance is mandatory and latency flexibility is unnecessary
ISSI IS61QW25636A-450BQ 72-Mbit QDR II+, same 450 MHz speed and 2.5-cycle latency, but uses 169-ball FBGA (13 × 13 mm) and different BWS mapping Smaller package footprint but incompatible pinout; requires PCB redesign and timing revalidation Consider for new designs prioritizing board area reduction, provided layout and firmware changes are acceptable

Compared with IDT72T3615L10BG and IS61QW25636A-450BQ, CY7C1565KV18-450BZC uniquely combines DOFF-selectable latency, integrated ZQ calibration, and echo clock support - critical for systems requiring dynamic latency adaptation or simplified high-speed data capture without external delay elements.

Availability

CY7C1565KV18-450BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom line card buffering requiring stable component supply and long-term industrial availability.

Supply support for CY7C1565KV18-450BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1565KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1565KV18-450BZC?

The DOFF pin controls the internal PLL: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency; when pulled LOW, it disables the PLL and reverts to QDR I timing with 1-cycle latency and reduced maximum frequency (≤167 MHz). This enables runtime latency tuning without changing clock frequency or firmware.

How does the ZQ pin affect signal integrity?

ZQ connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (≈48 Ω), matching standard PCB trace impedances. This minimizes reflections and improves eye diagram margins at 450 MHz clock rates without requiring external series termination.

Can CY7C1565KV18-450BZC support partial writes without read-modify-write cycles?

Yes - the BWS[3:0] inputs enable selective writing of four independent 9-bit segments (D[8:0], D[17:9], D[26:18], D[35:27]) within the 36-bit word. When a BWS bit is deasserted, its corresponding byte remains unaltered, allowing atomic partial updates without reading prior data or using external logic.

What is the role of CQ and CQ echo clocks in system timing?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide a local, jitter-reduced timing reference at the receiver (e.g., FPGA input register), eliminating skew between clock and data paths and relaxing setup/hold timing constraints for Q[35:0] capture at 900 Mbps effective data rate.

CY7C1565KV18-450BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565KV18-450BZC FAQ

1.How can I place an order for CY7C1565KV18-450BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565KV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565KV18-450BZC reliable?

The price and inventory of CY7C1565KV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-450BZC is usually 5 days.

3.What payment methods are accepted for CY7C1565KV18-450BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-450BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565KV18-450BZC?

CY7C1565KV18-450BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565KV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565KV18-450BZC?

For technical support, including CY7C1565KV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-450BZC requirements.

6.How does Aetrix verify that CY7C1565KV18-450BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1565KV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-450BZC meets industry standards.

7.What is the process for return or replacement of CY7C1565KV18-450BZC?

All CY7C1565KV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-450BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565KV18-450BZC part is unused and in its original packaging.

Return procedure for CY7C1565KV18-450BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1565KV18-450BZC Tags

  • CY7C1565KV18-450BZC
  • CY7C1565KV18-450BZC PDF
  • CY7C1565KV18-450BZC Datasheet
  • CY7C1565KV18-450BZC Specifications
  • CY7C1565KV18-450BZC Images
  • Cypress Semiconductor Corp
  • Cypress Semiconductor Corp CY7C1565KV18-450BZC
  • Buy CY7C1565KV18-450BZC
  • CY7C1565KV18-450BZC Price
  • CY7C1565KV18-450BZC Distributor
  • CY7C1565KV18-450BZC Supplier
  • CY7C1565KV18-450BZC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER