Cypress Semiconductor Corp CY7C1565KV18-450BZC
- Part No.:
- CY7C1565KV18-450BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565KV18-450BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1565KV18-450BZC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 450 MHz maximum clock frequency, 2.5-cycle read latency, and separate read/write ports enabling concurrent transactions in high-bandwidth networking and packet buffering systems.
For engineers reviewing the CY7C1565KV18-450BZC datasheet, CY7C1565KV18-450BZC pinout, CY7C1565KV18-450BZC application, or CY7C1565KV18-450BZC equivalent, key selection criteria include DDR interface timing at 900 Mbps effective data rate, HSTL I/O compatibility, echo clock (CQ/CQ) support for precise data capture, and DOFF-controlled latency mode switching between QDR I (1-cycle) and QDR II+ (2.5-cycle) operation.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 19-bit address bus. Each port uses rising edges of complementary K/K clocks for input sampling and output registration, eliminating bus turnaround and supporting full-duplex operation.
It integrates a PLL for accurate data placement and supports programmable output impedance via ZQ calibration. The QVLD signal provides edge-aligned valid-data indication synchronized to CQ/CQ, while BWS[3:0] enables byte-selective writes across four 9-bit segments of the 36-bit data bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36), enabling large packet buffers without external depth expansion |
| Max Clock Frequency | 450 MHz - sets maximum sustained bandwidth of 3.24 GB/s (4 × 36-bit × 450 MHz) |
| Read Latency | 2.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable real-time trade-off between throughput and determinism |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - supports both 1.5 V and 1.8 V HSTL interfaces for system voltage flexibility |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in space-constrained routers/switches |
| Data Interface | DDR on both ports - transfers 4 words per 2 clock cycles, reducing address bus toggling and simplifying controller design |
| Core Supply | VDD = 1.8 V ± 0.1 V - low-voltage core enabling power-efficient high-speed operation |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; 36-bit parallel input path for burst writes |
| Q[35:0] | Synchronous read data outputs | Tri-stated when RPS deasserted; driven on rising edges of K/K with QVLD alignment |
| RPS / WPS | Read/write port select | Active-low enables independent port activation for concurrent access control |
| BWS[3:0] | Byte write select | Four independent 9-bit segment enables (BWS0–BWS3) for partial-word updates without read-modify-write |
| K / K | Complementary input clocks | Rising-edge-triggered timing reference for all synchronous I/O; no internal clock generation |
| CQ / CQ | Echo clock outputs | Free-running, phase-matched copies of K/K for simplified high-speed data capture in FPGA/ASIC receivers |
| DOFF | PLL disable control | Active-low switch between QDR II+ (2.5-cycle latency) and QDR I (1-cycle latency) modes |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune Q[35:0]/CQ/CQ drive strength to match PCB trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true full-duplex operation - no bus turnaround required, eliminating contention and timing dead zones |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access, lowering EMI and routing complexity |
| QVLD valid-data indicator | Edge-aligned with CQ/CQ to eliminate setup/hold uncertainty in high-speed capture logic |
| HSTL-compatible I/O | Supports 1.5 V or 1.8 V VDDQ with variable-drive output buffers - matches FPGA transceiver standards directly |
| JTAG 1149.1 test access | Enables boundary-scan testing of interconnects in dense memory subsystems without additional test fixtures |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches operating at 10 Gbps+ line rates. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, with simultaneous read (scheduler fetch) and write (parser store). Use Value: 2.5-cycle latency ensures deterministic scheduling window; 450 MHz clock supports ≥3.2 GB/s aggregate throughput matching multi-lane SerDes bandwidth. |
Use Scenario: Interconnecting crossbar switch controllers and port ASICs in modular chassis-based routers. IC Role / Device Role / Timing Role: Shared memory node providing low-latency, collision-free access for flow control tokens and queue state updates. Use Value: Independent RPS/WPS allows concurrent token reads and state writes; echo clocks (CQ/CQ) simplify timing closure with FPGA-based switch fabric logic. |
| Telecom Line Card Buffering | Test Equipment Pattern Memory |
|
Use Scenario: Holding protocol-specific frame payloads (e.g., OTN, CPRI) during retiming and jitter attenuation in 5G fronthaul units. IC Role / Device Role / Timing Role: Burst-access memory staging data between high-speed SERDES and lower-speed DSP processing blocks. Use Value: Four-word burst reduces address strobe frequency, easing PCB layout; DOFF pin enables fallback to 1-cycle latency during debug or low-power modes. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for high-pin-count IC validation. IC Role / Device Role / Timing Role: High-throughput pattern memory feeding parallel DUT channels with synchronized read/write bursts. Use Value: 36-bit width matches common ATE channel groupings; ZQ calibration ensures signal integrity across long memory bus traces in rack-mounted testers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 72-Mbit QDR II, 1000 Mbps DDR rate, 1.8 V core, but lacks DOFF-configurable latency and ZQ calibration | Fixed 2-cycle latency only; requires external impedance matching resistors | Preferred where legacy QDR II timing compliance is mandatory and latency flexibility is unnecessary |
| ISSI IS61QW25636A-450BQ | 72-Mbit QDR II+, same 450 MHz speed and 2.5-cycle latency, but uses 169-ball FBGA (13 × 13 mm) and different BWS mapping | Smaller package footprint but incompatible pinout; requires PCB redesign and timing revalidation | Consider for new designs prioritizing board area reduction, provided layout and firmware changes are acceptable |
Compared with IDT72T3615L10BG and IS61QW25636A-450BQ, CY7C1565KV18-450BZC uniquely combines DOFF-selectable latency, integrated ZQ calibration, and echo clock support - critical for systems requiring dynamic latency adaptation or simplified high-speed data capture without external delay elements.
Availability
CY7C1565KV18-450BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom line card buffering requiring stable component supply and long-term industrial availability.
Supply support for CY7C1565KV18-450BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1565KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure where bus turnaround overhead must be eliminated.
FAQ
What is the function of the DOFF pin on CY7C1565KV18-450BZC?
The DOFF pin controls the internal PLL: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency; when pulled LOW, it disables the PLL and reverts to QDR I timing with 1-cycle latency and reduced maximum frequency (≤167 MHz). This enables runtime latency tuning without changing clock frequency or firmware.
How does the ZQ pin affect signal integrity?
ZQ connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (≈48 Ω), matching standard PCB trace impedances. This minimizes reflections and improves eye diagram margins at 450 MHz clock rates without requiring external series termination.
Can CY7C1565KV18-450BZC support partial writes without read-modify-write cycles?
Yes - the BWS[3:0] inputs enable selective writing of four independent 9-bit segments (D[8:0], D[17:9], D[26:18], D[35:27]) within the 36-bit word. When a BWS bit is deasserted, its corresponding byte remains unaltered, allowing atomic partial updates without reading prior data or using external logic.
What is the role of CQ and CQ echo clocks in system timing?
CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide a local, jitter-reduced timing reference at the receiver (e.g., FPGA input register), eliminating skew between clock and data paths and relaxing setup/hold timing constraints for Q[35:0] capture at 900 Mbps effective data rate.
CY7C1565KV18-450BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565KV18-450BZC FAQ
1.How can I place an order for CY7C1565KV18-450BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565KV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565KV18-450BZC reliable?
The price and inventory of CY7C1565KV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-450BZC is usually 5 days.
3.What payment methods are accepted for CY7C1565KV18-450BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-450BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1565KV18-450BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1565KV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1565KV18-450BZC?
For technical support, including CY7C1565KV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-450BZC requirements.
6.How does Aetrix verify that CY7C1565KV18-450BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1565KV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-450BZC meets industry standards.
7.What is the process for return or replacement of CY7C1565KV18-450BZC?
All CY7C1565KV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-450BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565KV18-450BZC part is unused and in its original packaging.
Return procedure for CY7C1565KV18-450BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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