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Cypress Semiconductor Corp CY7C1565KV18-450BZXI

Part No.:
CY7C1565KV18-450BZXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565KV18-450BZXI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:819

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Product details

Overview

CY7C1565KV18-450BZXI from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, four-word burst architecture, and 2.5-cycle read latency at 450 MHz. It features separate read/write ports, DDR interfaces on both ports (effective 900 Mbps per port), 1.8 V core supply, and 1.4–1.8 V I/O supply. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1565KV18-450BZXI datasheet, CY7C1565KV18-450BZXI pinout, CY7C1565KV18-450BZXI application, or CY7C1565KV18-450BZXI equivalent, key selection criteria include burst depth, dual-port concurrency, echo clock timing support, DOFF-configurable latency mode, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write data paths, eliminating bus turnaround. It uses two input clocks (K and K) - both rising edges drive register sampling - and provides echo clocks (CQ/CQ) aligned to output data for precise capture in source-synchronous systems.

Internal operation relies on a PLL for accurate data placement and supports two latency modes: 2.5-cycle (DOFF = HIGH) for QDR II+ compliance at up to 550 MHz, or 1-cycle (DOFF = LOW) for QDR I compatibility at lower frequencies. Depth expansion is enabled via RPS/WPS and BWS[3:0] controls across multiple devices.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36), enabling 9 MB of high-speed buffer storage per device
Max Clock Frequency 450 MHz - sets maximum sustained bandwidth of 3.24 GB/s (4 × 36-bit × 450 MHz)
Read Latency 2.5 cycles (DOFF = HIGH) - determines minimum time from address latch to first valid Q[x] word
Core Supply Voltage 1.8 V ± 0.1 V - defines required precision regulation and decoupling for stable internal timing
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with both 1.5 V and 1.8 V HSTL-15/18 logic families
Package 165-ball FBGA (13 × 15 × 1.4 mm) - enables dense routing with controlled impedance for >400 MHz signaling
Burst Length Four 36-bit words per access - reduces address bus toggling frequency by 4× vs. single-word mode

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, lead-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs Latched on rising edges of K/K; supports full 36-bit parallel writes per cycle
Q[35:0] Synchronous read data outputs Driven on rising edges of K/K; quad-word burst delivered over two clock cycles
RPS / WPS Read/write port select (active LOW) Enables independent arbitration between ports; critical for concurrent transaction control
BWS[3:0] Byte write select (active LOW) Permits partial 9-bit byte writes (BWS0–BWS3 map to D[8:0]–D[35:27]); preserves unselected bytes
K / K Differential clock inputs Both rising edges used for register sampling; no internal inversion - requires matched trace lengths
CQ / CQ Echo clock outputs Source-synchronous timing references for Q[x] capture; phase-aligned to output data edges
DOFF PLL disable input Switches between QDR II+ (2.5-cycle) and QDR I (1-cycle) latency modes; affects max frequency
QVLD Data validity indicator Edge-aligned with CQ/CQ; signals when Q[x] contains valid burst data - essential for receiver synchronization

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delays and contention, enabling true simultaneous read/write at full bandwidth
Four-word burst architecture Reduces effective address bus frequency by 75%, lowering routing complexity and signal integrity risk
HSTL-15/18 compatible I/O Ensures interoperability with FPGA/ASIC memory controllers using standard high-speed interface standards
Programmable output impedance (ZQ) Allows dynamic tuning of Q[x]/CQ output drive strength to match PCB trace impedance (typically 50 Ω)
JTAG 1149.1 test access port Supports boundary scan testing and in-system debug without requiring additional test fixtures

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler ASICs.

Use Value: Concurrent read/write eliminates arbitration stalls, sustaining 450 MHz throughput across 36-bit datapath for line-rate forwarding.

Use Scenario: Holding real-time voice/video frame buffers in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: High-reliability burst memory interfacing with TI C66x DSPs and Xilinx Ultrascale+ FPGAs.

Use Value: Echo clocks (CQ/CQ) and QVLD simplify timing closure in 450 MHz source-synchronous interfaces with <150 ps skew budget.

High-Speed Test Equipment Memory Avionics Data Acquisition Buffer

Use Scenario: Capturing multi-channel analog-to-digital samples at >1 GSPS aggregate rate in ATE systems.

IC Role / Device Role / Timing Role: Write-port receives interleaved ADC streams; read-port feeds analysis engine with deterministic latency.

Use Value: 2.5-cycle fixed latency ensures repeatable jitter-free data delivery to FFT processors and pattern generators.

Use Scenario: Buffering sensor telemetry (IMU, pressure, temperature) in flight control computers with DO-254 compliance.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM providing deterministic access for safety-critical monitoring firmware.

Use Value: Single-cycle QDR I mode (via DOFF) validated for 167 MHz operation under extended temperature range (–40°C to +85°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36150L10BG 36-Mbit (1M × 36), 1000 Mbps DDR interface, 1.5 V core, no DOFF-configurable latency Lower density; lacks QDR II+ burst flexibility and echo clock support Select when system requires smaller buffer size and simpler timing model without PLL dependency
ISSI IS61WV102436B 36-Mbit (1M × 36), asynchronous interface, 10 ns access, no DDR/QDR architecture No burst capability, no concurrent ports, significantly lower bandwidth (<100 MB/s) Choose only for legacy designs where synchronous timing and high throughput are not required

Compared with IDT72T36150L10BG and IS61WV102436B, CY7C1565KV18-450BZXI delivers double the density and 32× higher bandwidth via its QDR II+ architecture, while DOFF pin enables field-selectable latency modes - critical for mixed-speed system integration.

Availability

CY7C1565KV18-450BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C1565KV18-450BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1565KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput buffering in packet-switched infrastructure where concurrent read/write bandwidth is non-negotiable.

FAQ

What is the function of the DOFF pin on CY7C1565KV18-450BZXI?

The DOFF pin controls the internal PLL: when asserted HIGH, it enables QDR II+ mode with 2.5-cycle read latency and supports up to 550 MHz operation; when LOW, it disables the PLL and reverts the device to QDR I mode with 1-cycle latency and reduced max frequency (≤167 MHz). This allows hardware-selectable timing behavior without changing firmware or controller logic.

How does the ZQ pin affect signal integrity in high-speed designs?

ZQ connects to an external resistor (typically 240 Ω) to ground to calibrate output driver impedance for Q[35:0], CQ, and CQ pins. This achieves ~50 Ω termination matching to PCB traces, minimizing reflections and ensuring clean eye diagrams at 450 MHz. Leaving ZQ unconnected or tied to GND violates specification and causes undefined drive strength.

Can CY7C1565KV18-450BZXI operate with only one clock input?

No - the device requires both K and K differential clock inputs. All synchronous inputs (D[x], RPS, WPS, BWS[x]) and outputs (Q[x], CQ, CQ) are sampled or driven on the rising edge of each clock. Using only K violates timing specifications and prevents correct burst sequencing; K must be inverted and phase-matched to K in PCB layout.

What is the role of QVLD in system-level timing validation?

QVLD is a synchronous output that transitions edge-aligned with CQ/CQ to indicate when Q[35:0] carries valid burst data. It replaces complex setup/hold margin calculations at the receiver - designers use QVLD as a strobe to latch Q[x] in FPGA fabric, ensuring reliable capture even with ±100 ps clock-to-Q skew across the 36-bit bus.

CY7C1565KV18-450BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565KV18-450BZXI FAQ

1.How can I place an order for CY7C1565KV18-450BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565KV18-450BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565KV18-450BZXI reliable?

The price and inventory of CY7C1565KV18-450BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-450BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1565KV18-450BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-450BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565KV18-450BZXI?

CY7C1565KV18-450BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565KV18-450BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565KV18-450BZXI?

For technical support, including CY7C1565KV18-450BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-450BZXI requirements.

6.How does Aetrix verify that CY7C1565KV18-450BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1565KV18-450BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-450BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1565KV18-450BZXI?

All CY7C1565KV18-450BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-450BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565KV18-450BZXI part is unused and in its original packaging.

Return procedure for CY7C1565KV18-450BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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