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Cypress Semiconductor Corp CY7C1568XV18-633BZXC

Part No.:
CY7C1568XV18-633BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1568XV18-633BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:110

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Product details

Overview

CY7C1568XV18-633BZXC from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR II+ Xtreme SRAM with 633 MHz clock frequency, 2.5-cycle read latency, and HSTL I/O interface operating at 1.4–1.6 V VDDQ. It features dual echo clocks (CQ/CQ), QVLD data-valid indicator, and PLL-based timing alignment for high-speed synchronous burst reads in networking line cards and packet buffer applications.

For engineers reviewing the CY7C1568XV18-633BZXC datasheet, CY7C1568XV18-633BZXC pinout, CY7C1568XV18-633BZXC application, or CY7C1568XV18-633BZXC equivalent, key selection criteria include DDR II+ burst timing compliance, 165-ball FBGA mechanical fit, DOFF-controlled latency mode switching, and JTAG 1149.1 test port integration for system-level validation.

Technical Context

This SRAM implements a synchronous pipelined architecture with two-word burst transfers initiated on alternate rising edges of complementary K/K clocks. All address, control, and data signals are registered synchronously to K or K, enabling deterministic timing at 1266 MT/s effective data rate.

The integrated PLL aligns output data edges to echo clocks CQ/CQ, while DOFF pin selects between 2.5-cycle DDR II+ mode (DOFF = HIGH) and 1-cycle DDR I mode (DOFF = LOW). ZQ pin enables programmable output impedance matching to 0.2 × RQ via external resistor to ground.

Key Specifications

Parameter Value and Actual Design Meaning
Density 72 Mbit (4M × 18 organization)
Max Clock Frequency 633 MHz - sets 1266 MT/s DDR data rate
Read Latency 2.5 cycles (DOFF = HIGH) - enables precise timing closure in high-bandwidth buffers
I/O Voltage VDDQ = 1.4 V to 1.6 V - compatible with 1.5 V HSTL-18 systems
Core Voltage VDD = 1.8 V ± 0.1 V - low-power 1.8 V core with separate I/O rail
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for dense memory stacking
JTAG Support IEEE 1149.1 compliant TAP - enables boundary scan testing without external logic

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant Pb-free construction.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Transfers 18-bit words on rising edges of K/K; tristated automatically after deselect
K / K Complementary input clocks Define all synchronous timing; K captures address/control, both capture/write data
CQ / CQ Output echo clocks Free-running, phase-aligned copies of K/K for simplified DDR data capture
QVLD Data validity indicator Asserted edge-aligned with CQ/CQ to signal valid DQ[17:0] output window
DOFF PLL enable/disable control HIGH = DDR II+ mode (2.5-cycle latency); LOW = DDR I mode (1-cycle latency)
ZQ Impedance calibration reference Connects to external resistor to ground to tune CQ/CQ/DQ output drive strength

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling by 50% versus single-word access, lowering system EMI and routing complexity
DDR II+ Xtreme timing mode Enables 633 MHz operation with deterministic 2.5-cycle latency for predictable pipeline depth in packet processors
Integrated PLL with echo clocks Eliminates need for external delay-locked loops or board-level trace length matching for data capture
Byte-write select (BWS[1:0]) Allows partial 18-bit word updates without read-modify-write cycles, preserving bandwidth in dynamic buffer management
JTAG 1149.1 test access port Supports production-level boundary scan verification of solder joints and interconnect integrity in high-density BGA layouts

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: High-throughput packet buffering in 10G/25G Ethernet switch ASIC interfaces.

IC Role / Device Role / Timing Role: Synchronous burst SRAM serving as first-level packet store with deterministic 2.5-cycle read latency aligned to ASIC clock domain.

Use Value: Enables zero-wait-state burst reads at 1266 MT/s, reducing ASIC stall cycles and improving buffer utilization efficiency.

Use Scenario: Control-plane memory in carrier-grade optical transport equipment requiring ECC-agnostic fast access.

IC Role / Device Role / Timing Role: Low-latency DDR II+ SRAM interfacing directly to FPGA-based framer logic using HSTL-18 signaling.

Use Value: Eliminates external DLLs via CQ/CQ echo clocks, simplifying PCB layout and meeting <1 ns skew requirements across 18-bit bus.

Test Equipment Data Capture High-Speed Protocol Analyzer Memory

Use Scenario: Real-time waveform capture buffer in automated test equipment sampling at >1 GSPS.

IC Role / Device Role / Timing Role: Burst-mode SRAM storing interleaved sample streams from parallel ADC channels synchronized to K/K clocks.

Use Value: QVLD signal provides unambiguous data-valid window for FPGA capture logic, removing setup/hold margin uncertainty.

Use Scenario: Deep packet inspection buffer in PCIe-based protocol analyzers handling multi-gigabit serial traffic.

IC Role / Device Role / Timing Role: DDR II+ memory mapped to x8/x16 PCIe endpoint BAR space via bridge FPGA with DOFF-controlled latency tuning.

Use Value: DOFF pin allows runtime switching between 2.5-cycle (high-throughput) and 1-cycle (low-latency debug) modes without hardware change.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36256PFS-15TIN Asynchronous 256K × 18 SRAM, 15 ns access, no DDR interface or PLL Lacks burst, echo clocks, and DDR timing - suitable only for legacy non-pipelined designs Select only when system clocking lacks K/K pair generation capability and bandwidth < 200 MT/s suffices
IS61WV102418BLL-10BLI Synchronous 1M × 18 SRAM, 10 ns cycle time, single-edge clock, no echo clocks or DOFF mode switching Requires external clock forwarding and lacks QVLD - increases FPGA capture logic complexity Choose if cost sensitivity outweighs timing predictability and board-level skew control requirements

Compared with AS7C36256PFS-15TIN and IS61WV102418BLL-10BLI, CY7C1568XV18-633BZXC delivers deterministic DDR II+ timing, eliminates board-level clock-data skew management, and supports runtime latency reconfiguration - critical for next-generation packet processing and test instrumentation.

Availability

CY7C1568XV18-633BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and high-speed protocol analyzer applications requiring stable component supply, long-lifecycle support, and verified Pb-free FBGA sourcing.

Supply support for CY7C1568XV18-633BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure markets.

CY7C1568XV18 belongs to the DDR II+ Xtreme SRAM product line, engineered specifically for deterministic, low-jitter burst memory access in packet-switched networking and high-speed test equipment where DDR I timing is insufficient and DDR2/3 SDRAM introduces unacceptable latency.

FAQ

What is the function of the DOFF pin on CY7C1568XV18-633BZXC?

The DOFF pin controls internal PLL operation: when asserted HIGH, it enables DDR II+ mode with 2.5-cycle read latency and full 633 MHz performance; when LOW, it disables the PLL and reverts the device to DDR I timing with 1-cycle latency and reduced maximum frequency (≤167 MHz). This allows runtime mode switching without changing clock generation circuitry.

How does the ZQ pin affect output drive strength?

ZQ connects to an external resistor (RQ) tied to ground, enabling on-die calibration of CQ, CQ, and DQ output impedance to 0.2 × RQ. This matches transmission line impedance on the PCB, minimizing reflections and signal integrity issues. If RQ is omitted, connecting ZQ to VDDQ enables minimum output drive strength.

Can CY7C1568XV18-633BZXC operate without the PLL enabled?

Yes - asserting DOFF LOW disables the PLL and places the device in DDR I mode, where timing follows standard DDR I specifications with 1-cycle read latency. In this mode, maximum operating frequency drops to 167 MHz, and echo clock alignment is no longer guaranteed, requiring external timing compensation.

What is the purpose of the QVLD signal in system design?

QVLD is a synchronous output that pulses edge-aligned with CQ/CQ to indicate exactly when DQ[17:0] data is valid. It replaces complex setup/hold margin calculations in FPGA capture logic, allowing designers to latch data on the QVLD-active edge rather than relying on fixed clock-phase relationships - essential for robust operation above 500 MHz.

CY7C1568XV18-633BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
633 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1568XV18-633BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1568XV18-633BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1568XV18-633BZXC reliable?

The price and inventory of CY7C1568XV18-633BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1568XV18-633BZXC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1568XV18-633BZXC transactions.

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CY7C1568XV18-633BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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5.How can I obtain technical support or documentation for CY7C1568XV18-633BZXC?

For technical support, including CY7C1568XV18-633BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1568XV18-633BZXC requirements.

6.How does Aetrix verify that CY7C1568XV18-633BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1568XV18-633BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1568XV18-633BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1568XV18-633BZXC?

All CY7C1568XV18-633BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1568XV18-633BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1568XV18-633BZXC part is unused and in its original packaging.

Return procedure for CY7C1568XV18-633BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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