Cypress Semiconductor Corp CY7C1614KV18-300BZC
- Part No.:
- CY7C1614KV18-300BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1614KV18-300BZC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:104
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1614KV18 from Infineon Technologies (formerly Cypress) is a 4M × 36, 144-Mbit QDR® II synchronous SRAM with two-word burst architecture, 300 MHz clock operation (720 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), DOFF-configurable 1- or 1.5-cycle read latency, and is used in high-bandwidth networking buffers and packet forwarding engines.
For engineers reviewing the CY7C1614KV18 datasheet, CY7C1614KV18 pinout, CY7C1614KV18 application, or CY7C1614KV18 equivalent, key selection criteria include its 36-bit bus width, 165-ball FBGA package, QDR II timing compliance, byte-write select (BWS[3:0]) granularity, and PLL-synchronized data placement for deterministic capture in multi-chip memory subsystems.
Technical Context
The CY7C1614KV18 implements a true dual-port QDR II architecture with physically independent read and write data paths-no bus turnaround required. Its 21-bit address bus accesses a 4M-depth × 36-bit-wide memory array organized as two 2M × 36 sub-arrays, latched on alternating edges of K/K clocks.
All synchronous inputs register on K/K rising edges; outputs register on C/C rising edges. The integrated PLL ensures precise data-eye alignment, while echo clocks (CQ/CQ) enable source-synchronous capture at the controller. DOFF pin selects between 1-cycle (QDR I–compatible) and 1.5-cycle (QDR II–optimized) read latency modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (4M × 36 configuration) |
| Max Clock Frequency | 300 MHz - enables 600 MT/s effective throughput with DDR interfaces |
| Data Rate | 720 Mbps per data line - achieved via double-data-rate transfers on both read and write ports |
| Core Supply Voltage | 1.8 V ± 0.1 V - defines minimum power delivery stability requirement for internal logic |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V HSTL-15/18 systems |
| Read Latency | Configurable: 1 cycle (DOFF = low) or 1.5 cycles (DOFF = high) - determines pipeline depth in controller design |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - requires 0.8 mm ball pitch layout and thermal pad under die |
Pinout & Package
Package: 165-ball fine-pitch BGA (15 mm × 17 mm × 1.4 mm height), RoHS-compliant, with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel data sampled on rising edge of K clock; supports byte-level masking via BWS[3:0] |
| Q[35:0] | Synchronous read data output | 36-bit parallel data driven on rising edges of C/C clocks; tristated when RPS inactive |
| RPS | Read port select (active low) | Enables read access; deassertion initiates automatic tristate after next C-edge - critical for bus sharing |
| WPS | Write port select (active low) | Enables write access; ignored if WPS inactive - prevents unintended writes during address setup |
| BWS[3:0] | Byte write select (active low) | Four independent 9-bit byte enables; allows partial-word writes without read-modify-write overhead |
| K / K | Positive/negative write/read clock inputs | Edge-triggered clocks for address/data latching; K used for write, K for read - enables time-multiplexed address bus |
| C / C | Positive/negative output clock inputs | Deskew pair for read data capture; matched flight time with Q[35:0] signals - reduces timing margin burden |
| CQ / CQ | Echo clocks (output) | Source-synchronous copies of C/C, routed with Q-bus - simplifies controller DQS generation in high-speed PHYs |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II); low = 1-cycle latency (QDR I compatibility) - sets controller pipeline staging |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround delay - enables concurrent read+write in same cycle for full-duplex traffic buffering |
| Two-word burst architecture | Guarantees two sequential 36-bit words per access - matches typical packet header + payload fetch patterns |
| Programmable read latency (DOFF) | Allows runtime switching between deterministic 1-cycle (low-latency control) and 1.5-cycle (higher-frequency margin) modes |
| HSTL Class I/II compatible I/O | Supports 1.5 V or 1.8 V termination - enables drop-in replacement in legacy QDR I systems or new 1.8 V designs |
| JTAG 1149.1 boundary scan | Enables production test and interconnect verification without external probes - critical for dense BGA routing validation |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches before classification and forwarding. IC Role / Device Role / Timing Role: High-throughput, low-latency dual-port buffer providing simultaneous header read and payload write under strict jitter constraints. Use Value: 720 Mbps per data line and 1.5-cycle latency ensure sub-10 ns read-to-read turnaround - meeting 10 Gbps line-rate buffering requirements. |
Use Scenario: Interfacing with crossbar switch controllers to hold cell-based or packet-based flow state across multiple ports. IC Role / Device Role / Timing Role: Deterministic-access shared memory with independent read/write arbitration - enabling non-blocking fabric scheduling. Use Value: Separate RPS/WPS controls and BWS[3:0] allow atomic updates to flow counters and queue pointers without corrupting adjacent fields. |
| Telecom Line Card Memory | Test Equipment Pattern Memory |
|
Use Scenario: Holding protocol-specific frame templates (e.g., SONET/SDH, OTN) and real-time error injection masks in optical transport modules. IC Role / Device Role / Timing Role: Synchronous SRAM acting as programmable pattern store with guaranteed timing closure at 300 MHz. Use Value: Echo clocks (CQ/CQ) and PLL-aligned outputs reduce setup/hold uncertainty to <120 ps - satisfying ±50 ps jitter tolerance in telecom PHYs. |
Use Scenario: Storing high-speed digital stimulus and expected response vectors in ATE systems performing parallel pin testing at >500 MHz. IC Role / Device Role / Timing Role: Deterministic, low-jitter memory interface delivering synchronized 36-bit vectors to multiple DUT pins simultaneously. Use Value: 165-ball FBGA with controlled impedance routing and HSTL drivers maintains signal integrity up to 720 Mbps - enabling >99.9% vector accuracy at 100 ps timing resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1612KV18 | 8M × 18 configuration (same 144 Mbit density, narrower 18-bit bus, 22-bit address) | Preferred where system bus width is 18-bit or depth expansion across multiple devices is required | Select when board layout favors lower pin count or existing 18-bit controller interface exists |
| CY7C1625KV18 | 16M × 9 configuration (same density, 9-bit bus, 23-bit address, no BWS[1:3]) | Used in cost-sensitive, narrow-bus applications such as legacy telecom control planes or FPGA boot memory | Choose when minimizing per-pin I/O count or supporting legacy 9-bit datapath designs is prioritized |
Compared with CY7C1612KV18 and CY7C1625KV18, the CY7C1614KV18 provides optimal bandwidth-per-pin efficiency for 36-bit wide ASIC/FPGA interfaces, avoids external multiplexing logic needed for narrower buses, and supports finer-grained byte masking essential for metadata-aware packet processing.
Availability
CY7C1614KV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom line card memory, and test equipment pattern memory requiring stable component supply across long-lifecycle deployments.
Supply support for CY7C1614KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and manufacturing for the QDR II SRAM portfolio originally developed by Cypress.
This device belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in networking, telecommunications, and test instrumentation where dual-port concurrency and sub-10 ns latency are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1614KV18?
The DOFF (Data Out Fall-off) pin configures read latency mode: when asserted high, it enables 1.5-cycle latency for QDR II operation, optimizing timing margin at high frequencies; when low, it reverts to 1-cycle latency for QDR I compatibility. This setting directly affects controller pipeline staging and must be held stable during initialization.
How does the CY7C1614KV18 handle byte-level writes?
It uses four active-low byte write select signals (BWS[3:0]), each controlling a distinct 9-bit segment of the 36-bit D[35:0] bus. When a BWS signal is deasserted, the corresponding byte remains unaltered during the write cycle - enabling partial-word updates without read-modify-write sequences or external logic.
Can CY7C1614KV18 operate with only a single clock domain?
Yes - it supports single-clock mode where K and C are tied together (and K and C likewise), simplifying clock tree design. In this mode, all data transfers synchronize to the K clock edges, though deskew benefits from C/C and echo clocks are forfeited, reducing maximum reliable frequency to ~250 MHz.
What is the role of the CQ and CQ pins?
CQ and CQ are echo clocks - buffered, source-synchronous copies of C and C outputs, routed alongside Q[35:0]. They provide the controller with precise timing references for capturing read data, eliminating need for complex DQS generation and relaxing PCB trace length matching requirements across the 36-bit bus.
CY7C1614KV18-300BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 144Mbit
- Memory Organization:
- 4M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1614KV18-300BZC FAQ
1.How can I place an order for CY7C1614KV18-300BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1614KV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1614KV18-300BZC reliable?
The price and inventory of CY7C1614KV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1614KV18-300BZC is usually 5 days.
3.What payment methods are accepted for CY7C1614KV18-300BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1614KV18-300BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1614KV18-300BZC?
CY7C1614KV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1614KV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1614KV18-300BZC?
For technical support, including CY7C1614KV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1614KV18-300BZC requirements.
6.How does Aetrix verify that CY7C1614KV18-300BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1614KV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1614KV18-300BZC meets industry standards.
7.What is the process for return or replacement of CY7C1614KV18-300BZC?
All CY7C1614KV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1614KV18-300BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1614KV18-300BZC part is unused and in its original packaging.
Return procedure for CY7C1614KV18-300BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1614KV18-300BZC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

