Cypress Semiconductor Corp CY7C1615KV18-250BZXC
- Part No.:
- CY7C1615KV18-250BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1615KV18-250BZXC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1615KV18-250BZXC from Cypress Semiconductor is a 4 M × 36, 144-Mbit QDR® II SRAM with separate read/write ports, 250 MHz operation (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers quad-data-rate burst transfers (four 36-bit words per access) with 1.5-cycle read latency when DOFF = high, and supports concurrent read/write transactions in high-bandwidth networking buffers.
For engineers reviewing the CY7C1615KV18-250BZXC datasheet, CY7C1615KV18-250BZXC pinout, CY7C1615KV18-250BZXC application, or CY7C1615KV18-250BZXC equivalent, key selection criteria include its 165-ball FBGA package, echo-clock–assisted DDR timing (C/C, CQ/CQ), JTAG 1149.1 test support, and depth expansion via RPS/WPS port selects.
Technical Context
The CY7C1615KV18 implements true dual-port QDR II architecture: independent read and write data paths eliminate bus turnaround, enabling simultaneous 36-bit reads and writes on every K/K rising edge. Its internal 4 × 1 M × 36 array organization uses multiplexed 20-bit address bus latched on alternating K edges.
Timing is governed by four synchronized clocks: K/K for input capture and write control, C/C for output data strobing, and CQ/CQ echo clocks aligned to C/C for receiver deskew. A built-in PLL ensures precise data placement, while DOFF pin configures read latency between 1-cycle (QDR I mode) and 1.5-cycle (QDR II mode).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (4 M × 36 configuration) |
| Max Clock Frequency | 250 MHz - sets maximum sustained bandwidth of 3.6 Gbps (36 bits × 250 MHz × 4-word burst) |
| Read Latency | 1.5 cycles (DOFF = high) or 1 cycle (DOFF = low) - directly impacts pipeline depth and controller wait-state design |
| Core Supply Voltage | 1.8 V ±0.1 V - defines power rail tolerance and decoupling requirements |
| I/O Supply Range | 1.4 V to 1.8 V - enables interoperability with both 1.5 V and 1.8 V HSTL-15/18 systems |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - specifies board layout footprint and thermal pad constraints |
| Output Drive | HSTL Class I - determines termination scheme (parallel 50 Ω to VDDQ) and signal integrity modeling |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; 36-bit parallel path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; full-width output for burst reads |
| RPS / WPS | Active-low port select controls | Enable/disable read or write port independently for depth expansion |
| BWS[3:0] | Byte write select inputs | Mask individual 9-bit bytes during write; BWS0–BWS3 cover D[35:0] in 9-bit groups |
| K / K, C / C | Differential clock inputs | K/K drive inputs and self-timed writes; C/C clock outputs and echo-clock generation |
| CQ / CQ | Free-running echo clocks | Phase-aligned to C/C; used by controller to sample Q[35:0] with minimized flight-time skew |
| ZQ | Impedance calibration reference | Connect to external resistor to ground to tune Q/CQ output impedance to 0.2 × RQ |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II); low = 1-cycle latency (QDR I compatibility) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround overhead and prevents data contention in full-duplex memory interfaces |
| Four-word burst architecture | Reduces effective address bus frequency by 4× versus single-word access, easing routing and timing closure |
| DDR interfaces on both ports | Enables 500 Mbps per pin at 250 MHz clock (K/K and C/C), doubling data rate without increasing clock frequency |
| Echo clocks (CQ/CQ) | Provide deterministic, board-level deskew reference for source-synchronous read capture at >400 Mbps |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant structural testing and interconnect verification in dense PCB assemblies |
| Programmable output impedance (ZQ) | Allows dynamic tuning of Q/CQ driver strength to match trace impedance, reducing reflections and jitter |
Applications
| Packet Buffer in 10G Ethernet Switch ASIC | Line Card Memory in Telecom Baseband Processing |
|---|---|
|
Use Scenario: Stores ingress/egress packet headers and metadata in real time within a multi-gigabit switch fabric. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, concurrent-access buffer between ingress parser and egress scheduler logic. Use Value: 36-bit width matches typical header+payload alignment; 1.5-cycle latency enables tight pipeline synchronization with 250 MHz ASIC clock domain. |
Use Scenario: Buffers IQ samples between ADC/DAC interfaces and FPGA-based channelizers in LTE/5G radio units. IC Role / Device Role / Timing Role: High-throughput memory co-processor providing burst-aligned sample storage with deterministic read timing. Use Value: Echo clocks (CQ/CQ) allow FPGA IDELAY/ODELAY blocks to lock precisely to data valid window, achieving <10 ps setup/hold margin at 400 Mbps. |
| Depth-Expanded Memory Subsystem | Protocol-Agnostic Interposer Buffer |
|
Use Scenario: Multiple CY7C1615KV18 devices stacked using RPS/WPS to form wider or deeper memory banks in network processors. IC Role / Device Role / Timing Role: Independent port-select–controlled memory slice supporting asynchronous read/write addressing across devices. Use Value: Port-select pins enable seamless 72-bit or 144-bit word expansion without external glue logic or address demuxing. |
Use Scenario: Bridges mismatched data widths and timing domains between legacy ASICs and modern SerDes controllers. IC Role / Device Role / Timing Role: Protocol-transparent, synchronous FIFO-like buffer with configurable latency and burst alignment. Use Value: DOFF pin allows runtime switching between 1-cycle (legacy interface sync) and 1.5-cycle (high-efficiency mode) latency to adapt to host controller constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | 36-bit, 144-Mbit, 100 MHz max - lower speed, different pinout, no echo clocks | Targeted at cost-sensitive industrial control where bandwidth < 1.8 Gbps suffices | Select when system clock ≤100 MHz and echo-clock–based deskew is unnecessary |
| ISSI IS61WV102436BLL-150BLI | 36-bit, 144-Mbit, 150 MHz max, LVDS I/O - no QDR II burst, no DOFF latency control | Used in embedded vision pipelines requiring low-power LVDS signaling over longer traces | Choose only if LVDS differential I/O and simpler single-cycle latency are mandatory |
Compared with IDT72T36150L10BG and IS61WV102436BLL-150BLI, CY7C1615KV18-250BZXC uniquely delivers 250 MHz QDR II operation with echo-clock timing support and programmable 1/1.5-cycle latency-critical for 10G+ packet buffering where bandwidth and deterministic capture timing are non-negotiable.
Availability
CY7C1615KV18-250BZXC is available at Aetrix Electronics and suitable for 10G Ethernet switch buffers, telecom baseband line cards, depth-expanded memory subsystems, and protocol-agnostic interposer buffers requiring stable component supply and long-lifecycle support.
Supply support for CY7C1615KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.
CY7C1615KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for high-speed packet processing and baseband data buffering where concurrent read/write bandwidth and deterministic latency are essential.
FAQ
What is the function of the DOFF pin on CY7C1615KV18-250BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when tied high, it enables 1.5-cycle latency for optimized QDR II performance; when tied low or to VSS, it reverts to 1-cycle latency compatible with QDR I timing. This pin does not affect write timing or burst length-it solely adjusts the read data launch point relative to C/C edges.
Can CY7C1615KV18-250BZXC operate with only a single clock domain?
Yes. When K is used as both input and output clock (i.e., C = K, C = K), the device operates in single-clock mode. In this configuration, Q[35:0] data is driven on K/K rising edges, and CQ/CQ echo clocks are generated relative to K/K. All timing parameters shift accordingly, and read latency remains configurable via DOFF.
How is output impedance calibrated using the ZQ pin?
ZQ must be connected to a precision resistor (RQ) tied to ground; the device measures RQ and scales all Q[35:0] and CQ/CQ output drivers to 0.2 × RQ. Typical RQ = 240 Ω yields 48 Ω nominal output impedance. Connecting ZQ directly to VDDQ forces minimum impedance (~30 Ω); floating or grounding ZQ is prohibited and may cause undefined behavior.
Does CY7C1615KV18-250BZXC support byte-write masking across the full 36-bit width?
Yes. Four active-low byte write select inputs (BWS[3:0]) each control a 9-bit segment of D[35:0]: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Any deselected BWS leaves its corresponding 9-bit byte unchanged during the write cycle, enabling partial-word updates without read-modify-write sequences.
CY7C1615KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 144Mbit
- Memory Organization:
- 4M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1615KV18-250BZXC FAQ
1.How can I place an order for CY7C1615KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1615KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1615KV18-250BZXC reliable?
The price and inventory of CY7C1615KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1615KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1615KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1615KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1615KV18-250BZXC?
CY7C1615KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1615KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1615KV18-250BZXC?
For technical support, including CY7C1615KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1615KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1615KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1615KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1615KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1615KV18-250BZXC?
All CY7C1615KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1615KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1615KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1615KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1615KV18-250BZXC Tags

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