Cypress Semiconductor Corp CY7C1623KV18-333BZXC

Overview

CY7C1623KV18-333BZXC from Infineon Technologies (formerly Cypress) is a 144-Mbit (8 M × 18) DDR-II Synchronous Pipelined SRAM with Separate I/O architecture, operating at 333 MHz clock frequency and delivering 666 MHz effective data rate. It features dual input clocks (K/K), echo clocks (CQ/CQ), programmable impedance via ZQ, and supports both DDR-I (1-cycle read latency, DOFF = LOW) and DDR-II (1.5-cycle read latency, DOFF = HIGH) modes. Used in high-bandwidth networking line cards and packet buffering subsystems requiring deterministic low-latency memory access.

For engineers reviewing the CY7C1623KV18-333BZXC datasheet, CY7C1623KV18-333BZXC pinout, CY7C1623KV18-333BZXC application, or CY7C1623KV18-333BZXC equivalent, key selection criteria include DDR-II SIO timing compliance, HSTL-18 I/O compatibility, 165-ball FBGA mechanical fit, PLL-enabled data placement accuracy, and burst-2 address-to-data timing alignment across multi-device stacks.

Technical Context

The device implements a two-port DDR-II SIO architecture: dedicated read port (Q[17:0], C/C, CQ/CQ) and write port (D[17:0], K/K), eliminating bus turnaround overhead. All synchronous inputs are registered on rising edges of K/K, while outputs are edge-aligned to C/C (or K/K in single-clock mode), enabling precise skew management in parallel memory systems.

Its internal PLL synchronizes output data placement to echo clocks, supporting stable 333 MHz operation with 1.5-cycle read latency when DOFF = HIGH. The ZQ pin enables dynamic output impedance calibration against system trace impedance (via external RQ resistor), ensuring signal integrity for 666 MHz DDR data transfers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm body, 1.4 mm height, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SIO SRAM applications.

Compared with AS7C3256A-15JCIN and IS61WV102418BLL-10TLI, the CY7C1623KV18-333BZXC delivers 5.6× higher bandwidth via DDR-II and eliminates board-level timing tuning through integrated PLL and echo clocks-critical for scalable multi-SRAM systems.

Availability

CY7C1623KV18-333BZXC is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed test equipment, and radar signal processing applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1623KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and memory solutions.

The CY7C1623KV18 belongs to Infineon's legacy Cypress DDR-II SIO SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in telecom and instrumentation systems where deterministic timing and signal integrity are non-negotiable.

FAQ

What is the function of the DOFF pin?

The DOFF pin is an active-LOW PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR-I mode with 1-cycle read latency and maximum 167 MHz operation. For full DDR-II performance at 333 MHz, DOFF must be held HIGH via a ≤10 kΩ pull-up to VDDQ.

Can CY7C1623KV18-333BZXC operate without external echo clocks (CQ/CQ)?

Yes. The device supports single-clock mode using only K/K for both input and output timing. In this mode, Q[17:0] is driven on rising edges of K/K, and CQ/CQ are not required-but system-level timing margin and skew control degrade significantly compared to echo-clock–assisted operation.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external resistor (RQ) tied to ground, enabling on-die calibration of Q[17:0] and CQ/CQ output driver impedance to 0.2 × RQ. This matches PCB trace impedance (typically 50 Ω), minimizing reflections and improving eye diagram opening at 666 MHz DDR data rates.

Is JTAG boundary scan supported in all operating modes?

Yes. IEEE 1149.1 JTAG functionality remains fully operational regardless of DOFF state or clock configuration. TAP signals (TCK, TMS, TDI, TDO) are asynchronous and independent of K/K or C/C domains, enabling reliable interconnect testing during power-up, functional operation, or PLL-disabled mode.