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Cypress Semiconductor Corp CY7C1668KV18-450BZXC

Part No.:
CY7C1668KV18-450BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1668KV18-450BZXC.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:125

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Product details

Overview

CY7C1668KV18 from Cypress Semiconductor is a 144-Mbit (8 M × 18) DDR II+ synchronous SRAM with two-word burst architecture, 2.5-cycle read latency, and 550-MHz clock operation. It features dual echo clocks (CQ/CQ), QVLD data-valid indicator, and PLL-based timing alignment for high-speed memory subsystems in networking and telecom line cards.

For engineers reviewing the CY7C1668KV18 datasheet, CY7C1668KV18 pinout, CY7C1668KV18 application, or CY7C1668KV18 equivalent, key selection criteria include DDR II+ burst timing compliance, HSTL-18 I/O compatibility, 165-ball FBGA mechanical fit, and DOFF-pin configurable latency mode (2.5-cycle vs. 1-cycle).

Technical Context

This SRAM implements a pipelined, synchronous architecture where address and control signals are latched on rising edges of K clock, while write data is registered on both K and K edges. Read data is driven synchronously on both K and K edges, enabling true double-data-rate transfers at up to 1100 MT/s.

The device integrates an internal PLL for precise data placement relative to echo clocks CQ/CQ, supports programmable output impedance via ZQ pin, and provides byte-write select (BWS0/BWS1) for granular 9-bit write control. DOFF pin toggles between DDR II+ (2.5-cycle latency, 550 MHz) and DDR I (1-cycle latency, ≤167 MHz) modes.

Key Specifications

Parameter Value and Actual Design Meaning
Density 144 Mbit (8 M × 18 organization)
Max Clock Frequency 550 MHz - enables 1100 MT/s DDR data rate
Read Latency 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline scheduling
I/O Voltage VDDQ = 1.4 V to 1.8 V - supports HSTL-18 and mixed-voltage system interfacing
Core Voltage VDD = 1.8 V ± 0.1 V - low-power 1.8-V SRAM core with stable timing margin
Package 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-density PCB layout
Interface Standard DDR II+ - superset of JEDEC QDR-II, with echo clocks and QVLD for simplified capture

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant, Pb-free.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Transfers 18-bit words on both K and K rising edges; tri-stated automatically after deselect
K / K Differential input clocks Rising edges latch all synchronous inputs and drive outputs; define DDR timing reference
CQ / CQ Output echo clocks Free-running, phase-aligned copies of K/K for source-synchronous data capture
QVLD Data validity indicator Asserted edge-aligned with CQ/CQ to signal valid DQ[17:0] during read bursts
DOFF PLL enable/disable control LOW disables PLL → DDR I mode (1-cycle latency); HIGH enables DDR II+ mode (2.5-cycle latency)
ZQ Output impedance calibration input Connects to external resistor to ground to tune DQ/CQ output drive strength to 0.2 × RQ
BWS0 / BWS1 Byte write select (active-low) BWS0 controls DQ[8:0]; BWS1 controls DQ[17:9] - enables partial-word writes without read-modify-write
LD Load strobe Sampled on K rising edge to initiate address/control capture for next burst transaction

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus switching frequency by 50% versus single-word access - lowers EMI and routing congestion
Integrated PLL with echo clocks Eliminates need for external delay-locked loops or board-level trace length matching for data capture
Programmable output impedance (ZQ) Enables dynamic impedance tuning to match PCB trace characteristics - improves signal integrity at 1100 MT/s
Configurable latency mode (DOFF) Single-pin hardware switch between high-performance DDR II+ (550 MHz) and legacy DDR I (167 MHz) timing
HSTL-18 compatible I/O Ensures interoperability with FPGA/ASIC memory controllers using JEDEC HSTL Class I specifications

Applications

High-Speed Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switches.

IC Role / Device Role / Timing Role: Burst-access SRAM buffer providing deterministic 2.5-cycle read latency for ingress/egress queue management.

Use Value: Two-word burst reduces address bus toggling by half, lowering power and routing complexity in dense switch fabric designs.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface units.

IC Role / Device Role / Timing Role: Synchronous DDR II+ memory supporting 550-MHz clock domain for real-time cell/frame assembly/disassembly.

Use Value: Echo clocks CQ/CQ and QVLD eliminate setup/hold uncertainty - critical for error-free 10 Gbps+ data path timing.

FPGA-Based Protocol Acceleration Network Processor Co-Processor Memory

Use Scenario: Offloading packet classification, deep packet inspection, or encryption tasks in FPGA-accelerated NICs.

IC Role / Device Role / Timing Role: High-bandwidth local memory tightly coupled to FPGA logic fabric via HSTL-18 interface.

Use Value: 1100 MT/s effective bandwidth sustains parallel lookup engines without stalling on memory bottlenecks.

Use Scenario: Shared instruction/data memory for multi-threaded network processors handling L2–L4 processing.

IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM serving as scratchpad or cache tag store with deterministic 2.5-cycle access.

Use Value: DOFF pin allows runtime reconfiguration to DDR I mode during debug or low-power states - simplifies test and power management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1668AV18-450BZXC Same 8 M × 18 density and FBGA package, but rated for 450 MHz max clock (vs. 550 MHz); uses older DDR II architecture without DOFF-configurable latency Limited to fixed 2-cycle latency; no DDR I fallback mode; lower bandwidth ceiling Select when system clock < 450 MHz and DDR II+ features (echo clocks, QVLD) are not required
AS7C3256A-15JIN Asynchronous 256-K × 16 SRAM in 44-pin SOJ; no DDR, no burst, no PLL; 15 ns access time Supports simple glueless microcontroller interfaces only; no high-speed memory controller compatibility Select only for legacy low-speed control-plane buffers where timing predictability outweighs bandwidth needs

Compared with CY7C1668AV18-450BZXC, the CY7C1668KV18 delivers +22% bandwidth and flexible latency mode; versus AS7C3256A-15JIN, it enables full DDR II+ system integration but requires clock tree and echo clock routing discipline.

Availability

CY7C1668KV18 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, FPGA-based protocol acceleration, and network processor co-processor memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1668KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C1668KV18 belongs to Cypress's QDR II+/DDR II+ SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory subsystems in networking infrastructure and high-end test equipment.

FAQ

What is the function of the DOFF pin on CY7C1668KV18?

The DOFF pin is an active-low PLL disable input. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and maximum 167-MHz operation. When HIGH, the PLL is enabled, supporting DDR II+ mode with 2.5-cycle latency and up to 550-MHz clock frequency. This pin must be pulled up via ≤10 kΩ resistor for normal DDR II+ operation.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of DQ, CQ, and CQ pins to 0.2 × RQ (≈48 Ω). This dynamic impedance matching minimizes reflections and ensures consistent signal rise/fall times across process/voltage/temperature variations, directly improving eye diagram margins at 1100 MT/s.

Can CY7C1668KV18 operate without using the echo clocks CQ/CQ?

No - CQ and CQ are mandatory for reliable data capture. The device drives read data edge-aligned with these echo clocks, and QVLD is synchronized to them. Omitting CQ/CQ routing prevents valid data recovery because the SRAM does not provide center-aligned or static timing windows; all read data timing is referenced solely to CQ/CQ edges.

What is the role of BWS0 and BWS1 in byte-write operations?

BWS0 and BWS1 are active-low byte write select inputs that control which 9-bit segment of DQ[17:0] is written during a burst. BWS0 governs DQ[8:0], and BWS1 governs DQ[17:9]. When either is HIGH, the corresponding byte remains unaltered - enabling true partial-word writes without requiring read-modify-write cycles or external masking logic.

CY7C1668KV18-450BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
144Mbit
Memory Organization:
8M x 18
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1668KV18-450BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1668KV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1668KV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1668KV18-450BZXC is usually 5 days.

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5.How can I obtain technical support or documentation for CY7C1668KV18-450BZXC?

For technical support, including CY7C1668KV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1668KV18-450BZXC requirements.

6.How does Aetrix verify that CY7C1668KV18-450BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1668KV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1668KV18-450BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1668KV18-450BZXC?

All CY7C1668KV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1668KV18-450BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1668KV18-450BZXC part is unused and in its original packaging.

Return procedure for CY7C1668KV18-450BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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