Cypress Semiconductor Corp CY7C1670KV18-450BZXC

Overview

CY7C1670KV18-450BZXC from Cypress Semiconductor is a 144-Mbit (4 M × 36) synchronous DDR II+ SRAM with 2.5-cycle read latency, 450 MHz clock operation, HSTL I/O interface, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers 1100 MT/s effective data rate via double-data-rate transfers synchronized to K/K clocks, features echo clocks (CQ/CQ) and QVLD for precise high-speed data capture, and is used in network packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C1670KV18-450BZXC datasheet, CY7C1670KV18-450BZXC pinout, CY7C1670KV18-450BZXC application, or CY7C1670KV18-450BZXC equivalent, this page provides verified timing behavior under DOFF-controlled PLL modes, burst-2 data flow alignment, byte-write select mapping for 36-bit DQ bus, and FBGA ball assignment validation per Document 001-44062 Rev. *K.

Technical Context

The device implements a pipelined synchronous architecture where address and control signals (LD, R/W, BWS[3:0]) are registered on the rising edge of K, while write data is latched on both K and K edges. Read data is driven synchronously on both K and K edges with 2.5-cycle latency when DOFF = HIGH, enabling deterministic placement relative to echo clocks CQ/CQ.

Its DDR II+ core integrates a PLL for accurate internal timing generation, supports VDD = 1.8 V ± 0.1 V and VDDQ = 1.4–1.8 V, uses ZQ calibration for output impedance matching (0.2 × RQ), and maintains strict setup/hold timing for all synchronous inputs referenced to K/K edges - critical for multi-device depth-expanded memory systems.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with CY7C1668KV18-450BZXC, this part offers native 36-bit width and identical timing, reducing component count in wide-data systems; versus AS7C362000B-450BIN, it provides superior timing predictability via PLL-based DDR II+ and built-in impedance tuning - critical for signal integrity at 1100 MT/s.

Availability

CY7C1670KV18-450BZXC is available at Aetrix Electronics and suitable for network infrastructure, FPGA-accelerated computing, and high-speed test equipment requiring stable component supply, long-term lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1670KV18-450BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

This device belongs to the QDR II+/DDR II+ SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in networking, telecom, and FPGA-based systems where deterministic timing and signal integrity are non-negotiable.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin is an active-low PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL enables DDR II+ mode with 2.5-cycle latency and full 450 MHz capability. This dual-mode capability allows hardware-level performance scaling without firmware changes.

How does the ZQ pin calibrate output impedance, and what resistor value is required?

ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and sets its DQ, CQ, and CQ output drivers to 0.2 × RQ. For standard 50 Ω trace impedance, a 250 Ω resistor is used. Alternatively, connecting ZQ directly to VDDQ enables minimum impedance mode (≈20 Ω), but it must never be left floating or tied to GND.

Can CY7C1670KV18-450BZXC be used in depth-expanded configurations, and how is bus contention avoided?

Yes - the device supports seamless depth expansion. On read deselection, internal logic automatically tri-states DQ[35:0] on the next rising edge of K, eliminating bus contention. No external OE control or wait states are needed, enabling clean stacking of multiple devices for wider data buses without added logic complexity.

What is the role of QVLD, and why is it preferred over relying solely on CQ/CQ edges?

QVLD is a dedicated, edge-aligned valid-data indicator that asserts precisely when DQ[35:0] contains stable, correct read data. Unlike CQ/CQ - which are free-running echo clocks - QVLD accounts for internal propagation delays and guarantees validity across process/voltage/temperature corners, making it more reliable than clock-edge-based capture for timing-critical FPGA implementations.