Cypress Semiconductor Corp CY7C1911KV18-300BZXC
- Part No.:
- CY7C1911KV18-300BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1911KV18-300BZXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1911KV18-300BZXC from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 2M × 9 organization, 300 MHz maximum operating frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements separate read/write ports, four-word burst architecture, and DDR interfaces on both ports for concurrent high-bandwidth memory access in network packet buffers and switch fabric controllers.
For engineers reviewing the CY7C1911KV18-300BZXC datasheet, CY7C1911KV18-300BZXC pinout, CY7C1911KV18-300BZXC application, or CY7C1911KV18-300BZXC equivalent, key selection criteria include its 300 MHz clock rating, DOFF-configurable 1-cycle/1.5-cycle read latency, echo clock (CQ/CQ) support for timing margin recovery, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.
Technical Context
The device uses synchronous pipelined QDR II architecture with independent read and write data paths, eliminating bus turnaround overhead. Address latching occurs on alternate rising edges of K/K clocks, enabling full concurrency between read and write transactions without arbitration delay.
It integrates a PLL for precise data placement, HSTL-compatible variable-drive output buffers, and IEEE 1149.1 JTAG test access port. Read latency is configurable via DOFF pin: LOW yields 1-cycle latency (QDR I mode), HIGH yields 1.5-cycle latency (native QDR II mode) with guaranteed data coherency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (2,097,152 × 9 bits) - supports 2M-word depth with 9-bit wide data path for byte-aligned packet header storage. |
| Max Clock Frequency | 300 MHz - enables 600 MT/s effective throughput per port with DDR interface, delivering 1.08 GB/s aggregate bandwidth. |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines minimum read-to-read interval and pipeline depth in controller design. |
| Core Supply Voltage | 1.8 V ±0.1 V - requires tight regulation; decoupling must meet 100 mV peak-to-peak noise limit per Cypress AC specs. |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V logic families without level shifters. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - 0.8 mm ball pitch; requires controlled-impedance routing and thermal vias under die for signal integrity. |
| Burst Length | Four-word burst - reduces address bus toggling by 75% versus single-word access, lowering system-level EMI and routing complexity. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data input | 9-bit parallel data sampled on rising edge of K clock; all bits written simultaneously during active WPS cycle. |
| Q[8:0] | Synchronous read data output | 9-bit parallel data driven on rising edge of C clock; valid only when RPS is asserted and address matches. |
| WPS | Write port select | Active-low control; enables write transaction and gates D[8:0] into memory array when asserted on K clock edge. |
| RPS | Read port select | Active-low control; enables read transaction and drives Q[8:0] from addressed location on C clock edge. |
| BWS0 | Byte write select | Active-low; selects entire 9-bit word for write (CY7C1911KV18 uses single BWS0 for full-width writes). |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II mode); Low = 1-cycle latency (QDR I compatibility mode). |
| CQ / CQ | Echo clocks | Source-synchronous output clocks paired with Q[8:0]; simplify capture timing at receiver by tracking data flight time skew. |
| K / K | Input clocks | Differential pair driving write/read address and control; only rising edges used for sampling - eliminates duty-cycle dependency. |
| C / C | Output clocks | Differential pair controlling Q[8:0] output timing; aligned with data edges to minimize setup/hold margin loss. |
| VDDQ | I/O power supply | 1.4–1.8 V supply for D[8:0], Q[8:0], and control pins; must be independently decoupled from VDD core rail. |
| VDD | Core power supply | 1.8 V ±0.1 V supply for internal logic and memory array; requires low-noise regulation and ≥10 µF bulk capacitance. |
| VREF | Reference voltage | 0.5 × VDDQ reference for HSTL input receivers; must be stable within ±1% to ensure reliable WPS/RPS sampling. |
| ZQ | Impedance calibration | Connects to 240 Ω external resistor to ground; calibrates output driver strength for consistent HSTL termination. |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent read and write operations without arbitration delay - critical for full-duplex packet buffering in switches. |
| Four-word burst architecture | Reduces address bus transitions by 75%, lowering PCB routing count and system-level EMI in high-density switch fabric designs. |
| Echo clocks (CQ/CQ) | Eliminates board-level clock-data skew uncertainty; allows receiver to latch Q[8:0] using locally tracked timing rather than global clock tree. |
| Configurable read latency (DOFF) | Supports migration from legacy QDR I systems (1-cycle) while enabling higher throughput QDR II mode (1.5-cycle) in new designs. |
| HSTL Class I compatible I/O | Meets JEDEC JESD8-6 specifications with programmable drive strength - ensures signal integrity at 600 MT/s on FR4 backplanes. |
Applications
| Network Packet Buffer | Switch Fabric Controller |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 Ethernet switches before classification and forwarding decisions. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer accessed concurrently by ingress and egress pipelines. Use Value: 300 MHz DDR interface delivers 1.08 GB/s aggregate bandwidth - sufficient for 10 Gbps line-rate packet buffering with <100 ns read-to-write turnaround. |
Use Scenario: Acting as lookup table memory for TCAM-assisted forwarding engines in modular chassis switches. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing deterministic 1-cycle or 1.5-cycle read latency for real-time forwarding table queries. Use Value: DOFF pin enables latency tuning to match pipeline stage alignment - minimizing idle cycles in multi-stage forwarding architectures. |
| Telecom Line Card | High-Speed Test Equipment |
|
Use Scenario: Buffering ATM or OTN frame payloads in SONET/SDH add-drop multiplexers requiring strict jitter tolerance. IC Role / Device Role / Timing Role: QDR II SRAM interfacing with SerDes PHYs via echo-clocked data paths to maintain BER <1e-12 under temperature variation. Use Value: CQ/CQ echo clocks track PVT-induced skew - enabling reliable 600 MT/s operation across -40°C to +85°C industrial temperature range. |
Use Scenario: Capturing high-speed digital stimulus/response waveforms in ATE systems with >500 MHz sampling clocks. IC Role / Device Role / Timing Role: Dual-port memory serving as deep acquisition buffer synchronized to pattern generator and digitizer clocks. Use Value: Independent RPS/WPS controls allow simultaneous waveform capture (write) and analysis-trigger fetch (read) without contention or FIFO overflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 18-Mbit (2M × 9), 250 MHz max, 1.8 V core, but uses SSTL-2 I/O (not HSTL) and lacks echo clocks. | Requires external clock forwarding circuitry for timing margin; less suitable for >20 cm trace lengths without retiming. | Select when cost sensitivity outweighs timing margin requirements and board layout allows tighter clock routing. |
| ISSI IS61WV102418B | 18-Mbit (1M × 18), 200 MHz max, 3.3 V tolerant I/O, asynchronous interface - no DDR, no echo clocks, no DOFF latency control. | Cannot support concurrent read/write at line rate; limited to burst-mode or FIFO-based buffering with higher latency. | Choose only for legacy 3.3 V systems where QDR II features are unnecessary and bandwidth demand ≤ 360 MB/s. |
Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1911KV18-300BZXC uniquely delivers 300 MHz DDR bandwidth with source-synchronous echo clocks and configurable latency - making it the only option capable of sustaining 10 Gbps packet buffering with sub-100 ns turnaround in compact switch ASIC interfaces.
Availability
CY7C1911KV18-300BZXC is available at Aetrix Electronics and suitable for network packet buffers, switch fabric controllers, telecom line cards, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1911KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1911KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for ultra-low-latency, concurrent-access memory subsystems in networking and telecommunications infrastructure where deterministic timing and burst efficiency are critical.
FAQ
What is the function of the DOFF pin on CY7C1911KV18-300BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables native QDR II operation with 1.5-cycle read latency and guaranteed data coherency; when LOW, it reverts to QDR I compatibility mode with 1-cycle latency. This pin is sampled synchronously on the K clock edge at power-up and remains latched until reset.
Can CY7C1911KV18-300BZXC operate with only a single clock domain?
Yes - the device supports single-clock-domain operation by tying K to C and K to C, though this sacrifices the skew-mitigation benefit of separate output clocks. In this mode, all inputs and outputs are referenced to the same K clock, and echo clocks (CQ/CQ) remain functional for data capture timing recovery at the receiver.
What is the purpose of the ZQ pin and how must it be connected?
ZQ is the impedance calibration reference pin. It must be connected to a precision 240 Ω resistor tied to ground to enable on-die termination calibration of HSTL output drivers. Without this connection, output drive strength varies with process/voltage/temperature, risking signal integrity violations at 600 MT/s operation.
Does CY7C1911KV18-300BZXC support byte-level write masking?
No - unlike the ×8 and ×18 variants, CY7C1911KV18 (2M × 9) uses a single BWS0 pin to enable or disable the entire 9-bit word. It does not support partial-word writes; all nine bits are written or none are. Nibble write select (NWS) is not implemented in this configuration.
CY7C1911KV18-300BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 2M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1911KV18-300BZXC FAQ
1.How can I place an order for CY7C1911KV18-300BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1911KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1911KV18-300BZXC reliable?
The price and inventory of CY7C1911KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1911KV18-300BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1911KV18-300BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1911KV18-300BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1911KV18-300BZXC?
CY7C1911KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1911KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1911KV18-300BZXC?
For technical support, including CY7C1911KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1911KV18-300BZXC requirements.
6.How does Aetrix verify that CY7C1911KV18-300BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1911KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1911KV18-300BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1911KV18-300BZXC?
All CY7C1911KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1911KV18-300BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1911KV18-300BZXC part is unused and in its original packaging.
Return procedure for CY7C1911KV18-300BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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