Cypress Semiconductor Corp CY7C2263XV18-633BZXC

Overview

CY7C2263XV18-633BZXC from Infineon Technologies (formerly Cypress) is a 36-Mbit QDR® II+ Xtreme SRAM with 2 M × 18 organization, 633 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT). It implements separate read/write ports with DDR interfaces, four-word burst architecture, and HSTL I/O for high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C2263XV18-633BZXC datasheet, CY7C2263XV18-633BZXC pinout, CY7C2263XV18-633BZXC application, or CY7C2263XV18-633BZXC equivalent, key selection criteria include its 1266 MT/s data rate, dual-clock timing control (K/K), echo clocks (CQ/CQ), QVLD strobe, and 165-ball FBGA package compatibility with high-speed memory subsystems.

Technical Context

This SRAM uses synchronous pipelined architecture with independent read and write ports, enabling concurrent transactions without bus turnaround. Its four-word burst transfers 72 bits per access (18-bit × 4), latched on alternating rising edges of K and K clocks to sustain full bandwidth at 633 MHz.

The device integrates a PLL for precise data placement, supports 1.8 V core supply (±0.1 V) and 1.5 V I/O (1.4–1.6 V), and implements ODT on D[17:0], BWS[1:0], and K/K inputs using external ZQ resistor calibration. DOFF pin selects between 2.5-cycle (HIGH) and 1-cycle (LOW) read latency modes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant Pb-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with IDT72T36120L10BG and AS7C33618B-10BIN, CY7C2263XV18-633BZXC delivers higher bandwidth (633 MHz vs. ≤550 MHz), configurable latency via DOFF, and calibrated ODT-reducing board-level design risk in next-gen networking hardware.

Availability

CY7C2263XV18-633BZXC is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom line card memory, ATE pattern storage, and low-latency financial trading engines requiring stable component supply across multi-year production cycles.

Supply support for CY7C2263XV18-633BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the QDR® II+ Xtreme SRAM portfolio.

This device belongs to Infineon's high-performance synchronous SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, test, and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C2263XV18-633BZXC?

The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle latency for maximum throughput in QDR II+ Xtreme operation; when LOW, it reverts to 1-cycle latency compatible with legacy QDR I timing. This is a static configuration set at power-up and must remain stable during operation.

How does On-Die Termination (ODT) work on this SRAM?

ODT is enabled via the ODT pin and calibrated using an external precision resistor tied to the ZQ pin. A LOW on ODT selects RQ/3.33 (≈175–350 Ω range); HIGH selects RQ/1.66 (≈175–250 Ω). It applies to D[17:0], BWS[1:0], and K/K inputs, eliminating need for 38 discrete 50 Ω terminators and improving signal integrity at 1266 MT/s.

Can CY7C2263XV18-633BZXC interface directly with Xilinx UltraScale FPGAs?

Yes-its HSTL Class I outputs and inputs meet Xilinx UltraScale DCI specifications. The CQ/CQ echo clocks align with FPGA IDELAYCTRL timing windows, and QVLD provides unambiguous data validity. Reference designs confirm successful 633 MHz operation with Virtex-7 and Kintex-Ultrascale devices using standard XDC constraints.

Is JTAG boundary scan supported, and what is its scope?

Yes, CY7C2263XV18-633BZXC implements IEEE 1149.1 compliant TAP controller with full boundary scan capability across all I/O pins (D[17:0], Q[17:0], K/K, CQ/CQ, RPS/WPS, BWS[1:0], etc.). Scan chain length is 224 bits; instruction set includes SAMPLE/PRELOAD, EXTEST, and IDCODE per datasheet Rev. *F section 11.