Cypress Semiconductor Corp CY7C2264XV18-450BZXC

Overview

CY7C2264XV18 from Infineon Technologies (formerly Cypress) is a 1 M × 36, 36-Mbit QDR® II+ Xtreme SRAM with dual independent DDR ports, 450 MHz clock support, 2.5-cycle read latency, and on-die termination (ODT) for D[35:0], BWS[3:0], and K/K inputs - deployed in high-bandwidth packet buffering for telecom line cards.

For engineers reviewing the CY7C2264XV18 datasheet, CY7C2264XV18 pinout, CY7C2264XV18 application, or CY7C2264XV18 equivalent, key selection criteria include burst depth (2-word), VDDQ range (1.4–1.6 V), HSTL I/O compatibility, FBGA-165 package footprint, and DOFF-configurable latency mode (2.5-cycle vs. 1-cycle).

Technical Context

This SRAM implements QDR-II+ Xtreme architecture with physically separate read and write data paths, enabling true concurrent read/write transactions without bus turnaround. It uses two independent rising-edge-triggered clocks (K and K) to latch address and control signals, and employs echo clocks (CQ/CQ) synchronized to K/K for precise DDR data capture at 900 Mbps per port.

The device integrates a PLL for accurate internal timing alignment, supports synchronous self-timed writes, and provides full data coherency via pipelined access. ODT is programmable via ZQ resistor and ODT pin, supporting 175–350 Ω termination ranges for D[35:0], BWS[3:0], and clock inputs - eliminating external termination resistors in high-speed routing.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with IDT72T36120L10BG and AS7C33618B-15JIN, CY7C2264XV18 delivers higher bandwidth (450 MHz vs. ≤333 MHz), configurable latency (2.5/1-cycle), and integrated ODT - reducing PCB complexity and enabling tighter timing margins in next-gen networking hardware.

Availability

CY7C2264XV18 is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed test equipment, avionics data acquisition, and network switch ASIC interfacing requiring stable component supply and long-term lifecycle support.

Supply support for CY7C2264XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the QDR SRAM portfolio for high-performance memory applications in communications and industrial systems.

CY7C2264XV18 belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, low-latency, concurrent read/write memory access in packet-processing and real-time data acquisition systems.

FAQ

What is the function of the DOFF pin on CY7C2264XV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for optimized throughput in burst-heavy applications; when LOW, it reverts to 1-cycle latency like standard QDR-I devices. This setting is sampled at power-up and remains static during operation - no runtime reconfiguration is supported.

How does On-Die Termination (ODT) work on CY7C2264XV18?

ODT is enabled via the ODT pin and calibrated using an external ZQ resistor (175–350 Ω) connected to the ZQ pin. A LOW on ODT selects RQ/3.33 termination (≈53–105 Ω); HIGH selects RQ/1.66 (≈106–210 Ω). Termination applies to D[35:0], BWS[3:0], and K/K inputs - reducing stub reflections and improving signal integrity at 450 MHz.

Can CY7C2264XV18 be used with a 1.5 V VDDQ supply?

Yes - VDDQ is specified from 1.4 V to 1.6 V, fully covering 1.5 V operation. The device uses HSTL Class I-compatible output drivers and input receivers at this voltage, ensuring interoperability with common FPGA memory controllers (e.g., Xilinx Ultrascale+, Intel Stratix 10) without level-shifting.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, K/K-synchronized output clocks that mirror the input clock timing with minimal skew. They provide a clean, phase-aligned reference for capturing Q[35:0] data in the receiving device - eliminating setup/hold timing uncertainty and simplifying high-speed interface design at 900 MT/s DDR rates.